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Book part
Publication date: 6 September 2019

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Experiencing Persian Heritage
Type: Book
ISBN: 978-1-78754-813-8

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Article
Publication date: 1 April 2000

H. Richter, D. Ferling, F. Buchali and W. Heck

In this paper, Substrate Integrated Packaging (SIP) based on thin film multilayer technology is presented. Coplanar waveguide feedthroughs calculated with 3D‐Finite Differential…

403

Abstract

In this paper, Substrate Integrated Packaging (SIP) based on thin film multilayer technology is presented. Coplanar waveguide feedthroughs calculated with 3D‐Finite Differential Methods were manufactured using a ceramic or silicon carrier, gold conductors and polyimide as dielectric. The substrate integrated packages were realized with metallic frames and lids mounted on the thin film circuitry. S‐parameter measurements show the superior quality of the feedthroughs. To verify the new packaging concept, a 10GHz and a 58GHz amplifier module were realized. From these modules the potential of the SIP‐technology is demonstrated.

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Microelectronics International, vol. 17 no. 1
Type: Research Article
ISSN: 1356-5362

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Book part
Publication date: 16 July 2019

Mathew Donald

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Leading and Managing Change in the Age of Disruption and Artificial Intelligence
Type: Book
ISBN: 978-1-78756-368-1

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Book part
Publication date: 6 June 2016

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Social Conflict and Harmony: Tourism in China’s Multi-Ethnic Communities
Type: Book
ISBN: 978-1-78441-356-9

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Book part
Publication date: 6 June 2016

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Social Conflict and Harmony: Tourism in China’s Multi-Ethnic Communities
Type: Book
ISBN: 978-1-78441-356-9

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Article
Publication date: 1 April 1997

H. Richter, K. Ruess, A. Gemmler and W. Leonhard

Bumping is a prerequisite forflip‐chip attachment of bare dies. For silicon semiconductors bumping is normally performedon the ICs at wafer scale. Bumping can be performed by…

176

Abstract

Bumping is a prerequisite for flip‐chip attachment of bare dies. For silicon semiconductors bumping is normally performed on the ICs at wafer scale. Bumping can be performed by micro‐plating or vacuum deposition techniques. Mechanical methods are also well known. In this paper a bumping process based on tin/lead alloy plating is reported. The plating bath presented enables the deposition of both solder compositions used for flip‐chip attachment, the eutectic and the lead‐rich. All key issues of the plating process covering plating equipment, electrolyte characteristics and plating process parameters are discussed. Methods of bump characterisation and quality assurance are reported as an important part of the bumping process. The deciding process parameters leading to high quality solder bumps are demonstrated.

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Microelectronics International, vol. 14 no. 1
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 1 March 2003

Joan Hoffman

Economic crime is too varied an activity to be explained by a single theory. Valuable insights are gained from theories that focus on individual characteristics and on the…

1263

Abstract

Economic crime is too varied an activity to be explained by a single theory. Valuable insights are gained from theories that focus on individual characteristics and on the socio‐economic context of crime, but these theories are not sufficient explanations of economically motivated crime. They are usefully supplemented by legal responsiveness theory, which focuses on the capacity of the economic system to provide legal means to adapt to economic change. This theory acknowledges the insights of chaos and cellular automata theory into the inevitable and unpredictable nature of economic change. Variation in the system's capacity for legal responsiveness to unpredicted change is hypothesized to have an impact on crime. Economic crime can be an indication of dysfunction in the adaptation systems of the economy. The concepts of ecological and evolutionary economics such as stability, resilience, connectedness and adaptation offer an approach to analyzing the systemic property of legal responsiveness.

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International Journal of Social Economics, vol. 30 no. 3
Type: Research Article
ISSN: 0306-8293

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Article
Publication date: 1 August 2006

W.K. Chiu, Y.C. Yeung and K.M. Yu

Fractal geometry can be used to model natural objects which cannot be easily represented by the euclidean geometry. However, contemporary computer‐aided design (CAD) and…

1549

Abstract

Purpose

Fractal geometry can be used to model natural objects which cannot be easily represented by the euclidean geometry. However, contemporary computer‐aided design (CAD) and computer‐aided manufacturing (CAM) systems cannot be used to model a fractal object efficiently. In a general layer manufacturing (LM) workflow, a model described by the euclidean geometry is required in order to generate the necessary toolpath information. So this workflow cannot be applied for a fractal object. In this paper, to realize the fabrication of a fractal represented object by the LM technology, a methodology is proposed.

Design/methodology/approach

In the proposed methodology, a slab grid is generated in each layer of the object and it consists of a number of pixels. The interior property (corresponding to the fractal object) of each pixel in the slab grid is checked so that slab models of the fractal are created. The boundary of each slab is traced and refined so that the toolpath of the object can be generated from these boundaries.

Findings

Applying the proposed methodology, the LM toolpath information can be extracted from the mathematical model of the fractal and the tessellating or slicing processes are not needed to be performed. The problem of representing a fractal in a CAD platform can be eliminated.

Research limitations/implications

The proposed methodology can be applied to iterative function system (IFS) or complex fractal. However, for some fractals constructed from more than one kind of fractal objects, such as multi‐IFS fractals, the methodology must be further developed.

Originality/value

The proposed methodology is a novel development for realizing the fabrication of fractal objects by the LM technology.

Details

Rapid Prototyping Journal, vol. 12 no. 4
Type: Research Article
ISSN: 1355-2546

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Available. Open Access. Open Access
Article
Publication date: 22 September 2021

Ulrica von Thiele Schwarz, Kin Andersson and Carina Loeb

The purpose is explore an approach to acquire, analyze and report data concerning an organizational change initiative that combines knowledge generation and knowledge use, and…

1433

Abstract

Purpose

The purpose is explore an approach to acquire, analyze and report data concerning an organizational change initiative that combines knowledge generation and knowledge use, and contrast that with a method where knowledge generation and use is separated. More specifically, the authors contrast a participatory group workshop with individual interviews analyzed with thematic analysis, focusing on information about the change process and its perceived practical relevance and usefulness.

Design/methodology/approach

Participants were managers responsible for implementing a broad organizational change aiming to improve service quality (e.g. access and equity) and reduce costs in a mental health service organization in Sweden. Individual interviews were conducted at two points, six months apart (i1: n = 15; i2: n = 18). Between the interviews, a 3.5-h participatory group workshop was conducted, during which participants (n = 15) both generated and analyzed data through a structured process that mixed individual-, small- and whole-group activities.

Findings

Both approaches elicited substantive information about the content, purpose and process of change. While the content and purpose findings were similar across the two data sources, the interviews described how to lead a change process, whereas the workshop yielded concrete information about what to do. Benefits of interviews included personal insights about leading change while the workshop provided an opportunity for collective sense-making.

Originality/value

When organizational stakeholders work through the change process through a participatory workshop, they may get on the same page, but require additional support to take action.

Details

Journal of Health Organization and Management, vol. 35 no. 7
Type: Research Article
ISSN: 1477-7266

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Article
Publication date: 3 February 2020

Santosh Kumar, Manoj Kumar and Neeru Jindal

This paper aims to consolidate the results of various researchers focusing the different applications, so that this paper could become the torch bearer for the futuristic…

1067

Abstract

Purpose

This paper aims to consolidate the results of various researchers focusing the different applications, so that this paper could become the torch bearer for the futuristic researchers working in the domain of cold gas dynamics spray coating.

Design/methodology/approach

A study on the cold spray coating is presented by summarizing the data present in literature. Important factors such as coating temperature, pressure, coating thickness, particle size, which affect the erosion-corrosion (E-C) resistance, physical and mechanical properties of boiler steel are stated. This paper also addresses the use of cold spray coating and compares it with other different thermal spray processes.

Findings

From the literature review, it was noticed that cold spray technology is best as compare to other thermal spray processes to reduce porosity, increase hardness, adhesion strength and retention in properties of feedstock powders.

Originality/value

Cold spray coating technology has a great potential in almost every field especially in restoration of surfaces, generation of complex surface, biomedical application, resist hot corrosion, wear, oxidation and erosion corrosion.

Details

World Journal of Engineering, vol. 17 no. 1
Type: Research Article
ISSN: 1708-5284

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