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Article
Publication date: 1 April 1988
An efficient method is shown to calculate the temperature distribution and the thermal coupling elements in integrated circuits. With that it is possible to treat circuits under…
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Abstract
An efficient method is shown to calculate the temperature distribution and the thermal coupling elements in integrated circuits. With that it is possible to treat circuits under nonisothermal conditions. The algorithm combines several methods of the three‐dimensional solution of the FOURIER equation to analyse real heat problems of integrated circuits in a short computation time. Some examples illustrate the application of the algorithm.