Search results

1 – 10 of 25
Per page
102050
Citations:
Loading...
Access Restricted. View access options
Article
Publication date: 1 December 1999

Dongkai Shangguan

Understanding crack growth in solder joints is important for predicting the fatigue life of solder interconnects. In this paper, crack propagation in solder joints made of two…

641

Abstract

Understanding crack growth in solder joints is important for predicting the fatigue life of solder interconnects. In this paper, crack propagation in solder joints made of two solder alloys, 62Sn/36Pb/2Ag (by weight), a commonly used solder paste for SMT reflow applications, and 96.5Sn/3.5Ag (by weight), a lead‐free solder alloy, was examined during thermal cycling. Based on these observations, the rate of crack propagation was estimated. Microstructural changes in the solder during thermal cycling were also studied.

Details

Soldering & Surface Mount Technology, vol. 11 no. 3
Type: Research Article
ISSN: 0954-0911

Keywords

Access Restricted. View access options
Article
Publication date: 1 February 2013

Hao Yu and Dongkai Shangguan

As a literature review article, the purpose of this paper is to highlight the intricate interaction and correlation between the interconnection microstructure and the failure…

372

Abstract

Purpose

As a literature review article, the purpose of this paper is to highlight the intricate interaction and correlation between the interconnection microstructure and the failure mechanism. It is therefore critical to summarize all the challenges in understanding solder solidification of interconnections.

Design/methodology/approach

Literature review.

Findings

Solidification of solder interconnections is therefore critical because it is the process during which the solder interconnection is formed. The as‐solidified microstructure serves as the starting point for all failure modes. Because of the miniaturization of electronics, the interconnection size decreases continuously, already to such a range that solder solidification takes place remarkably differently from the bulk ingot, on which solidification studies have been focused for decades. There are many challenges in understanding the solidification of tiny solder interconnections, including the complex metallurgical system, dynamic solder composition, supercooling and actual solidification temperature, localized temperature field, diverse interfacial IMC formation, and so on, warranting further research investment on solder solidification.

Originality/value

This paper provides a critical overview of the concerns in solidification study for lead‐free solder interconnection. It is probably an article initiating more attention towards solidification topics.

Details

Soldering & Surface Mount Technology, vol. 25 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

Available. Content available
Article
Publication date: 1 April 2006

Bob Willis

88

Abstract

Details

Soldering & Surface Mount Technology, vol. 18 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Access Restricted. View access options
Article
Publication date: 10 April 2009

Jennifer Nguyen, David Geiger, Dan Rooney and Dongkai Shangguan

The purpose of this paper is to consider PTH solder joint reliability, particularly on the PTH solder joints with partial hole‐fill and without pin protrusion. Also, the impact of…

450

Abstract

Purpose

The purpose of this paper is to consider PTH solder joint reliability, particularly on the PTH solder joints with partial hole‐fill and without pin protrusion. Also, the impact of voiding on the solder joint reliability is discussed.

Design/methodology/approach

Thermal cycling tests for samples of different hole‐fill percentages and voiding were conducted, and cross‐sections of the PTH solder joints were performed to evaluate the solder microstructure, intermetallic formation, via hole‐fill, and the condition of the PTH metallization and PCB dielectric prior to thermal cycling and at different times during thermal cycling.

Findings

Different failure mechanisms were observed for solder joints with and without pin protrusion. PTH components with pin protrusion had better through hole‐fill and less voids than PTH components without pin protrusion.

Originality/value

The paper discusses in detail the effect of hole‐fill percentage and voiding on PTH solder joint reliability.

Details

Soldering & Surface Mount Technology, vol. 21 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Access Restricted. View access options
Article
Publication date: 1 August 2003

David Geiger, Fredrik Mattsson, Dongkai Shangguan, MT Ong, Patrick Wong, Mei Wang, Todd Castello and Sammy Yi

0201 assembly plays a very important role in the continuing miniaturization of electronics products. After a systematic study using Sn‐Pb solder paste on pad design, machine…

386

Abstract

0201 assembly plays a very important role in the continuing miniaturization of electronics products. After a systematic study using Sn‐Pb solder paste on pad design, machine evaluation, component qualification, and process optimisation, this study focused on the PCB assembly process for 0201 packages using Sn‐Ag‐Cu solder paste. The post‐reflow solder defects for a range of different spacings were examined for the different solder pastes.

Details

Soldering & Surface Mount Technology, vol. 15 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Available. Content available
Article
Publication date: 1 June 2005

206

Abstract

Details

Soldering & Surface Mount Technology, vol. 17 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Access Restricted. View access options
Article
Publication date: 8 May 2009

Björn Carlberg, Teng Wang, Johan Liu and Dongkai Shangguan

The purpose of this paper is to present a novel nanostructured polymer‐metal composite film providing continuous all‐metal thermally conductive pathways, intended to meet future…

825

Abstract

Purpose

The purpose of this paper is to present a novel nanostructured polymer‐metal composite film providing continuous all‐metal thermally conductive pathways, intended to meet future performance requirements on thermal interface materials (TIMs) in microelectronics packaging applications.

Design/methodology/approach

Porous polymer structures with a thickness of approximately 100 μm were manufactured using electrospinning technology. Pressure‐assisted infiltration of low‐melting temperature alloy into the porous polymeric carrier resulted in the final composite film. Thermal performance was evaluated using an accurate and improved implementation of the ASTM D5470 standard in combination with an Instron 5548 MicroTester. Finally, a brief comparative study using three current state‐of‐the‐art commercial TIMs were carried out for reference purposes.

Findings

Composite films with continuous all‐metal thermally conductive pathways from surface to surface were successfully fabricated. Thermal resistances down to 8.5 K mm2 W−1 at 70 μm bond‐line thickness were observed, corresponding to an effective thermal conductivity of 8 W m−1 K−1, at moderate assembly pressures (200‐800 kPa), more than twice the effective thermal conductivity of the commercial reference materials evaluated.

Originality/value

A unique high‐performance nanostructured polymer‐metal composite film for TIM applications with the potential to meet the microelectronics industry's future demands on thermal performance and cost efficiency is presented.

Details

Microelectronics International, vol. 26 no. 2
Type: Research Article
ISSN: 1356-5362

Keywords

Access Restricted. View access options
Article
Publication date: 1 August 2004

John Lau, Dongkai Shangguan, Todd Castello, Rob Horsley, Joe Smetana, Nick Hoo, Walter Dauksher, Dave Love, Irv Menis and Bob Sullivan

Failure analyses of the lead‐free and SnPb solder joints of high‐density packages such as the plastic ball grid array and the ceramic column grid array soldered on SnCu hot‐air…

798

Abstract

Failure analyses of the lead‐free and SnPb solder joints of high‐density packages such as the plastic ball grid array and the ceramic column grid array soldered on SnCu hot‐air solder levelling electroless nickel‐immersion gold or NiAu, and organic solderability preservative Entek printed circuit boards are presented. Emphasis is placed on determining the failure locations, failure modes, and intermetallic compound composition for these high‐density packages' solder joints after they have been through 7,500 cycles of temperature cycling. The present results will be compared with those obtained from temperature cycling and finite element analysis.

Details

Soldering & Surface Mount Technology, vol. 16 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Access Restricted. View access options
Article
Publication date: 1 April 2004

Minna Arra, Todd Castello, Dongkai Shangguan and Eero Ristolainen

The mechanical properties of Sn/Ag/Cu solder joints in combination with different component lead coating materials (Ni/Pd/Au, Sn/15 per cent Pb, Sn/2 per cent Bi, and Sn) are…

684

Abstract

The mechanical properties of Sn/Ag/Cu solder joints in combination with different component lead coating materials (Ni/Pd/Au, Sn/15 per cent Pb, Sn/2 per cent Bi, and Sn) are studied in this work using a lead pull test and free fall drop test. The results of this study show that the Sn/2 per cent Bi coated components provide the best performance under the drop impact loading followed by the Sn/15 per cent Pb, Sn and Ni/Pd/Au coated components. Failure modes and the structure of the coating surfaces were examined from cross‐sectioned samples using a scanning electron microscope. Furthermore, the wetting of the leads by the solder and thickness of the IMC layers were studied.

Details

Soldering & Surface Mount Technology, vol. 16 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

Access Restricted. View access options
Article
Publication date: 1 December 2004

Minna Arra, David Geiger, Dongkai Shangguan and Jonas Sjöberg

The surface mount technology (SMT) assembly process for 0.4 mm pitch chip scale package (CSP) components was studied in this work. For the screen printing process, the printing…

495

Abstract

The surface mount technology (SMT) assembly process for 0.4 mm pitch chip scale package (CSP) components was studied in this work. For the screen printing process, the printing performance of different solder pastes, aperture shapes and sizes was investigated. Square apertures and a fine particle size in the solder paste provided a better paste release. Besides optimising the printing process capability and minimizing the printing defects such as bridging and missing paste, the total volume of solder consisting of the paste and the solder ball has to be considered in order to maximize the final process yield. For the pick & place process, the accuracy required for the placement equipment was determined by studying the self‐alignment of the lead‐free CSPs (with Sn/4.0Ag/0.5Cu balls) during the reflow process using lead‐free Sn/3.9Ag/0.6Cu paste. The components were intentionally misplaced up to ∼50percent off‐pad. After reflow, x‐ray inspection showed that the components had aligned to the pad. By considering the stack‐up of the printed circuit board pad location and size tolerances, the solder paste printing tolerances and the placement tolerances, the required alignment accuracy for the pick & place equipment was established to meet the total process capability requirement.

Details

Soldering & Surface Mount Technology, vol. 16 no. 3
Type: Research Article
ISSN: 0954-0911

Keywords

1 – 10 of 25
Per page
102050