Search results

The purpose of this study is to offer the advanced leadless leadframe package which achieve small form factor and high thermal and electrical performance, according to the continuous market requirement. Because of demand and trends, new package structures that can accommodate many pins (I/Os) while maintaining the excellent thermal and electrical properties of the leadframe package was studied. Different from conventional leadframe and laminate packages, it must have the large-exposed pad for thermal dissipation and design flexibility to deploy signal, ground and power selectively.

In this study, the routable molded leadframe (rtMLF®) package applying the pre-resin MLF substrate was introduced. The structural advantages, in terms of design flexibility, were checked by adopting the specific electrical feature. Also, the excellence of thermal and electrical performance was confirmed by simulation. The sample was manufactured, and its package robustness was validated by reliability test.

rtMLF package that enables one layer substrate but routable pattern on top layer differently from existing leadframe package was developed and studied if it overcome the limitations of leadframe and laminate products. Asymmetric land layout was designed and special features to keep electrical interference was applied to prove design flexibility. The thermal and electrical simulation has been executed to check the advantages. And key differentiations were identified. Finally, actual sample was manufactured, and structural robustness was validated by package level and board level reliability.

The differentiation of new semiconductor package was introduced and its excellence was verified by electrical and thermal simulation as well as reliability test. It is expected to be adopted for alternative solutions not covered by the existing products.

Due to the complexity of and variations in additive manufacturing (AM) processes, there is a level of uncertainty that creates critical issues in quality assurance (QA), which must be addressed by time-consuming and cost-intensive tasks. This deteriorates the process repeatability, reliability and part reproducibility. So far, many AM efforts have been performed in an isolated and scattered way over several decades. In this paper, a systematically integrated holistic view is proposed to achieve QA for AM.

A systematically integrated view is presented to ensure the predefined part properties before/during/after the AM process. It consists of four stages, namely, QA plan, prospective validation, concurrent validation and retrospective validation. As a foundation for QA planning, a functional workflow and the required information flows are proposed by using functional design models: Icam DEFinition for Function Modeling.

The functional design model of the QA plan provides the systematically integrated view that can be the basis for inspection of AM processes for the repeatability and qualification of AM parts for reproducibility.

A powder bed fusion process was used to validate the feasibility of this QA plan. Feasibility was demonstrated under many assumptions; real validation is not included in this study.

This study provides an innovative and transformative methodology that can lead to greater productivity and improved quality of AM parts across industries. Furthermore, the QA guidelines and functional design models provide the foundation for the development of a QA architecture and management system.

This systematically integrated view and the corresponding QA plan can pose fundamental questions to the AM community and initiate new research efforts in the in-situ digital inspection of AM processes and parts.