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1 – 10 of 288
Article
Publication date: 2 January 2018

Hanhua Zhang, Jun Li, Jun Zou, Zhixin Wang and Jin Yang

The track impedance is one of the most important parameters in designing the track circuit which is widely used in the railway signal control system to detect the presence of a…

Abstract

Purpose

The track impedance is one of the most important parameters in designing the track circuit which is widely used in the railway signal control system to detect the presence of a train. This paper aims to calculate the ballastless track impedance by taking account of the influence of reinforcement bars.

Design/methodology/approach

This paper proposes a two-step decomposition approach to calculate the ballastless track impedance. The basic idea is evaluating the track impedance without the reinforcement bars by using two-dimensional (2D) finite element method (FEM), and the incremental impedance, because of the reinforcement bar, is calculated by the partial element equivalent circuit (PEEC) method.

Findings

The numerical examples show that the proposed approach can guarantee the accuracy and largely reduce the computing time, at least 20 times, compared with the direct three-dimensional (3D) FEM method.

Research limitations/implications

The study provides a fast approach to calculate the ballastless track impedance. However, compared with the 3D FEM method, the results are less accurate because of the approximation and assumption adopted in the method. A future study should pay more attention to improve accuracy of the model.

Originality/value

A fast approach is proposed to calculate the ballastless track impedance taking account of the influence of the reinforcement bars. The computing time can be largely reduced by using the method. With the proposed approach, the influence of insulation of the reinforcement bars on track impedance can be analyzed.

Details

COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, vol. 37 no. 1
Type: Research Article
ISSN: 0332-1649

Keywords

Article
Publication date: 1 June 2022

Qiwen Cheng, Jun Zou, Benliang Li and Jun Lu

The purpose of this study is to develop a new approach for simulating the ion flow field with the floating conductors based on the existing inversion method.

Abstract

Purpose

The purpose of this study is to develop a new approach for simulating the ion flow field with the floating conductors based on the existing inversion method.

Design/methodology/approach

The space charge keeps charging the floating conductors until the dynamic balance is reached. The corresponding floating potential boundary condition is linearized as the combination of the equipotential constraints and natural boundary condition, which can be directly imposed in the inversion process.

Findings

The numerical results demonstrate that the modified inversion algorithm performs well in the ion flow field with the floating conductors and the floating potential converges within five steps’ iterations. The proposed approach is applied to investigate the effect of the grounded line to the floating conductors in the practical high voltage direct current (HVDC) transmission lines.

Originality/value

The modified inverse algorithm provides a general way to deal with the Kapzov hypothesis and the floating boundary condition simultaneously within one loop, which can be applied to the multiphysics systems with different kinds of irregular boundary conditions.

Details

COMPEL - The international journal for computation and mathematics in electrical and electronic engineering , vol. 42 no. 1
Type: Research Article
ISSN: 0332-1649

Keywords

Article
Publication date: 15 February 2022

Xinmeng Zhai, Yue Chen, Yuefeng Li, Jun Zou, Mingming Shi and Bobo Yang

This study aims to study the mechanical, photoelectric, and thermal reliability of SAC307 solder joints with Ni-decorated MWCNTs for flip-chip light-emitting diode (LED) package…

Abstract

Purpose

This study aims to study the mechanical, photoelectric, and thermal reliability of SAC307 solder joints with Ni-decorated MWCNTs for flip-chip light-emitting diode (LED) package component during aging. By adding nanoparticles (Ni-multi-walled carbon nanotubes [MWCNTs]) to the solder paste, the shear strength and fatigue resistance of the brazed joint can be improved. However, the aging properties of Ni-modified MWCNTs composite solder joints have not been deeply studied. In this research, the mechanical, photoelectric and thermal reliability of SAC307 packaged flip-chip LEDs with Ni-MWCNTs added during aging were studied.

Design/methodology/approach

Compared with SAC solder alloys, the effects of different contents (0, 0.05, 0.1 and 0.2 Wt.%) of Ni-MWCNTs on the photoelectric and thermal properties of composite solder joints were examined. To study the aging characteristics of composite solder joints, the solder joints were aged at 85°C/85% relative humidity.

Findings

The addition of an appropriate amount of reinforcing agent Ni-MWCNTs reduces the density of the composite solder to 96% of the theoretical value of the SAC solder alloy. In addition, the microhardness increases and the wetting angle decreases. Two different phase compositions were observed in the solder joints with Ni-MWCNTs reinforcement: Cu3Sn and (Cu, Ni)6Sn5. The solder joints of SAC307-0.1Ni-MWCNTs exhibit the highest luminous flux and luminous efficiency of flip-chip LED filaments, the lowest steady-state voltage and junction temperature. And with the extension of the aging time, its aging stability is the best. In short, when the addition amount of Ni-MWCNTs is 0.1 Wt.%, the solder joints exhibit the best wettability and the thinnest intermetallic compound layer. And the shear strength of the tested solder joints is the best, and the void ratio is the lowest. At this time, the enhancement effect of Ni-MWCNTs on the composite solder has been best demonstrated.

Research limitations/implications

The content range of enhancer Ni-MWCNTs needs to be further reduced.

Practical implications

The authors have improved the performance of Ni-modified MWCNTs composite solder joints.

Originality/value

Composite solder with high performance has great practical application significance for improving the reliability and life of the whole device.

Details

Soldering & Surface Mount Technology, vol. 34 no. 5
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 28 August 2021

Zhao Wang, Yuefeng Li, Jun Zou, Bobo Yang and Mingming Shi

The purpose of this paper is to investigate the effect of different soldering temperatures on the performance of chip-on-board (COB) light sources during vacuum reflow soldering.

Abstract

Purpose

The purpose of this paper is to investigate the effect of different soldering temperatures on the performance of chip-on-board (COB) light sources during vacuum reflow soldering.

Design/methodology/approach

First, the influence of the void ratio of the COB light source on the steady-state voltage, luminous flux, luminous efficiency and junction temperature has been explored at soldering temperatures of 250°C, 260°C, 270°C, 280°C and 290°C. The COB chip has also been tested for practical application and aging.

Findings

The results show that when the soldering temperature is 270°C, the void ratio of the soldering layer is only 5.1%, the junction temperature of the chip is only 76.52°C, and the luminous flux and luminous efficiency are the highest, and it has been observed that the luminous efficiency and average junction temperature of the chip are 107 lm/W and 72.3°C, respectively, which meets the requirements of street lights. After aging for 1,080 h, the light attenuation is 84.64% of the initial value, which indicates that it has higher reliability and longer life.

Originality/value

It can provide reference data for readers and people in this field and can be directly applied to practical engineering.

Details

Soldering & Surface Mount Technology, vol. 34 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Open Access
Article
Publication date: 10 December 2021

Pingan Zhu, Chao Zhang and Jun Zou

The purpose of the work is to provide a comprehensive review of the digital image correlation (DIC) technique for those who are interested in performing the DIC technique in the…

1119

Abstract

Purpose

The purpose of the work is to provide a comprehensive review of the digital image correlation (DIC) technique for those who are interested in performing the DIC technique in the area of manufacturing.

Design/methodology/approach

No methodology was used because the paper is a review article.

Findings

no fundings.

Originality/value

Herein, the historical development, main strengths and measurement setup of DIC are introduced. Subsequently, the basic principles of the DIC technique are outlined in detail. The analysis of measurement accuracy associated with experimental factors and correlation algorithms is discussed and some useful recommendations for reducing measurement errors are also offered. Then, the utilization of DIC in different manufacturing fields (e.g. cutting, welding, forming and additive manufacturing) is summarized. Finally, the current challenges and prospects of DIC in intelligent manufacturing are discussed.

Details

Journal of Intelligent Manufacturing and Special Equipment, vol. 2 no. 2
Type: Research Article
ISSN: 2633-6596

Keywords

Article
Publication date: 31 May 2022

Jun Zou, Zhang Yuechao and Zhenyu Feng

The fuselage riveted lap-joints are susceptible to multiple site damage (MSD) and should be considered in damage tolerance analysis. This paper aims to investigate the stress…

Abstract

Purpose

The fuselage riveted lap-joints are susceptible to multiple site damage (MSD) and should be considered in damage tolerance analysis. This paper aims to investigate the stress intensity factor (SIF) and crack growth simulation for lap-joints based on three-dimensional (3D) finite element analysis.

Design/methodology/approach

The 3D finite element model of lap-joints is established by detailed representation of rivets and considering the rivet clamping force and friction. Numerical study is conducted to investigate the SIF distribution along the thickness direction and the effect of clamping force. A predictive method for the cracks propagation of MSD is then developed, in which an integral mean is adopted to quantify the SIF at crack tips, and the crack closure effect is considered. For comparison, a fatigue test of a lap-joint with MSD cracks is conducted to determine the cracks growth live and measure the cracks growth.

Findings

The numerical study shows that the through-thickness crack at riveted hole in lap-joints can be treated as mode I crack. The distribution of SIF along the thickness direction is inconstant and nonmonotonic. Besides, the increase in clamping force will lead to more frictional load transfer at the faying surfaces. The multiple crack growth simulation results agreed well with the experimental data.

Originality/value

The novelty of this work is that the SIF distribution along the thickness direction and the MSD cracks growth simulation for lap-joints are investigated by 3D finite element analysis, which can reflect the secondary bending, rivet clamping, contact and friction in lap-joints.

Details

Aircraft Engineering and Aerospace Technology, vol. 94 no. 10
Type: Research Article
ISSN: 1748-8842

Keywords

Article
Publication date: 11 November 2013

Jun Zou, Chenglong Zhou, Wenwen Li, Jae-bok Lee and Sughun Chang

The electromagnetic field radiated from a lightning channel is the excitation for analyzing the field-to-transmission line coupling problem. The purpose of this paper is to…

Abstract

Purpose

The electromagnetic field radiated from a lightning channel is the excitation for analyzing the field-to-transmission line coupling problem. The purpose of this paper is to propose a novel efficient approach to evaluate the horizontal electric field of the lightning channel expressed by the generalized Sommerfeld integral.

Design/methodology/approach

The asymptotic integral is extracted from the original one, which actually makes the Sommerfeld integral tail reach its convergence very quickly. To handle the sharp variance around k0, a closed-form integral, which is obtained by replacing the original kernel with an approximated function, is presented in detail. The numerical examples validated the proposed approach in the both frequency and time domain.

Findings

The approach proposed in this paper has been validated by the comparison with results in other papers. The agreement among these results reaches very well, and the approach proposed in this paper is more efficient and easy to implement, especially for the calculation of the tail integral part.

Originality/value

In accordance with the numerical experiments, the proposed approach can be served as a qualified candidate in terms of computational efficiency to evaluate the electromagnetic field generated by the lightning channel.

Details

COMPEL: The International Journal for Computation and Mathematics in Electrical and Electronic Engineering, vol. 32 no. 6
Type: Research Article
ISSN: 0332-1649

Keywords

Article
Publication date: 17 March 2016

Boyuan Zhang, Jun Zou, Jaebok Lee and Ju Mun-no

A fast algorithm is proposed to calculate the lightning horizontal electric field over a lossy ground.

Abstract

Purpose

A fast algorithm is proposed to calculate the lightning horizontal electric field over a lossy ground.

Design/methodology/approach

The lightning horizontal electric field in frequency domain is approximated by a number of piecewise cubic polynomial functions by using the proposed adaptive Hermite strategy. To utilize the Hermite strategy, the frequency domain spectrum and its derivative with respect to frequency are required. The integral kernel of the derivative appears singular along the real axis. To overcome this singularity and accelerate the calculation, a new integration path is proposed. With the help of the Hermite interpolation model and the new path, the lightning horizontal electric field in time domain can be obtained rapidly.

Findings

The singularity problem has been overcome with the new integration path and the adaptive Hermite strategy proposed in this paper is at least 50 times faster than the one using the equally spaced sampling approach.

Originality/value

The adaptive Hermite approach can be a good candidate for fitting a wideband frequency domain response and the revised new integration path can be utilized when the calculation of the generalized Sommerfeld integral (GSI) or its derivative with respect to frequency is involved.

Details

COMPEL - The international journal for computation and mathematics in electrical and electronic engineering , vol. 35 no. 3
Type: Research Article
ISSN: 0332-1649

Article
Publication date: 3 May 2013

Jae‐bok Lee, Jun Zou, Mo Li and Sughun Chang

A fast algorithm is proposed to calculate the lightning electromagnetic field over a perfectly conducting earth surface.

Abstract

Purpose

A fast algorithm is proposed to calculate the lightning electromagnetic field over a perfectly conducting earth surface.

Design/methodology/approach

The channel base current is approximated by a number of sub‐domain quadratic functions using the proposed adaptive sampling technique, and the derivative and integral of the channel base current with respect to time can be analytically expressed. With the help of these approximations, the ideal electromagnetic field of the lightning channel can be evaluated along the lightning channel with respect to the height.

Findings

The computational time can be greatly reduced using the proposed approach to evaluate the electromagnetic field of a lightning channel in the time domain.

Originality/value

The adaptive sampling technique is a general‐purposed approach, which can be potentially used in other applications to fit a function with the minimal number of intervals.

Details

COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, vol. 32 no. 3
Type: Research Article
ISSN: 0332-1649

Keywords

Article
Publication date: 1 July 2014

Jae-bok Lee, Jun Zou, Benliang Li and Munno Ju

The per-unit-length earth return mutual impedance of the overhead conductors plays an important role for analyzing electromagnetic transients or couplings of multi-conductor…

Abstract

Purpose

The per-unit-length earth return mutual impedance of the overhead conductors plays an important role for analyzing electromagnetic transients or couplings of multi-conductor systems. It is impossible to have a closed-form expression to evaluate this kind of impedance. The purpose of this paper is to propose an efficient numerical approach to evaluate the earth return mutual impedance of the overhead conductors above horizontally multi-layered soils.

Design/methodology/approach

The expression of the earth return mutual impedance, which contains a complex highly oscillatory semi-infinite integral, is divided into two parts intentionally, i.e. the definite and the tail integral, respectively. The definite integral is calculated using the proposed moment functions after fitting the integrand into the piecewise cubic spline functions, and the tail integral is replaced by exponential integrals with newly developed asymptotic integrands.

Findings

The numerical examples show the proposed approach has a satisfactory accuracy for different parameter combinations. Compared to the direct quadrature approach, the computational time of the proposed approach is very competitive, especially, for the large horizontal distance and the low height of the conductors.

Originality/value

The advantage of the proposed approach is that the calculation of the highly oscillatory integral is completely avoided due to the fact that the moment function can be evaluated analytically. The contribution of the tail integral is well included by means of the exponential integral, though in an asymptotic way. The proposed approach is completely general, and can be applied to calculate the earth return mutual impedance of overhead conductors above a soil structure with an arbitrary number of horizontal layers.

Details

COMPEL: The International Journal for Computation and Mathematics in Electrical and Electronic Engineering, vol. 33 no. 4
Type: Research Article
ISSN: 0332-1649

Keywords

1 – 10 of 288