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CEMEX 94 ‐As requested by the 1992 Annual General Meeting, the CEMA Management Committee has been considering a number of options for the next CEMEX show, to be held in 1994.

Now formed for almost two years, the Brazilian Printed Circuit Association, ABRACI (Associação Brasileira de Circuitos Impressos), held on 17–18 September 1987 at Curitiba its first seminar on printed circuit technology. The association, with 150 members, is going from strength to strength and the 1987 Seminar was attended by 250 persons from several states. Participants included representatives from well known international companies (Du Pont, Degussa, IBM, Unisys, etc.), Government, Universities and local companies. The programme of 16 papers was divided into four sessions: Market, Quality, Manufacturing and SMT. The two‐day event proved too short for the enthusiasm of participants.

A dramatic growth‐rate is envisaged in the next decade in the demands on the integrated circuit industry, posing the question of the necessity for new techniques. Present technology does not lend itself to continued linear extension, and new semiconductor package types of increasing complexity require purpose designed interconnection systems. Tape Automated Bonding and Leadless Chip Carriers are currently becoming fairly widely used alternatives, while emphasis is being placed on developing the surface attachment concept. Potential problem areas centre around the cost of interconnections, which is closely dependent on their density; the heat dissipation properties of substrates encountering considerable heat generation from complex circuits; flexibility of design, and faster design time and delivery requirements. However, printed circuit technology is assured a healthy future provided that adjustments are made and experiments undertaken, such as those involving thick film hybrid technology, the use of porcelainised steel substrates, and the Lampac, Pactel and Microwire techniques for high density interconnection systems supported on metal planes.

Bepi Matrix Systems, Galashiels, Scotland, organised a Multiwire Conference held on 28th and 29th September 1987 which aimed to bring together current and potential Multiwire users to hear a number of presentations by speakers from the US, Japan and the UK. The papers given focused on Multiwire's technical advantages and the latest manufacturing techniques used with this discrete wiring technology.

The following is a summary of the reports sent to those members participating in the various statistical surveys running at present.

During the first half of this year the Association has continued to expand its exhibition programme by increasing its presence at overseas shows. Two DTI sponsored joint venture groups have been formed, one to Nepcon West, the other to Nepcon Beijing. Anaheim saw the biggest UK group for over 10 years, with CEMA taking three separate blocks in different sectors of the show. There is no doubt from the reception we received that CEMA is now firmly established at Nepcon West. We enjoyed tremendous support from both the British Consulate and the British‐American Chamber of Commerce with their President making several visits to the CEMA booth.

The Palexpo Exhibition and Conference Centre close to Geneva Airport was the location for this timely event organised by the EIPC and sponsored by Du Pont Electronics. Participants, including speakers, chairpersons and press, totalled approximately 190—perhaps a slightly lower figure than anticipated for this first European symposium on an issue of considerable significance for the industry.

On 18 March the LA/Ventura Chapter featured the subject of ‘Proposition 65 and AB 2185/2187. Keynote speaker was Barry Groveman, former Deputy Attorney, Chief Environmental Prosecutor, LA City and County Chairman, LA County Bar, Environmental Law Section.

The ISHM CAN‐AM Chapter recently organised a half‐day programme of paper presentations followed by a tour of a local hybrid facility. The event took place on 26 April at the Holiday Inn, Montreal (Pointe Claire), Quebec, with the theme of the papers concentrating on advances in hybrid manufacturing processes and some coverage of SMT.

Printed Circuit World Convention IV, which took place at the Tokyo Prince Hotel, Tokyo, Japan, from 2–5 June 1987, will be reported in two parts. Part 1, in this issue, covers an introduction to the event, the Opening Ceremony, Social and Accompanying Spouse Programmes, Closing Ceremony and some reflections on peripheral activities. In Part 2, in the next issue, a report on the technical sessions will be published, focusing on the highlights of the technical programme.