The purpose of this paper is to focus on through‐silicon via (TSV), with a new concept that every chip or interposer could have two surfaces with circuits. Emphasis is placed on…
Abstract
Purpose
The purpose of this paper is to focus on through‐silicon via (TSV), with a new concept that every chip or interposer could have two surfaces with circuits. Emphasis is placed on the 3D IC integration, especially the interposer (both active and passive) technologies and their roadmaps. The origin of 3D integration is also briefly presented.
Design/methodology/approach
This design addresses the electronic packaging of 3D IC integration with a passive TSV interposer for high‐power, high‐performance, high pin‐count, ultra fine‐pitch, small real‐estate, and low‐cost applications. To achieve this, the design uses chip‐to‐chip interconnections through a passive TSV interposer in a 3D IC integration system‐in‐package (SiP) format with excellent thermal management.
Findings
A generic, low‐cost and thermal‐enhanced 3D IC integration SiP with a passive interposer has been proposed for high‐performance applications. Also, the origin of 3D integration and the overview and outlook of 3D Si integration and 3D IC integration have been presented and discussed. Some important results and recommendations are summarized: the TSV/redistribution layer (RDL)/integrated passive devices passive interposer, which supports the high‐power chips on top and low‐power chips at its bottom, is the gut and workhorse of the current 3D IC integration design; with the passive interposer, it is not necessary to “dig” holes on the active chips. In fact, try to avoid making TSVs in the active chips; the passive interposer provides flexible coupling for whatever chips are available and/or necessary, and enhances the functionality and possibly the routings (shorter); with the passive interposer, the TSV manufacturing cost is lower because the requirement of TSV manufacturing yield is too high (>99.99 percent) for the active chips to bear additional costs due to TSV manufacturing yield loss; with the passive interposer, wafer thinning and thin‐wafer handling costs (for the interposer) are lower because these are not needed for the active chips and thus adds no cost due to yield loss; with the current designs, all the chips are bare; the packaging cost for individual chips is eliminated; more than 90 percent of heat from the 3D IC integration SiP is dissipated from the backside of high‐power chips using a thermal interface material and heat spreader/sink; the appearance and footprint of current 3D IC integration SiP designs are very attractive to integrated device manufactures, original equipment manufactures, and electronics manufacturing services (EMS) because they are standard packages; and underfills between the copper‐filled TSV interposer and the high‐ and low‐power chips are recommended to reduce creep damage of the lead‐free microbump solder joints and prolong their lives.
Originality/value
The paper's findings will be very useful to the electronic industry.
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Dilupa Nakandala, Henry Lau and Jingjing Zhang
Logistics practitioners must continually improve inventory management processes as they daily respond to the twin drivers of customer satisfaction and cost efficiency. The purpose…
Abstract
Purpose
Logistics practitioners must continually improve inventory management processes as they daily respond to the twin drivers of customer satisfaction and cost efficiency. The purpose of this paper is to investigate the scenario of sourcing goods through lateral transshipments in a periodic-review policy setting, against a backdrop of cost optimization objectives.
Design/methodology/approach
The authors develop decision rules that make cost-optimized selection between backordering and combined reactive and proactive lateral transshipment options possible. This necessarily takes account of the trade-off between purchasing, holding and backorder cost components. In addition, the authors use simulation studies to illustrate the superior performance of the proposed decision options.
Findings
According to results of the simulation studies, the proposed two-step decision rule generates the lower inventory cost than the alternative decisions rules. The outperformance of proposed two-step decision rule is valid in different scenario.
Practical implications
This study develops the decision rules to assist wholesaler logistics practitioners to make optimized decisions with regard to whether they should proactively lateral transshipments and if selected, the optimum size of the extra lateral transshipment.
Originality/value
This study has made a significant contribution to the existing knowledge base as it develops decision rules for a combined proactive and reactive approach using lateral transhipments to meet both urgent demand and a part of the demand expected during the supplier lead time in a cost-efficient way.
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Henry Lau, C.K.M. Lee, Dilupa Nakandala and Paul Shum
The purpose of this paper is to propose an outcome-based process optimization model which can be deployed in companies to enhance their business operations, strengthening their…
Abstract
Purpose
The purpose of this paper is to propose an outcome-based process optimization model which can be deployed in companies to enhance their business operations, strengthening their competitiveness in the current industrial environment. To validate the approach, a case example has been included to assess the practicality and validity of this approach to be applied in actual environment.
Design/methodology/approach
This model embraces two approaches including: fuzzy logic for mimicking the human thinking and decision making mechanism; and data mining association rules approach for optimizing the analyzed knowledge for future decision-making as well as providing a mechanism to apply the obtained knowledge to support the improvement of different types of processes.
Findings
The new methodology of the proposed algorithm has been evaluated in a case study and the algorithm shows its potential to determine the primary factors that have a great effect upon the final result of the entire operation comprising a number of processes. In this case example, relevant process parameters have been identified as the important factors causing significant impact on the result of final outcome.
Research limitations/implications
The proposed methodology requires the dependence on human knowledge and personal experience to determine the various fuzzy regions of the processes. This can be fairly subjective and even biased. As such, it is advisable that the development of artificial intelligence techniques to support automatic machine learning to derive the fuzzy sets should be promoted to provide more reliable results.
Originality/value
Recent study on the relevant topics indicates that an intelligent process optimization approach, which is able to interact seamlessly with the knowledge-based system and extract useful information for process improvement, is still seen as an area that requires more study and investigation. In this research, the process optimization system with an effective process mining algorithm embedded for supporting knowledge discovery is proposed for use to achieve better quality control.
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Henry C. Lau, Andrew Ip, CKM Lee and GTS Ho
The purpose of this paper is to propose a three-tier assessment model (TAM), aiming to identify and evaluate the competitiveness level of companies. The existing problem is that…
Abstract
Purpose
The purpose of this paper is to propose a three-tier assessment model (TAM), aiming to identify and evaluate the competitiveness level of companies. The existing problem is that companies find it difficult to choose a proper model which can be deployed to benchmark with competitors in terms of their competiveness level in the marketplace. Most of the available models are not appropriate or easy to use. The proposed assessment model is able to provide an insight for better planning and preparation so as to gain a better chance of success comparing with their competitors. Most importantly, the proposal model adopts a pragmatic approach and can be implemented without going through tedious mathematical calculations and analysis.
Design/methodology/approach
TAM embraces three different approaches deployed in various stages of the application process. The first stage is to identify the relevant criteria using hierarchical holographic modeling and the second stage is to assess the associated weightings of these criteria used to rate the potential competitiveness of related companies. The technique used in stage two is known as fuzzy analytic hierarchy process (FAHP) which is a combination of two well-established methods including fuzzy logic and analytical hierarchical programming. In stage three, a technique known as technique for order preference by similarity to the ideal solution (TOPSIS) is adopted to benchmark the level of competitiveness covering several companies in the same industry.
Findings
In this paper, a case study is conducted in order to validate the feasibility and practicality of the proposed model. Results indicate that TAM can be easily applied in various industrial settings by practitioners in the field for supporting operations management practices.
Research limitations/implications
Significant amount of work is needed to ensure that the proposed model can be practically deployed in real industrial settings.
Practical implications
This proposed model is able to capitalize on the benefits of the HMM, FAHP and TOPSIS methods and offset their deficiencies. Most importantly, it can be applied to various industries without complex modification.
Originality/value
This paper suggests a hybrid model to assess competitiveness level embracing three different techniques with the unique feature which is able to provide an insight for better planning and preparation in order to excel competitors. Companies may be able to follow the procedures and steps suggested in the paper to implement the model which is proven to be pragmatic and can be applied in real situations.
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In smart cities striving for innovation, development, and prosperity, hydrogen offers a promising path for decarbonization. However, its effective integration into the evolving…
Abstract
In smart cities striving for innovation, development, and prosperity, hydrogen offers a promising path for decarbonization. However, its effective integration into the evolving energy landscape requires understanding regional intricacies and identifying areas for improvement. This chapter examines hydrogen transport from production to utilization, evaluating technologies’ pros, cons, and process equations and using Analytic Hierarchy Process (AHP) as a Multi-Criteria Decision-Making (MCDM) tool to assess these technologies based on multiple criteria. It also explores barriers and opportunities in hydrogen transport within the 21st-century energy transition, providing insights for overcoming challenges. Evaluation criteria for hydrogen transport technologies were ranked by relative importance, with energy efficiency topping the list, followed by energy density, infrastructure requirements, cost, range, and flexibility. Safety, technological maturity, scalability, and compatibility with existing infrastructure received lower weights. Hydrogen transport technologies were categorized into three performance levels: low, medium, and high. Hydrogen tube trailers ranked lowest, while chemical hydrides, hydrail, liquid organic hydrogen carriers, hydrogen pipelines, and hydrogen blending exhibited moderate performance. Compressed hydrogen gas, liquid hydrogen, ammonia carriers, and hydrogen fueling stations demonstrated the highest performance. The proposed framework is crucial for next-gen smart cities, cutting emissions, boosting growth, and speeding up development with a strong hydrogen infrastructure. This makes the region a sustainable tech leader, improving air quality and well-being. Aligned with Gulf Region goals, it is key for smart cities. Policymakers, industries, and researchers can use these insights to overcome barriers and seize hydrogen transport tech opportunities.
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H.C.W. Lau, Wan Kai Pang and Christina W.Y. Wong
An organization’s supply chain is the upstream fraction of the value chain activities, aiming to ensure that the right materials, services, and technologies are purchased from the…
Abstract
An organization’s supply chain is the upstream fraction of the value chain activities, aiming to ensure that the right materials, services, and technologies are purchased from the right sources, at the right time, and in the right quality. It is essential that a company is able to utilize its supply chain with the support of a good monitoring scheme. This paper considers a framework of supply chain management embracing the principles of fuzzy logic for analyzing and monitoring performance of suppliers based on the criteria of product quality and delivery time. The proposed system recommends the quantity that should be placed in the next purchase order by indicating the possible issues to be considered prior to final confirmation with the relevant suppliers.
Details
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G.T.S. Ho, H.C.W. Lau, S.H. Chung, R.Y.K. Fung, T.M. Chan and C.K.M. Lee
This paper aims to develop a genetic algorithm (GA)‐based process knowledge integration system (GA‐PKIS) for generalizing a set of nearly optimal fuzzy rules in quality…
Abstract
Purpose
This paper aims to develop a genetic algorithm (GA)‐based process knowledge integration system (GA‐PKIS) for generalizing a set of nearly optimal fuzzy rules in quality enhancement based on the extracted fuzzy association rules in a supply chain network.
Design/methodology/approach
The proposed methodology provides all levels of employees with the ability to formulate nearly optimal sets of fuzzy rules to identify possible solutions for eliminating the number of defect items.
Findings
The application of the proposed methodology in the slider manufacturer has been studied. After performing the spatial analysis, the results obtained indicate that it is capable of ensuring the finished products with promising quality.
Research limitations/implications
In order to demonstrate the feasibility of the proposed approach, only some processes within the supply chain are chosen. Future studies can advance this research by applying the proposed approach in different industries and processes.
Originality/value
Because of the complexity of the logistics operations along the supply chain, the traditional quality improvement approaches cannot address all the quality problems automatically and effectively. This newly developed GA‐based approach can help to optimize the process parameters along the supply chain network.