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The purpose of this study is the design, fabrication and evaluation of a miniature ozone generator using the principle of electric discharge are presented.

The device was fabricated using a low-temperature co-fired ceramics (LTCC) technology, by which a multilayered ceramic structure with integrated electrodes, buried channels and cavities in micro and millimeter scales was realized.

The developed ozone generator with the dimensions of 63.6 × 41.8 × 1.3 mm produces approximately 1 vol. % of ozone in oxygen flow of 15 ml/min, at an applied voltage of 7 kV.

A miniature ozone generator, manufactured in LTCC technology, produces high amount of ozone and more than it is described in the available references or in datasheets of commercial devices of similar size.

In this manuscript the purpose is to present and evaluate the developed non‐destructive method for analysing the phase composition of LTCC Du Pont “Green Tape 951” material fired in the temperature range from 800 to 1,000°C using X‐ray powder diffraction and Rietveld refinement.

The method uses the crystalline Al2O3 which is already present in the material as an internal standard since its mass fraction was previously found to be constant in the described temperature range.

The results of the non‐destructive analyses and the classical destructive analyses are comparable and the estimated error of the destructive phase analyses and the calculated errors for the non‐destructive phase analyses are of the same order.

The described method can be used also for analysing another type of LTCC material. In this case it is necessary to check whether the mass fraction of any crystalline phase present in the sample is constant in the given temperature range, because only in this case can it be used as an internal standard for a determination of the phase composition.

The non‐destructive method is a fast and easy approach for analysing the fired samples and is also suitable for controlling the phase composition of LTCC materials on 3D complex structures without destroying them, just by using the X‐ray diffraction patterns collected from their surface.

Aims to evaluate different thick‐film materials for use in strain sensors and temperature sensors on low‐temperature co‐fired ceramic (LTCC) substrates.

LTCC materials are sintered at the low temperatures typically used for thick‐film processing, i.e. around 850°C, The thick‐film resistor materials for use as strain and temperature sensors on LTCC tapes are studied. Thick‐film piezo‐resistors in the form of strain‐gauges are realised with 10 kΩ/sq. 2041 (Du Pont)and 3414‐B (ESL), resistor materials; thick‐film temperature‐dependent resistors were made from PTC 5093 (Du Pont), and NTC‐4993 (EMCA Remex) resistor materials.

The X‐ray spectra of the 2041 and 3414‐Bb low TCR resistors after drying at 150°C and after firing display more or less the same peaks. The electrical characteristics of 2041 resistors fired on alumina and LTCC substrates are similar indicating that the resistors are compatible with the LTCC material. After firing on LTCC substrates the sheet resistivities and TCRs of the 3414‐B resistors increased. Also, there is a significant increase in the GFs from 13 to over 25.

Investigates the compatibility of thick‐film materials and the characteristics of the force and temperature sensors.

Diffusion patterning is a dielectric patterning technology, which is used in the screen printed thick film technology for higher density multilayer circuits. This technology is suitable for producing lower cost multichip modules and requires a low additional investment in conventional thick film technology production lines. Comparisons of via resolution capability of diffusion patterning versus conventional thick film technology are described and discussed. Preliminary experimental results obtained with a test circuit showed that 200μm lines and 200μm vias could be achieved with acceptable yield and with minimal modification to standard production lines. The electronic circuit for the pressure sensor was designed and realised with the verified technology as a low‐cost ceramic multichip module. A few results of an investigation of some thick film materials, which comprise the “set” of pastes for diffusion patterning technology, are presented.