Search results

1 – 1 of 1
Per page
102050
Citations:
Loading...
Access Restricted. View access options
Article
Publication date: 1 December 2001

G. Kaltenpoth, W. Siebert, X‐M. Xie and F. Stubhan

Flip chip test boards with and without plasma enhanced chemical vapor deposition silicon nitride moisture barrier coatings were exposed to high humidity and temperature cycling…

360

Abstract

Flip chip test boards with and without plasma enhanced chemical vapor deposition silicon nitride moisture barrier coatings were exposed to high humidity and temperature cycling conditions. The effect of the stress developed in these environments was investigated and evaluated. The influence of the barrier layers on the extent of underfill delamination and degradation in flip chip assemblies was inspected by C‐mode Scanning Acoustic Microscopy. The moisture barrier layers studied show their potential to enhance the reliability of flip chip assemblies in humid environments.

Details

Soldering & Surface Mount Technology, vol. 13 no. 3
Type: Research Article
ISSN: 0954-0911

Keywords

1 – 1 of 1
Per page
102050