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This paper aims to develop thermal analysis method of thermal joints characterization. The impact on convection on thermal resistance analysis with use thermography for silver-based thermal joints were investigated for non-metallized and metalized semiconductor surfaces. Heat transfer efficiency depends on thermal conductivity; radiation was used to perform thermographic analysis; the convection is energy loss, so its removing might improve measurements accuracy.

Investigation of thermal joints analysis method was focused on determination of convection impact on thermal resistance thermographic analysis method. Measuring samples placed in vacuum chamber with lowered pressure requires transparent window for infrared radiation that is used for thermographic analysis. Impact of infrared window and convection on temperature measurements and thermal resistance were referred.

The results showed that the silicon window allowed to perform thermal analysis through, and the convection was heat transfer mode which create 15% energy loss.

It is possible to measure thermal resistance for silver-based thermal joints with convection eliminated to improve measurements accuracy.

The purpose of this paper is to present a most accurate analytical model suit for the prediction of the elastic displacements in a ceramic strip for sensing longitudinal deformations. Accordingly, the objective of the analysis given is to develop a physically meaningful and simple‐as‐possible stress‐strain model for an elongated strip attached to a thick‐and‐stiff substrate.

Today's advanced strain gage designs intended for measuring deformations and related physical characteristics use sensitive elements manufactured as ceramic strips. The output signal depends to a great extent on the ability to measure and to adequately interpret the induced elastic displacements in the strip, as the global electric resistor is coupled strongly to the strain field in the sensitive layer. The dependence of the strain on the thickness of a strip is calculated using an analytical 2D stress‐strain model using a shear tension applied at its interface with the substrate and zero‐stress at the opposite face as boundary conditions. All necessary considerations and calculations to develop the model are discussed.

A significant result is the gradual reduction in the deformation depending on the layer thickness. Applying the model combines easy numerical effort with an expressive approximation.

The developed model can be used in the analysis and physical design of the structural elements of the type in question, not necessarily in the field of strain gage and sensor engineering.