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Article
Publication date: 26 January 2023

Fenglian Wang, Qing Su and Zongming Zhang

This study is aimed at making an inspection of the effects of collaborative innovation network characteristics on firm innovation performance, and the intermediary roles of…

850

Abstract

Purpose

This study is aimed at making an inspection of the effects of collaborative innovation network characteristics on firm innovation performance, and the intermediary roles of knowledge transfer efficiency is taken into account.

Design/methodology/approach

This study used a convenient sampling method to obtain population and samples. Using data obtained by publishing online and paper questionnaires, and using on-site interviews in Anhui Province in the Yangtze River Delta region of China, descriptive analysis, regression analysis and correlation analysis are utilized to study the direct influence of collaborative innovation network characteristics on knowledge transfer efficiency as well as firm innovation performance, and the intermediary roles of knowledge transfer efficiency on firm innovation performance, respectively. In this study, 3,000 questionnaires were distributed to the employees of enterprises engaged in research and development (R&D) activities, of which 2,560 were valid. With the help of SPSS24.0 software, the reliability and validity of the questionnaire was analyzed.

Findings

The results are indicative of that network centrality and relationship strength positively affect knowledge transfer efficiency and firm innovation performance. Nevertheless, network scale has no significant correlation with knowledge transfer efficiency and enterprise innovation performance. In addition, knowledge transfer efficiency is an intermediary between collaborative innovation network characteristics and enterprise innovation performance, and positively affects enterprise innovation performance, which demonstrated that managers should take advantage of collaborative innovation network characteristics to elevate knowledge transfer efficiency because well-realized transferals of knowledge can help accelerate the coordination of resources in knowledge, and finally bring about the advancement of firm's innovation abilities and performance.

Research limitations/implications

There are few previous studies that fully examined the relationships among collaborative innovation network characteristics, knowledge transfer efficiency and firm innovation performance. This paper developed previous researches on the relationships between collaborative innovation network characteristics, knowledge transfer efficiency and firm innovation performance. The mediation of knowledge transfer efficiency on the relationship between collaborative innovation network characteristics and firm innovation performance is analyzed. Further, studies on collaborative innovation network characteristics using data obtained from employees engaged in R&D activities are very limited in the literature. On account of that, the findings in this study may make sense to the innovation ability of innovative enterprise and expand the literature in the field of enterprise strategic management and knowledge management.

Practical implications

This analysis shows that collaborative innovation network characteristics have both positive and negative effects on firm innovation performance. Therefore, business managers should pay attention to their position in the collaborative innovation network and maintain the relationship strength with other innovation subjects. Special consideration should be given to the knowledge transfer of innovative enterprises, so as to improve firm innovation performance practically.

Originality/value

The study may provide additional understandings for researchers, government managers, universities and enterprises with regard to strategic management from the visual angle of innovation ecosystems. It is instrumental in the exploration of the mechanisms enabling firm innovation performance.

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Article
Publication date: 29 August 2024

Maochun Zhou and Yuhua Niu

The purpose of this study is to examine the impact of cross-ownership on corporate digital innovation and their specific mechanisms. Cross-ownership, who hold equity in two or…

73

Abstract

Purpose

The purpose of this study is to examine the impact of cross-ownership on corporate digital innovation and their specific mechanisms. Cross-ownership, who hold equity in two or more companies simultaneously, have two different types of governance effects in the capital market: governance synergistic effects and competitive collusion effects.

Design/methodology/approach

This paper uses a panel model, selecting A-share company data from 2011 to 2021 in China. In total, 23,853 valid data were obtained, which came from the CSMAR database and Wind database. For some missing data, they were manually supplemented by consulting the company's annual report and Sina Finance. Data processing was conducted using EXCEL and Stata16.0 software.

Findings

The results show that cross-ownership promote corporate digital innovation by leveraging governance synergies. Further grouping tests show that the synergistic effects of cross-ownership are significant in non-state-owned, high-tech, weakly competitive and higher analyst attention enterprises. Mechanism testing shows that cross-ownership can empower corporate digital innovation in three ways: reducing information asymmetry, alleviating financing constraints and improving corporate governance.

Originality/value

The conclusion of this paper provides new empirical evidence for a comprehensive understanding of the role of cross-ownership in corporate development, enriches the economic consequences research of chain institutional investors in China and broadens the research perspective of corporate digital innovation. It also provides important references for the digital transformation of enterprises and the healthy development of the capital market.

Details

Business Process Management Journal, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 1463-7154

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Article
Publication date: 23 August 2021

Xiuqi Wang, Fenglian Sun, Bangyao Han, Yilun Cao, Jinyang Du, Long Shao and Guohuai Liu

The purpose of this paper is to investigate the wetting behaviors of Sn-5Sb-CuNiAg solders on copper substrates in different soldering processes and the effects of alloying…

176

Abstract

Purpose

The purpose of this paper is to investigate the wetting behaviors of Sn-5Sb-CuNiAg solders on copper substrates in different soldering processes and the effects of alloying elements on the wettability.

Design/methodology/approach

Sn-5Sb-CuNiAg solder balls (750 µm in diameter) were spread and wetted on 40 × 40 × 1 mm copper plates, in different fluxes, soldering temperatures and time. The contact angles were obtained by a home-made measuring instrument. The samples were polished and deep etched before analyzed by scanning electron microscopy. Energy dispersive X-ray spectroscopy was used to identify the composition of the joints.

Findings

The effects of different soldering processes and alloying elements on the wetting behaviors of Sn-5Sb-CuNiAg solders on copper substrates were calculated and expounded. The rosin-based flux could effectively remove oxidation layers and improve the wettability of Sn-5Sb-CuNiAg solders. Then with the increase of soldering temperature and time, the contact angles decreased gradually. The soldering processes suited for Sn-5Sb-CuNiAg solders were RMA218, 280°C and 30 s. Considered the effects of alloying elements, the wettability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag was relatively favorable on copper substrates. Besides, Ni could accumulate at the solder/Cu interface and form a jagged (Cu,Ni)6Sn5 IMC.

Originality/value

This work was carried out with our handmade experiment equipment and the production of the quinary lead-free solder alloy used in wetting tests belongs to us. The investigated Sn-5Sb-CuNiAg alloys exhibited higher melting point and preferable wettability, that was one of the candidates for high-temperature lead-free solders to replace high-Pb solders, and applied extremely to high temperature and frequency working environments of the third-generation semiconductors components, with a greater potential research and development value.

Details

Soldering & Surface Mount Technology, vol. 34 no. 2
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 18 March 2022

Bangyao Han, Fenglian Sun, Chi Zhang and Xinlei Wang

This paper aims to investigate the effect of the Cu, Ni and Ag addition in Sn5Sb-based alloy on the mechanical properties and its mechanism.

118

Abstract

Purpose

This paper aims to investigate the effect of the Cu, Ni and Ag addition in Sn5Sb-based alloy on the mechanical properties and its mechanism.

Design/methodology/approach

The micro-indentation, creeping test of the Cu/Sn5Sb–0.5Cu–0.1Ni–0.5Ag/Cu and Cu/Sn–5Sb/Cu were conducted, and its microstructure was analysed. The scanning electron microscope and the metallographic microscope characterized the microstructure of the Sn5Sb–0.5Cu–0.1Ni–0.5Ag/Cu and Sn–5Sb/Cu joints.

Findings

The microstructure of Cu/Sn5Sb–0.5Cu–0.1Ni–0.5Ag/Cu is distributed with the fine (Cu,Ni)6Sn5 and Ag3Sn intermetallic compounds (IMCs), whereas the Cu6Sn5 and Sn3Sb2 in Cu/Sn–5Sb/Cu is larger and far more less. This investigation reveals that the addition of the Cu, Ni and Ag elements reinforced mechanical properties and provided a technical basis for the development of Sn–Sb alloy with good mechanical properties.

Originality/value

This paper reveals that the hardness and the modulus of the bulk solder Cu/Sn–5Sb/Cu solder joints were improved with the addition of Cu, Ni and Ag trace elements. Meanwhile, the creep resistance and plasticity were also improved. This study has a great value for exploring high-performance Sn–Sb based solder alloy and has proved an example.

Details

Soldering & Surface Mount Technology, vol. 34 no. 5
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 3 April 2017

Yan Zhu and Fenglian Sun

The purpose of this paper is to investigate the effect of geometric size on intermetallic compound (IMC) growth and elements diffusion of Cu/Sn/Cu solder joint and establish the…

203

Abstract

Purpose

The purpose of this paper is to investigate the effect of geometric size on intermetallic compound (IMC) growth and elements diffusion of Cu/Sn/Cu solder joint and establish the correlation model between the thickness of the IMC layer and size of the solder joint on the dozens of microns scale.

Design/methodology/approach

The sandwich-structured Cu/Sn/Cu solder joints with different gaps between two copper-clad plates (δ) are fabricated using a reflow process. The microstructure and composition of solder joints are observed and analyzed by scanning electron microscopy.

Findings

After reflow, the thickness of the IMC and Cu concentration in solder layers increase with the reduction of δ from 50, 40, 30, 20 to 10 μm. During isothermal aging, the thickness of the IMC fails to increase according to the traditional parabolic rule due to changes in Cu concentration. The reduction of δ is the root cause of changes in Cu concentration and the growth rule of the IMC layer. A correlation model between the thickness of the IMC layer and δ is established. It is found that the thickness of the IMC layer is the function of aging time and δ. With δ reducing, the main control element of IMC growth transfers from Cu to Sn.

Originality/value

This paper shows the changes of IMC thickness and elements concentration with the reduction of the size of solder joints on the dozens of microns scale. A correlation model is established to calculate the thickness of the IMC layer during aging.

Details

Soldering & Surface Mount Technology, vol. 29 no. 2
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 14 April 2022

Meng Xu, Fenglian Sun, Zhen Pan and Yang Liu

The purpose of this paper is to study the temperature cycling reliability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu micro solder joints compared with Sn-5Sb/Cu and SAC305/Cu micro solder…

129

Abstract

Purpose

The purpose of this paper is to study the temperature cycling reliability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu micro solder joints compared with Sn-5Sb/Cu and SAC305/Cu micro solder joints, which has important engineering and theoretical significance for the research of micro solder joint reliability. This paper also aims to provide guidance for the selection of solder for third-generation semiconductor power device packaging.

Design/methodology/approach

The shear strength, plasticity, bulk solder hardness and creep performance of three kinds of micro solder joints before and after temperature cycling were studied by nanoindentation and micro shear experiments. Scanning electron microscopy and energy dispersive spectrometry were used to analyze the fracture mode, fracture position and compound composition of the solder joints.

Findings

The bulk solder hardnesses and shear strengths of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu solder joints were higher than those of Sn-5Sb/Cu and SAC305/Cu solder joints before and after temperature cycling. The indentation depth, creep displacement and creep rate of bulk solders of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu solder joints were the smallest compared with those of Sn-5Sb/Cu and SAC305/Cu solder joints after the same number of cycles. In addition, the fracture mode and fracture position of the micro solder joints changed before and after temperature cycling.

Originality/value

A new type of solder was developed with excellent temperature cycling performance.

Details

Soldering & Surface Mount Technology, vol. 35 no. 1
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 3 April 2017

Gaofang Ban, Fenglian Sun, Yang Liu and Shaonan Cong

The purpose of this paper is to focus on the fabrication of SnAgCu (SAC) nanocomposites solder and study the effect of Cu nanopowders (nano-Cu) addition on the microstructure…

132

Abstract

Purpose

The purpose of this paper is to focus on the fabrication of SnAgCu (SAC) nanocomposites solder and study the effect of Cu nanopowders (nano-Cu) addition on the microstructure evolution of resultant nanocomposite solder after reflow and thermal aging.

Design/methodology/approach

Mechanical mixing is used in this work to incorporate nanoparticles into the solder and produce more homogeneous mixture. Standard metallographic procedures are applied for microstructural analysis of solder joints.

Findings

It is found that nano-Cu doped into Sn0.7Ag0.5Cu-BiNi solder has no appreciable influence on melting temperature of the composite solder. The addition of Cu nanoparticles refines the microstructure of bulk solder and suppresses the growth of interfacial intermetallic compound (IMC) layers. However, interfacial IMC grain size increases slightly after 1.0 per cent nano-Cu added.

Originality/value

The paper demonstrates a method of nano-composite solder paste preparation by means of mechanical mixing and a comparison study of the microstructure evolution of composite solder with the basic SAC solder.

Details

Soldering & Surface Mount Technology, vol. 29 no. 2
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 14 February 2018

Zuozhu Yin, Fenglian Sun, Yang Liu and Yang Liu

The purpose of this paper is to investigate growth kinetics of interfacial Cu-Sn intermetallic compound (IMC) at the solid Cu/liquid Sn interface.

246

Abstract

Purpose

The purpose of this paper is to investigate growth kinetics of interfacial Cu-Sn intermetallic compound (IMC) at the solid Cu/liquid Sn interface.

Design/methodology/approach

The Sn/Cu solid–liquid interfacial IMCs are fabricated under various soldering temperatures (240°C-270°C) and soldering times (5-240 s) by dipping method. The thickness and morphology of IMC are observed and analyzed by the optical microscope and scanning electron microscope.

Findings

Holding at 260°C, Cu/Sn solid–liquid interface Cu6Sn5 growth index experience a change from 0.08 to 0.30 within 10-190 s. The growth index is 0.08 in 10-40 s; the growth index is 0.30 in 40-190 s. Cu6Sn5 grain coarsening index is constant within 10-190 s. It is 0.13. The result of the index of Cu6Sn5 grain coarsening is different from predecessors 27 results Cu6Sn5 grain coarsening index for 1/3. This is because Cu6Sn5 grain grows at the expense of its near small grain to reduce the surface Gibbs free energy, and its morphology changes from regular shape to irregular shape. It sets up the mathematical expression about the initial formation time and temperature of Cu3Sn in 240°C-270°C.

Originality/value

It obtains a mathematical model to express the changes of solid–liquid interface frontier concentration which has an effect on the interfacial Cu6Sn5 layer growth index and the Cu6Sn5 grain coarsening index. Different indexes can be obtained by establishing relevance equations, which can be used to predict the growth of the interface IMC layer. This mathematical model is established to design the solder pads and the sizes of the solder joints.

Details

Soldering & Surface Mount Technology, vol. 30 no. 3
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 3 October 2019

Bangyao Han, Fenglian Sun, Tianhui Li and Yang Liu

The purpose of this paper is to investigate the morphology evolution and the composition transformation of Au-Sn intermetallic compounds (IMCs) of the new…

97

Abstract

Purpose

The purpose of this paper is to investigate the morphology evolution and the composition transformation of Au-Sn intermetallic compounds (IMCs) of the new Au/Sn-5Sb-1Cu-0.1Ni-0.1Ag/(Au)Ni solder joint during the high temperature aging.

Design/methodology/approach

Sn-5Sb-1Cu-0.1Ni-0.1Ag solder balls (500 µm in diameter), heat sink with structure of 7.4 µm Au layer on 5 µm Ni-plated Cu alloy and Si chip with 5.16 µm plated Au were used to fabricate micro-solder joints. The joints were performed in a furnace at 150°C for 150, 250 and 350 h aging. The samples were polished and deep etched before analyzed by metallographic microscope and scanning electron microscopy, respectively. Energy dispersive x-ray spectroscopy was used to identify the composition of the IMCs.

Findings

ß-(Au,Ni,Cu)10Sn phase is formed during the soldering process. The IMCs evolution has two periods during the aging. The first is the ξ-(Au,Ni,Cu)5Sn, ξ-(Au,Cu)5Sn and δ-AuSn were formed and grew to form a full-compound joint after about 150 h aging. The second is the conversion of the full-compound joint. The IMCs converted to ξ′ phase when the aging time extends to 250 h, and transformed to ε-(Au,Ni,Cu)Sn2 and η-(Au,Ni,Cu)Sn4 after 350 h aging. The thicker gold layer and thinner solder joint can promote the growth of the IMCs. ß-(Au,Ni,Cu)10Sn emerged in Au/SnSb-CuNiAg/(Au)Ni in this research, which is not usually found.

Originality/value

The results in this study have a significant meaning for the application of the new Sn-5Sb-1Cu-0.1Ni-0.1Ag in harsh conditions.

Details

Soldering & Surface Mount Technology, vol. 32 no. 2
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 4 October 2021

Zhen Pan and Fenglian Sun

The purpose of this paper is to design a novel die-attach composite joint for high-temperature die-attach applications based on transient liquid phase bonding. Moreover, the…

128

Abstract

Purpose

The purpose of this paper is to design a novel die-attach composite joint for high-temperature die-attach applications based on transient liquid phase bonding. Moreover, the microstructure, shear strength, electrical property, thermal conductivity and aging property of the composite joint were investigated.

Design/methodology/approach

The composite joint was made of microporous copper and Cu3Sn. Microporous copper was immersed into liquid Sn to achieve Sn-microporous copper composite structure for die attachment. By the thermo-compression bonding, the Cu3Sn-microporous copper composite joint with a thickness of 100 µm was successfully obtained after bonding at 350 °C for 5 min under a low pressure of 0.6 MPa.

Findings

After thermo-compression bonding, the resulting interconnection could withstand a high temperature of at most 676 °C, with the entire Sn transforming into Cu3Sn with high remelting temperatures. A large shear strength could be achieved with the Cu3Sn-microporous copper in the interconnections. The formed bondlines demonstrated a good electrical and thermal conductivity owing to the large existing amount of copper in the interconnections. Furthermore, the interconnection also exhibited excellent reliability under high temperature aging at 300 °C.

Originality/value

This die-attach composite joint was suitable for power devices operating under high temperatures or other harsh environments.

Details

Soldering & Surface Mount Technology, vol. 34 no. 3
Type: Research Article
ISSN: 0954-0911

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