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The purpose of this paper is to investigate how to reduce the time and cost required to conduct reliability testing. With increasing competition in the electronics industry and reduction in product life cycles, it is essential to diminish the time required for new product development and thus time to market.

This study conducts empirical sample test for wireless card and analyzes the fatigue life through finite element modeling (FEM). Simulation results are compared to the data collected from a temperature cycling test under conditions of −40°C to 150°C and −40°C to 100°C.

Assuming that the results of product lifetime from empirical sample test and software simulation exhibit a linear relationship, a “scale factor” should exist for any given product structure, process condition and materials composition scenario. The scale factors were found to be approximately 0.1 in both temperature cycling scenarios. Also, the effectiveness of various adhesive dispensing patterns on solder joint reliability is evaluated through software simulation. The L shape adhesive dispensing was proven to effectively enhance the fatigue life of chip scale package solder joints roughly 100‐fold.

The scale factor is used to convert the results from software simulation to empirical sample test for a given set of processing environments and materials. This helps to reduce the time and cost required to conduct reliability testing.

Compared with traditional industrial processing technologies of sulfurized isobutylene, the one-step synthesis method involving high pressure is more environment-friendly and leads to better product performance. However, products from various sources perform differently because of the difference in the contents of their components. Therefore, the purpose of this study was to investigate the relationships between sulfide components of high-pressure sulfurized isobutylene and load carrying capacities.

A typical high-pressure sulfurized isobutylene was chosen, and the structure and contents of its sulfide components were characterized using gas chromatography-mass spectrometry and gas chromatography (GC). Extreme-pressure properties of the sample at different concentrations were evaluated using a four-ball tribometer.

A multiple regression equation model was established, and tert-butyl trisulfide made the greatest contribution to the extreme-pressure properties according to the equation coefficient, while tert-butyl tetrasulfide had no effect. The results can be attributed to the fact that the structure of a sulfurized additive having an impact is application-specific.

A precise and fast way to predict weld load values of high-pressure sulfurized isobutylene by using GC and the established equation model were successfully developed. Moreover, the empirical equation shows the relationships between sulfide component concentrations and load carrying capacities.