Hejun Gu and Ugur Aytun Ozturk
Investigating the relationship between gender gap in school enrollment and the spread of information and communication technology (ICT) in rural China.
Abstract
Purpose
Investigating the relationship between gender gap in school enrollment and the spread of information and communication technology (ICT) in rural China.
Design/methodology/approach
Using data from China Health and Nutrition Survey for the period of 1991-2009, we document gender patterns of school enrollments of children aged between 7 and 18 years. We estimate the impact of phone and internet access on school enrollments of children using a probit model.
Findings
The results indicate that the spread of phone and internet access both contribute to an increase in enrollment of females. Naturally, the gender gap in enrollments is not simply shaped by technology, and social norms also play an important role. Consequently, our results also show that enrollment of females is lower in the communities where pro-son preference is stronger, holding technology and other factors constant.
Originality/value
We conclude that promoting further development of telecommunications services may result in narrowing the school enrollment gender gap in rural China. This conclusion is valuable in setting governmental policies as well as guiding the actions of NGOs.
Jian Feng Li, Qin Shi, HeJun Zhu, ChenYu Huang, Shuai Zhang, Weixiang Peng and ChangSheng Li
This paper aims to clarify the size and morphology of transition metal dichalcogenides has an impact on lubrication performance of Cu-based composites. This study is intended to…
Abstract
Purpose
This paper aims to clarify the size and morphology of transition metal dichalcogenides has an impact on lubrication performance of Cu-based composites. This study is intended to show that Cu-based electrical contact materials containing Nb0.91Ti0.09Se2 have better electrical and tribological properties than those containing NbSe2. The tribological properties of Cu-based with different Ti-dopped NbSe2 content were also discussed.
Design/methodology/approach
The NbSe2 and Nb0.91Ti0.09Se2 particles were fabricated by thermal solid state reaction method. The powder metallurgy technique was used to fabricate composites with varying Nb0.91Ti0.09Se2 mass fraction. The phase composition of Cu-based composites was identified by X-ray diffraction, and the morphology of NbSe2/Nb0.91Ti0.09Se2 and the worn surface of composites were characterized by scanning electron microscopy and transmission electron microscopy. In addition, the tribological properties of composites were appraised using a ball-on-disk multi-functional tribometer. The data of friction coefficient and resistivity were analyzed and the corresponding conclusion was drawn.
Findings
In comparison with the pure copper, Cu-based composites containing Nb0.91Ti0.09Se2/NbSe2 had a lower friction coefficient, illustrating the Nb0.91Ti0.09Se2 with nano-size particles prepared in this work is a perfect choice for the fabrication of excellent electrical contact composites. Compared to composites with NbSe2, composites containing Nb0.91Ti0.09Se2 have better tribological and electrical properties.
Research limitations/implications
Because of the use of thermal solid state reaction method, the size of NbSe2 and Nb0.91Ti0.09Se2 is relatively large. Therefore, the fabrication of finer particles of Nb0.91Ti0.09Se2 is encouraged.
Originality/value
In this paper, the authors discuss the tribological and electrical properties of Cu-based composites, and the value of optimum obtained as Nb0.91Ti0.09Se2 content is 15 Wt.%.