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Article
Publication date: 1 September 2017

Dongfan Hu and Tinggui Fung

It is our pleasure to present this regular issue of Open House International. In this issue (Vol.42, No. 3, 2017), we selected 26 papers which have gone through several rounds of…

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Abstract

It is our pleasure to present this regular issue of Open House International. In this issue (Vol.42, No. 3, 2017), we selected 26 papers which have gone through several rounds of review and revision, and represent a cross-section of research in building management, construction management, house economics & management, urban planning areas that touch upon both building and housing issues. Open House International is only this outsourced issue supplier as the publisher. This editorial remark also indemnifies the Open House International from any responsibility for the content and presentation of this issue.

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Open House International, vol. 42 no. 3
Type: Research Article
ISSN: 0168-2601

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Article
Publication date: 24 December 2024

Jiacheng Zhou, Jinglin Shi, Dongfan Yin, Lei Xu, Fuwen Zhang, Zhigang Wang, Qiang Hu and Huijun He

This study aims to investigate the impact of indium (In) content on the thermal properties, microstructure and mechanical properties of Sn-3Ag-3Sb-xIn (x = 0, 1, 2, 3, 4, 5 Wt.%…

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Abstract

Purpose

This study aims to investigate the impact of indium (In) content on the thermal properties, microstructure and mechanical properties of Sn-3Ag-3Sb-xIn (x = 0, 1, 2, 3, 4, 5 Wt.%) solders to enhance the performance of tin-based solder under demanding conditions and to meet the urgent need for high-reliability microelectronic interconnection materials in emerging sectors such as automotive intelligent technology, 5G communication technology and high-performance computing.

Design/methodology/approach

In this study, Sn-3Ag-3Sb-xIn solder alloys were prepared. The thermal properties of the solder alloys were characterised by differential scanning calorimetry. Subsequently, optical microscopy, scanning electron microscopy, X-ray diffraction and an electron probe X-ray microanalyser were used to analyse the influence of the In content on the microstructure of the solder. The mechanical properties of solder alloys were determined through tensile testing.

Findings

As the In content increased, the melting temperature of the Sn-3Ag-3Sb-xIn solder decreased, accompanied by less nucleation undercooling and an expanded melting range. The incorporation of In led to an enhancement in the yield and tensile strengths of the Sn-3Ag-3Sb-xIn solder alloys, but with a concomitant decrease in plasticity. In comparison to commercial Sn-3.0Ag-0.5Cu solder alloys, the yield strength and tensile strength of the Sn-3Ag-3Sb-3In alloy increased by 8.64 and 21.69 MPa, respectively, while the elongation decreased by 11.48%.

Originality/value

Sn-3Ag-3Sb-3In solder alloy was the most appropriate and expected comprehensive properties. The enhancements will provide substantial assistance and precise data references for the interconnection requirements in high-strength interconnection fields, such as automotive intelligent technology, 5G communication technology and high-performance computing.

Details

Soldering & Surface Mount Technology, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0954-0911

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