To enable adequate transfer of heat from a hybrid circuit in many cases the substrate is attached to a heatsink. This paper examines the two principal means of calculating the…
Abstract
To enable adequate transfer of heat from a hybrid circuit in many cases the substrate is attached to a heatsink. This paper examines the two principal means of calculating the dispersion and transfer of heat generated by active elements on the surface when both thin and thick film techniques are employed. The paper concludes by presenting formulae for making the relevant thermal resistance calculations.
Brian Waterfield, G. Kersuzan and Boguslaw Herod
The Benelux chapter has made a habit of organising meetings with a scientific and commercial accent more or less alternately. This approach has proven to be successful in the past…
Abstract
The Benelux chapter has made a habit of organising meetings with a scientific and commercial accent more or less alternately. This approach has proven to be successful in the past three years. The 1986 Autumn meeting will be another display meeting. A number of papers will be presented by suppliers of materials and equipment for the hybrid and surface mounting industry. In a 300 m2 exhibition room about 25 companies will display their products. The programme of the day leaves ample opportunity for meeting colleagues and suppliers. The meeting will be held in the ‘Jaarbeurs Vergadercentrum’ in Utrecht on 16 October from 9.30–17.00. The annual ISHM‐Benelux general membership meeting will precede the lectures.
C. Val, G. Kersuzan and B. Dreyfus‐Alain
The ‘chip carrier’ or CC is an intermediate support, hermetically sealed or otherwise, (of alumina, beryllium oxide or plastic) requires to connect an integrated circuit chip with…
Abstract
The ‘chip carrier’ or CC is an intermediate support, hermetically sealed or otherwise, (of alumina, beryllium oxide or plastic) requires to connect an integrated circuit chip with numerous output pins to the outside world. This carrier at present represents the best compromise in terms of technology and economy, because of the use of standard multi‐source chips and the simple testing it permits.
G. Kersuzan, Nigel Batt, Brian Waterfield, Hamish Law, B. Herod, M.A. Whiteside and Nihal Sinnadurai
The International Electronic Components Show in Paris in November, 1983, provided the occasion for a very successful meeting of ISHM‐France which attracted 170 attendees. The…
Abstract
The International Electronic Components Show in Paris in November, 1983, provided the occasion for a very successful meeting of ISHM‐France which attracted 170 attendees. The following presentations were given:
Marc Monneraye, Panizza, Brian Waterfield, John Knowles and P.L. Bainbridge
A month or so after the Stresa meeting, the French ISHM chapter, organising a session on ‘Gallic inks’ (!), summoned me to deliver some comments on the 5th European Hybrid…
Abstract
A month or so after the Stresa meeting, the French ISHM chapter, organising a session on ‘Gallic inks’ (!), summoned me to deliver some comments on the 5th European Hybrid Microelectronics Conference. Although it was only a matter of interlude during this technical session, I felt the task quite a difficult one. It became a hazardous project when Brian C. Waterfield kindly asked me to let what is in fact a personal opinion—my personal opinion, standing back from my daily work—appear in Hybrid Circuits. I'll do my best.
Nihal Sinnadurai, G. Kersuzan, B.S. Sonde, Boguslaw Herod, Brian C. Waterfield, J.B. Knowles and M.A. Stein
I was an invited speaker to the ISHM‐Benelux meeting. As I arrived early, I also sat in on the committee meeting as an observer. Jos B. Peeters was the outgoing president and the…
Abstract
I was an invited speaker to the ISHM‐Benelux meeting. As I arrived early, I also sat in on the committee meeting as an observer. Jos B. Peeters was the outgoing president and the incoming committee was widened to about 15 members compared with the previous 6. Following the unanimous election of all those nominated, the committee reconvened and elected Mr Kwikkers as the new president of ISHM‐Benelux. He is a professor at the Technische Hogeschole in Delft.
C. Zardini, J.D. Pistre, F. Rodes and J.L. Aucouturier
Water cooling of hybrid modules allows a power dissipation much higher than that of conventional methods. This paper describes the design and construction of a copper‐clad Invar…
Abstract
Water cooling of hybrid modules allows a power dissipation much higher than that of conventional methods. This paper describes the design and construction of a copper‐clad Invar water‐cooled hybrid power circuit intended for use in a medical hand‐held tool which is a 25 mm diameter cylinder. The thermal study demonstrates the interest of a copper‐clad Invar heat exchanger: water flowing at a rate lower than 15 Ih−1 allows the dissipation of more than 50 W in the module while keeping the external temperature of the tool below 35°C.
T. Kwikkers, J. Lantaires, R.B. Turnbull, H.T. Law, Barry George and Dave Savage
On 20 April ISHM‐Benelux held its 1988 Spring meeting at the Grand Hotel Heerlen. This meeting was totally devoted to implantable devices, in particular to the technologies used…
Abstract
On 20 April ISHM‐Benelux held its 1988 Spring meeting at the Grand Hotel Heerlen. This meeting was totally devoted to implantable devices, in particular to the technologies used for these high reliability, extremely demanding devices. For this meeting ISHM‐Benelux was the guest of the Kerkrade facility of Medtronic. Medtronic (headquartered in Minneapolis, USA) is the world's leading manufacturer of implantable electronic devices. Apart from the assembly of pacemakers and heart‐wires, the Kerkrade facility acts as a manufacturing technology centre for Medtronic's European facilities.
Dates: 29–31 May 1991 Venue: De Doelen Conference Centre, Rotterdam, The Netherlands The Benelux Chapter of the International Society for Hybrid Microelectronics will be…
Abstract
Dates: 29–31 May 1991 Venue: De Doelen Conference Centre, Rotterdam, The Netherlands The Benelux Chapter of the International Society for Hybrid Microelectronics will be organising the 8th European Microelectronics Conference. The event will take place at ‘De Doelen’, Rotterdam, The Netherlands, from 29 to 31 May 1991.
Drive east from Frankfurt, upstream along the valley of the River Main, and in 25 kilometres or so you will reach Hanau, where once the brothers Grimm lived and collected the…
Abstract
Drive east from Frankfurt, upstream along the valley of the River Main, and in 25 kilometres or so you will reach Hanau, where once the brothers Grimm lived and collected the folklore which we now know as the famous Tales. Here too, in 1856, Wilhelm Carl Heraeus, a chemist and pharmacist, proprietor of the pharmacy which had carried the family name for many generations, succeeded in producing temperatures approaching 2000°C from an oxy‐hydrogen flame, temperatures sufficiently high to achieve the melting point of platinum and to allow him to melt substantial quantities of this metal for the first time. Hanau was then a centre for the jewellery manufacturing industry (and remains so today) so the smelting of platinum and other precious metals had an immediate commercial relevance.