Search results

1 – 2 of 2
Per page
102050
Citations:
Loading...
Access Restricted. View access options
Article
Publication date: 1 April 2014

Liu Mei Lee, Muhammad Firdaus Mohd Nazeri, Habsah Haliman and Ahmad Azmin Mohamad

– The purpose of this paper is to examine the corrosion behaviors of SAC305 thin film solder alloy in 6 M KOH solution.

264

Abstract

Purpose

The purpose of this paper is to examine the corrosion behaviors of SAC305 thin film solder alloy in 6 M KOH solution.

Design/methodology/approach

The corrosion behavior of bare Cu, as-deposited SAC305/Cu and as-reflowed SAC305/Cu thin films at varying temperatures, was investigated by means of potentiodynamic polarization in a 6 M KOH solution. The microstructure, phase and thickness of the intermetallic compounds formed were determined before and after polarization.

Findings

Bare Cu was found to possess the best corrosion resistance, whereas the as-deposited SAC305/Cu had the lowest corrosion resistance. As-reflowed SAC305/Cu with an exposed Cu3Sn layer exhibited better corrosion resistance than did Cu6Sn5. The Ag3Sn phase has the noblest characteristic because it was retained and did not dissolve in the KOH solution. All of the samples contained the corrosion products of oxide. Bare Cu obeys the well-known duplex structure of a Cu2O/CuO, Cu(OH)2 layer. For as-reflowed SAC305/Cu, the corroded surface was also mainly composed of SnO and SnO2.

Originality/value

New analysis on the polarization of thin film characteristics of SAC305 lead-free solder in alkaline solution.

Details

Soldering & Surface Mount Technology, vol. 26 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Access Restricted. View access options
Article
Publication date: 1 February 2013

Liu Mei Lee, Habsah Haliman and Ahmad Azmin Mohamad

The purpose of this paper is to produce and investigate the interfacial reaction between Sn‐3.0Ag‐0.5Cu (SAC305) thin films and Cu substrates by solder reflow at various…

442

Abstract

Purpose

The purpose of this paper is to produce and investigate the interfacial reaction between Sn‐3.0Ag‐0.5Cu (SAC305) thin films and Cu substrates by solder reflow at various temperatures and times.

Design/methodology/approach

SAC305 thin films were deposited on copper substrates using a thermal evaporation technique. The as‐deposited SAC305/Cu was then reflowed on a hot plate at temperatures of 230, 240, 250 and 260°C for 30 s. In addition, solder reflow was conducted at a constant temperature of 230°C for 5, 10, 15 and 20 s. The microstructure, phase and thickness of the intermetallic compounds (IMCs) formed were determined after cross‐sectional metallographic preparation.

Findings

Cu6Sn5 and Cu3Sn were observed at the as‐reflowed SAC305/Cu interfacial region. The IMC thicknesses increased with the higher reflow temperature and longer reflow times.

Originality/value

Up to now, studies on the thin film characteristics of SAC305 lead‐free solder have been very limited. Thus, this paper presents the deposition of SAC305 thin film by a thermal evaporation technique and its characteristics after solder reflow.

Details

Soldering & Surface Mount Technology, vol. 25 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

1 – 2 of 2
Per page
102050