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This study expanded previous studies on the relationship between POP (Perceptions of Organizational Politics) and OC (Organizational Commitment); and it examined the mediating effect of OCM (Organizational Concern Motive) and the moderated mediating effect of PS (Political Skills). Based on the uncertainty management and expectancy theories, the mediating role of OCM was assumed; also, the moderated mediating effect of PS was assumed, because of the effect of the POP on members' motives would vary depending on each individual's ability to respond.

To collect the required data for analyzing the research model of this study, a questionnaire was conducted on employees of South Korean companies and institutions. To verify the hypothesis of this study, the measurement and hypothesized models were analyzed sequentially.

The results of this study indicated that the OCM mediates the relationship between POP and OC. Furthermore, the mediating effect of OCM is moderated by PS. Specifically the negative effect of the POP on the OCM was mitigated in the group with proficient PS.

To mitigate the negative effects of POP, this study suggests that managers should provide fair evaluation and reward based on performance, and consider PS as an important factor in employee selection and education/training.

This study is original in that it presents the mechanisms of both variables in terms of an individual's motive towards the organization. Furthermore, this study is valuable in that it suggests ways to mitigate the negative effects of POP through PS.

The purpose of this paper is to demonstrate industrial Internet of Things (IIoT) solution to improve the equipment condition monitoring with equipment status data and process condition monitoring with plasma optical emission spectroscopy data, simultaneously. The suggested research contributes e-maintenance capability by remote monitoring in real time.

Semiconductor processing equipment consists of more than a thousand of components, and unreliable condition of equipment parts leads to the failure of wafer production. This study presents a web-based remote monitoring system for physical vapor deposition (PVD) systems using programmable logic controller (PLC) and Modbus protocol. A method of obtaining electron temperature and electron density in plasma through optical emission spectroscopy (OES) is proposed to monitor the plasma process. Through this system, parts that affect equipment and processes can be controlled and properly managed. It is certainly beneficial to improve the manufacturing yield by reducing errors from equipment parts.

A web-based remote monitoring system provides much of benefits to equipment engineers to provide equipment data for the equipment maintenance even though they are physically away from the equipment side. The usefulness of IIoT for the e-maintenance in semiconductor manufacturing domain with the in situ monitoring of plasma parameters is convinced. The authors found the average electron temperature gradually with the increase of Ar carrier gas flow due to the increased atomic collisions in PVD process. The large amount of carrier gas flow, in this experimental case, was 90 sccm, dramatically decreasing the electron temperature, which represents kinetic energy of electrons.

Semiconductor industries require high level of data security for the protection of their intellectual properties, and it also falls into equipment operational condition; however, data security through the Internet communication is not considered in this research, but it is already existing technology to be easily adopted by add-on feature.

The findings indicate that crucial equipment parameters are the amount of carrier gas flow rate and chamber pressure among the many equipment parameters, and they also affect plasma parameters of electron temperature and electron density, which directly affect the quality of metal deposition process result on wafer. Increasing the gas flow rate beyond a certain limit can yield the electron temperature loss to have undesired process result.

Several research studies on data mining with semiconductor equipment data have been suggested in semiconductor data mining domain, but the actual demonstration of the data acquisition system with real-time plasma monitoring data has not been reported. The suggested research is also valuable in terms of high cost and complicated equipment manufacturing.