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The purpose of this paper is to present a Design for Additive Manufacturing (DfAM) methodology that connects several methods, from geometrical design to post-process selection, into a common optimisation framework.

A design methodology is formulated and tested in a case study. The outcome of the case study is analysed by comparing the obtained results with alternative designs achieved by using other design methods. The design process in the case study and the potential of the method to be used in different settings are also discussed. Finally, the work is concluded by stating the main contribution of the paper and highlighting where further research is needed.

The proposed method is implemented in a novel framework which is applied to a physical component in the case study. The component is a structural aircraft part that was designed to minimise weight while respecting several static and fatigue structural load cases. An addition goal is to minimise the manufacturing cost. Designs optimised for manufacturing by two different AM machines (EOS M400 and Arcam Q20+), with and without post-processing (centrifugal finishing) are considered. The designs achieved in this study show a significant reduction in both weight and cost compared to one AM manufactured geometry designed using more conventional methods and one design milled in aluminium.

The method in this paper allows for the holistic design and optimisation of components while considering manufacturability, cost and component functionality. Within the same framework, designs optimised for different setups of AM machines and post-processing can be automatically evaluated without any additional manual work.

This paper aims to review recent research in design for additive manufacturing (DfAM), including additive manufacturing (AM) terminology, trends, methods, classification of DfAM methods and software. The focus is on the design engineer’s role in the DfAM process and includes which design methods and tools exist to aid the design process. This includes methods, guidelines and software to achieve design optimization and in further steps to increase the level of design automation for metal AM techniques. The research has a special interest in structural optimization and the coupling between topology optimization and AM.

The method used in the review consists of six rounds in which literature was sequentially collected, sorted and removed. Full presentation of the method used could be found in the paper.

Existing DfAM research has been divided into three main groups – component, part and process design – and based on the review of existing DfAM methods, a proposal for a DfAM process has been compiled. Design support suitable for use by design engineers is linked to each step in the compiled DfAM process. Finally, the review suggests a possible new DfAM process that allows a higher degree of design automation than today’s process. Furthermore, research areas that need to be further developed to achieve this framework are pointed out.

The review maps existing research in design for additive manufacturing and compiles a proposed design method. For each step in the proposed method, existing methods and software are coupled. This type of overall methodology with connecting methods and software did not exist before. The work also contributes with a discussion regarding future design process and automation.

This study aims to develop a bimodal nano-silver paste with improved mechanical property and reliability. Silicon carbide (SiC) particles coated with Ag were introduced in nano-silver paste to improve bonding strength between SiC and Ag particles and enhance high-temperature stability of bimodal nano-silver paste. The effect of sintering parameters such as sintering temperature, sintering time and the proportion of SiC particles on mechanical property and reliability of sintered bimodal nano-silver structure were investigated.

Sandwich structures consist of dummy chips and copper substrates with nickel and silver coating bonded by nano-silver paste were designed for shear testing. Shear strength testing was conducted to study the influence of SiC particles proportions on the mechanical property of sintered nano-silver joints. The reliability of the bimodal nano-silver paste was evaluated experimentally by means of shear test for samples subjected to thermal aging test at 150°C and humidity and temperature testing at 85°C and 85 per cent RH, respectively.

Shear strength was enhanced obviously with the increase of sintering temperature and sintering time. The maximum shear strength was achieved for nano-silver paste sintered at 260°C for 10 min. There was a negative correlation between the proportion of SiC particles and shear strength. After thermal aging testing and humidity and temperature testing for 240 h, the shear strength decreased a little. High-temperature stability and high-hydrothermal stability were improved by the addition of SiC particles.

Submicron-scale SiC particles coated with Ag were used as alternative materials to replace part of nano-silver particles to prepare bimodal nano-silver paste due to its high thermal conductivity and excellent mechanical property.

This study aims to contribute with an extended framework on synergy realisation in acquisitions. The study conceptualises synergy realisation after acquisitions, in interaction with other companies in a business network and that synergy can be the result of both intended and not intended actions.

The study is based on a company involved in acquisitions, being both the acquirer and the acquired. The data for analysis were collected through semi-structured interviews with managers involved in the described acquisition processes. The semi-structured interviews were guided by overarching themes to cover relevant areas of the described acquisitions.

This study develops a framework in which synergy is used as a concept in business networks. The framework offers a more dynamic perspective on acquisition processes and extends the view of acquisition performance beyond more financial and company internal aspects of acquisition processes. Further, the findings show that related companies such as customers and suppliers, play important roles in synergy realisation.

From a managerial perspective, the study shows the importance of understanding the underlying forces of integration processes.

The concept of synergy used in this study not only includes the companies integrated in an acquisition but also their business networks. Including the integrated companies and their business networks provides a more dynamic perspective from which to plan and realise synergy.

The purpose of this paper is to identify sensing, seizing and reconfiguring routines of dynamic capabilities that enable digital transformation in firms.

A qualitative approach is used. Representatives from a firm going through digital transformations are interviewed, and focus groups have been carried out with a consultancy firm experienced in giving advice to firms going through digital transformation.

Six routines identified as relevant specifically for digital transformation are identified. These are cross-industrial digital sensing, inside-out digital infrastructure sensing, digital strategy development, determination of enterprise boundaries, decomposition of digital transformation into specified projects and creation of a unified digital infrastructure.

The authors provide direction for managers on how to approach digital transformation. In relation to previous research, the authors provide more specific guidance regarding how to reconfigure the organization in digital transformation.

The paper uses a novel context for digital transformation and complements the very few studies available using dynamic capabilities to understand digital transformation.

To determine the Coffin‐Manson (CM) equation constants for fatigue life estimation of Sn‐8Zn‐3Bi solder joints, since Sn‐8Zn‐3Bi solder has a melting temperature of around 199°C which is close to that of the conventional Sn‐Pb solder which has previously been used in the electronics assembly industry.

Three dimensional finite element (FE) simulation analysis was used for comparison with the experimentally measured data and to determine the CM constants. Low cycle fatigue tests and FE simulations were carried out for these lead‐free solder joints, and eutectic Sn‐37Pb solder was used as a reference.

The CM equation for Sn‐8Zn‐3Bi solder joints was fitted to the lifetimes measured and the shear strains simulated. The constants were determined to be 0.0294 for C, the proportional constant, and for the fatigue exponent, β, −2.833.

The CM equation can now be used to predict the reliability of Sn‐8Zn‐3Bi solder joints in electronics assembly and the knowledge base for the properties of the Sn‐Zn solder system has been increased.

Anisotropically Conductive Adhesives (ACAs) have been used in electronics packaging for over a decade on glass substrates, and more recently in contactless smart‐card module assembly and for bare chip attach on flexible and rigid substrates. Summarises various technologies used in connection with ACA joining. A summary of our understanding of the electrical, thermal, physical, chemical, environmental and cost behaviours of ACAs in conjunction with various packaging applications is elaborated. Finally, future research areas and remaining issues are pointed out.