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Describes the modification of a laboratory flip‐chip bonder to allow bonding of very large chips. The original optical system of the bonder was designed for chip sizes up to 5.0 ¥ 5.0mm2. It was desired to use the system for bonding chips larger than this, up to 23.0 ¥ 23.0mm2. Therefore a modification of the existing system was needed. Several options for purely optical modifications were identified and investigated. It was concluded that all optical solutions considered were not feasible because of either size or cost. Therefore attention was directed to a “mechanical solution”. The system was modified using a guide‐rail to move the microscope along the chip diagonally. It was proven that this works reliably for any size of chip. The overall costs of this solution are relatively low. It can be easily implemented for this type of bonder, which is widely used in laboratory flip‐chip research.