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Article
Publication date: 1 May 1988

Seif Shalaby, John F. Yanagida and James B. Hassler

During the period 1966/67–1984/85, the United States market share in the global wheat trade averaged 41 per cent. Recently, this percentage has declined considerably after a…

101

Abstract

During the period 1966/67–1984/85, the United States market share in the global wheat trade averaged 41 per cent. Recently, this percentage has declined considerably after a period when the US agricultural sector expanded rapidly to meet the needs of growing world markets. The US market share of wheat trade reached an all‐time high of 48 per cent in 1981/82 then steadily declined to 37 per cent in 1984/85.

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Journal of Economic Studies, vol. 15 no. 5
Type: Research Article
ISSN: 0144-3585

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Article
Publication date: 1 January 1986

ROGER N. CONWAY and RON C. MITTELHAMMER

In the last two decades there has been considerable progress made in the development of alternative estimation techniques to ordinary least squares (OLS) regression. The search…

155

Abstract

In the last two decades there has been considerable progress made in the development of alternative estimation techniques to ordinary least squares (OLS) regression. The search for alternative estimators has no doubt been motivated by the observance of erratic OLS estimator behavior in cases where there are too few observations, multicollinearity problems, or simply “information‐poor” data sets. Imprecise and unreliable OLS coefficient estimates have been the result.

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Studies in Economics and Finance, vol. 10 no. 1
Type: Research Article
ISSN: 1086-7376

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Book part
Publication date: 17 February 2020

Simon Grima and Eleftherios I. Thalassinos

Abstract

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Financial Derivatives: A Blessing or a Curse?
Type: Book
ISBN: 978-1-78973-245-0

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Book part
Publication date: 3 February 2025

Chandrima Chakraborty and Dipyaman Pal

Abstract

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Performance Analysis of the Indian Pharmaceutical Industry: A Global Outlook
Type: Book
ISBN: 978-1-83797-743-7

Available. Open Access. Open Access
Article
Publication date: 17 May 2024

Mahendra Reddy

This study examines how the introduction of mobile money transfers, while making it efficient and convenient to access funds, has affected rural households’ savings behavior and…

642

Abstract

Purpose

This study examines how the introduction of mobile money transfers, while making it efficient and convenient to access funds, has affected rural households’ savings behavior and the banking sector.

Design/methodology/approach

This study utilizes Fiji’s most recent agricultural census data to model the agricultural household’s saving decision. The study estimates an probit model to examine rural households' savings behavior. Furthermore, it utilizes time series secondary data to examine how funds transfer has been channeled to rural households in Fiji.

Findings

Firstly, the results demonstrate that with the mobile money transfer platform launch, the banking sector has lost substantial money previously used to pass through its system, thus losing service fees and interest income. Furthermore, the findings demonstrate that those using mobile wallet platforms to receive money are more likely not to have a savings account with the bank. Noting the cultural systems and social settings of the native households and the ease of payments via the mobile platform, they tend to spend more on consumption rather than saving, thus making these households more vulnerable during shocks such as natural disasters.

Originality/value

While mobile money transfer is hailed as a revolution, no research has yet picked up the downside to it, that of undermining the very effort by policymakers to get low-income rural households to save. Secondly, this study also highlights how mobile money transfer deprives the banking system of a significant transfer fee income and a source of funds to pool and lend to earn interest income. Furthermore, this study brings to the forefront a dichotomy about how a rural indigenous community sees the welfare and prosperity of their community much differently than what economics textbooks portray.

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International Journal of Bank Marketing, vol. 43 no. 1
Type: Research Article
ISSN: 0265-2323

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Article
Publication date: 1 October 2001

Jimmy Hill

This monograph is the consequence of a variety of experiences. It reflects an interest in SMEs and entrepreneurship stretching back almost 17 years from the author’s days in the…

9150

Abstract

This monograph is the consequence of a variety of experiences. It reflects an interest in SMEs and entrepreneurship stretching back almost 17 years from the author’s days in the fresh food industry. It reflects knowledge from a series of studies and projects in which the author has been engaged since commencement of an academic career in 1990. In particular, it reflects the findings of a five‐year piece of doctoral research that the author conducted with 57 firms in Ireland and the UK between 1995‐1999. The study seeks to identify the key determinants of SME marketing activity. The research objectives focused on determining a framework of marketing competencies for SMEs, the extent of formal marketing processes practised, and how SME marketing decisions are made. Further research objectives emerged (these were inductive in nature) that focused on determining the extent of the sales orientation in SMEs and on gaining insights into the use and character of the contact networks of the individuals who manage such enterprises. A syncretised qualitative methodology was developed for the study. The research approach was both deductive and inductive. The analytical strategy adopted a range of tools but was predominantly characterised by data reduction through detailed coding and the development of strict frameworks for analysis. The findings identified a spectrum of marketing competencies for SMEs. It existed at three levels – foundation, transitional and operational. It was shown that the sales orientation of SMEs is what determines their marketing character. A core spectrum of SME sales competencies was identified. It showed significant overlap with the marketing competency spectrum. It was concluded that, since the sales orientation determines the marketing competencies, it also shapes the marketing character of SMEs. The sample firms engaged in significant formal marketing practice, most notably marketing planning. Marketing practice and decisions were characterised by significant usage of personal contact networks. Contact networks were also rooted in a strong sales orientation. It was clear that many marketing decisions that are ostensibly operational in character become strategic or eventually effect strategic change in the marketing practices of SMEs. A holistic model of SME marketing was developed. The model is an integrated complex of the elements of SME marketing examined. Whilst the holistic model developed is entrepreneurial in character, it depicts the SME as a much more sophisticated marketing entity than has been suggested in any previous research.

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International Journal of Entrepreneurial Behavior & Research, vol. 7 no. 5
Type: Research Article
ISSN: 1355-2554

Keywords

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Abstract

Details

Financial Derivatives: A Blessing or a Curse?
Type: Book
ISBN: 978-1-78973-245-0

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Article
Publication date: 7 August 2017

Alena Pietrikova, Tibor Rovensky, Juraj Durisin, Igor Vehec and Ondrej Kovac

The purpose of this paper is to analyse the influence of various firing profiles on microstructural and dielectric properties of low-temperature, co-fired ceramic (LTCC…

110

Abstract

Purpose

The purpose of this paper is to analyse the influence of various firing profiles on microstructural and dielectric properties of low-temperature, co-fired ceramic (LTCC) substrates in a GHz frequency range. According these analyses, sintering process can be controlled and modified to achieve better performance of devices fabricated from LTCC substrates.

Design/methodology/approach

Samples from LTCC substrates GreenTape 951 and GreenTape 9K7 were sintered by four firing profiles. Basic firing profile recommended by the manufacturer was modified by increasing the peak temperature or the dwell time at the peak temperature. The influence of firing profile on microstructural properties was analysed according to measurements by X-ray diffractometer (application of the Cu K-alpha radiation and the Bragg-Brentano method), and the influence on dielectric properties (dielectric constant and dielectric losses) was analysed according to measurements by split cylinder resonator method at 9.7 and 12.5 GHz.

Findings

Rising of the peak temperature or extension of dwell time at this temperature has influence on all analysed properties of LTCC substrates. Size of crystallites can be changed by modification of firing profile as well as microdeformation. In addition, dielectric properties can be changed too by modification of the firing profile. Correlation between microdeformation and dielectric losses was observed.

Originality/value

The novelty of this work lies in finding the mutual relationship between changes in microstructural (size of grains and microdeformation) and dielectric properties (dielectric constant and dielectric losses) caused by different firing profiles.

Details

Microelectronics International, vol. 34 no. 3
Type: Research Article
ISSN: 1356-5362

Keywords

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Article
Publication date: 23 September 2024

Yuan Nan and Huan Chen

As one of China’s most influential social platforms, Xiaohongshu is considered an underexploited market with significant user traffic. This study aims to build on existing…

156

Abstract

Purpose

As one of China’s most influential social platforms, Xiaohongshu is considered an underexploited market with significant user traffic. This study aims to build on existing scholarly work on social media marketing by conducting an empirical analysis of Xiaohongshu’s content to explore effective marketing strategies for children’s books.

Design/methodology/approach

This study uses qualitative content analysis to investigate the marketing practices for children’s books on Xiaohongshu. By systematically coding and interpreting data, the authors identified core marketing strategies and their interactions among publishers of children’s books on the platform.

Findings

Based on viral marketing and social proof theories, the analysis delineates practices and interrelations among three key marketing strategy components: content creation, traffic navigation and sales conversion on Xiaohongshu. From this analysis, a conceptual model titled “Continuous ‘Planting a Seed’ of Interest: Strategies for Marketing Children’s Books on Xiaohongshu” was developed.

Originality/value

This research not only corroborates the existing literature on the transformative power of social media in marketing but also extends it by providing a focused examination of how these principles apply to the promotion of children’s books on Xiaohongshu. It also provides practical insights for publishers looking to develop effective marketing strategies.

Details

Young Consumers, vol. 26 no. 1
Type: Research Article
ISSN: 1747-3616

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Article
Publication date: 10 May 2011

John H. Lau

The purpose of this paper is to focus on through‐silicon via (TSV), with a new concept that every chip or interposer could have two surfaces with circuits. Emphasis is placed on…

4966

Abstract

Purpose

The purpose of this paper is to focus on through‐silicon via (TSV), with a new concept that every chip or interposer could have two surfaces with circuits. Emphasis is placed on the 3D IC integration, especially the interposer (both active and passive) technologies and their roadmaps. The origin of 3D integration is also briefly presented.

Design/methodology/approach

This design addresses the electronic packaging of 3D IC integration with a passive TSV interposer for high‐power, high‐performance, high pin‐count, ultra fine‐pitch, small real‐estate, and low‐cost applications. To achieve this, the design uses chip‐to‐chip interconnections through a passive TSV interposer in a 3D IC integration system‐in‐package (SiP) format with excellent thermal management.

Findings

A generic, low‐cost and thermal‐enhanced 3D IC integration SiP with a passive interposer has been proposed for high‐performance applications. Also, the origin of 3D integration and the overview and outlook of 3D Si integration and 3D IC integration have been presented and discussed. Some important results and recommendations are summarized: the TSV/redistribution layer (RDL)/integrated passive devices passive interposer, which supports the high‐power chips on top and low‐power chips at its bottom, is the gut and workhorse of the current 3D IC integration design; with the passive interposer, it is not necessary to “dig” holes on the active chips. In fact, try to avoid making TSVs in the active chips; the passive interposer provides flexible coupling for whatever chips are available and/or necessary, and enhances the functionality and possibly the routings (shorter); with the passive interposer, the TSV manufacturing cost is lower because the requirement of TSV manufacturing yield is too high (>99.99 percent) for the active chips to bear additional costs due to TSV manufacturing yield loss; with the passive interposer, wafer thinning and thin‐wafer handling costs (for the interposer) are lower because these are not needed for the active chips and thus adds no cost due to yield loss; with the current designs, all the chips are bare; the packaging cost for individual chips is eliminated; more than 90 percent of heat from the 3D IC integration SiP is dissipated from the backside of high‐power chips using a thermal interface material and heat spreader/sink; the appearance and footprint of current 3D IC integration SiP designs are very attractive to integrated device manufactures, original equipment manufactures, and electronics manufacturing services (EMS) because they are standard packages; and underfills between the copper‐filled TSV interposer and the high‐ and low‐power chips are recommended to reduce creep damage of the lead‐free microbump solder joints and prolong their lives.

Originality/value

The paper's findings will be very useful to the electronic industry.

Details

Microelectronics International, vol. 28 no. 2
Type: Research Article
ISSN: 1356-5362

Keywords

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