Engineers working in an electronics assembly environment require an ability to evolve new solutions to problems and new products. How is this ‘know‐how’ acquired?
Design for manufacture and testability seems to be a very hot topic. This seminar organised by Bob Willis was over‐subscribed within the first two weeks of announcement, and the…
Abstract
Design for manufacture and testability seems to be a very hot topic. This seminar organised by Bob Willis was over‐subscribed within the first two weeks of announcement, and the standby places were already sufficient to warrant a repeat seminar during September. This will be held in Chelmsford on 9 September.
Greatest…. largest…. highest…. best…. are some of the words that spring to mind when thinking of this year's SMART tour to Nepcon West. We have become used to smooth running SMART…
Abstract
Greatest…. largest…. highest…. best…. are some of the words that spring to mind when thinking of this year's SMART tour to Nepcon West. We have become used to smooth running SMART events, and although a number of members contributed in no small measure to the success of the tour, special mention has to be made of the effort put in by Tony Gordon to ensure a successful trip.
The SMART Group Aims to Promote the Advancement of the Electronics Manufacturing Industry through the Education, Training and Notification of its Members in Surface Mount and…
Abstract
The SMART Group Aims to Promote the Advancement of the Electronics Manufacturing Industry through the Education, Training and Notification of its Members in Surface Mount and Related Assembly Technologies, and by the Promotion of a Community of Electronics Manufacturing Professionals.
This design‐based seminar was aimed at broadening the horizons of designers and engineers. The greatest area of cost reduction in any electronics project is in making the right…
Abstract
This design‐based seminar was aimed at broadening the horizons of designers and engineers. The greatest area of cost reduction in any electronics project is in making the right choices at the conception and design phases. This seminar was one step in this direction: a piece of 1·6 mm FR‐4 is not always the best substrate to use.
The SMART Group has been investigating joining methods for ball grid arrays (BGAs). Originally a development of IBM, and expected to be a dominant packaging technology, the BGA is…
Abstract
The SMART Group has been investigating joining methods for ball grid arrays (BGAs). Originally a development of IBM, and expected to be a dominant packaging technology, the BGA is best visualised as a legless PGA. It has the same advantages—high lead count, wide pitch, small area—but does not need holes. The problem of the BGA is that the interconnects are not visible. This places a high demand on process control and material selection — it really is a case of ‘right first time’. The investigation concentrated on this aspect.
This conference, in the series being run by the National Physical Laboratory to help the electronics assembly industry consider the problems of CFC phase‐out, was essentially an…
Abstract
This conference, in the series being run by the National Physical Laboratory to help the electronics assembly industry consider the problems of CFC phase‐out, was essentially an updated repeat of the event held on 30 April, which had been a complete, standing‐room‐only sell‐out. Surprisingly, this repeat performance also attracted a full house and the format used has proved to be the most popular of all the NPL non‐CFC options conferences.