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This study aims to determine the minimum force required to pull out a surface mount component in printed circuit boards (PCBs) during the wave soldering process through both experimental and numerical procedures.

An efficient experimental technique was proposed to determine the minimum force required to pull out a surface mount component in PCBs during the wave soldering process.

The results showed that the pullout force is approximately 0.4 N. Comparing this value with the simulated force exerted by the solder wave on the component (≅ 0.001158 N), it can be concluded that the solder wave does not exert sufficient force to remove a component.

This study provides a deep understanding of the wave soldering process regarding the component pullout, a critical issue that usually occurs in the microelectronics industry during this soldering process. By applying both accurate experimental and numerical approaches, this study showed that more tests are needed to evaluate the main cause of this problem, as well as new insights were provided into the depositing process of glue dots on PCBs.

This study aims to investigate the effect of bismuth addition (up to 30 Wt%) on the microstructure and electrical conductivity of a commercial lead-free alloy (SAC405) near the solder/substrate soldered joint. The system under study is referred in this work as (SAC405 + xBi)/Cu, as Cu is the selected substrate in which the solder was casted. The electrical resistivity of this system was investigated, considering Bi addition effect on the local microstructure and chemical composition gradients within that zone.

Solder joints between Cu substrate and SAC405 alloy with different levels of Bi were produced. The electrical conductivity along the obtained solder/substrate interface was measured by four-point probe method. The microstructure and chemical compositions were evaluated by scanning electron microscopy/energy dispersive spectroscopy analysis.

Two different electrical resistivity zones were identified within the solder interface copper substrate/solder alloy. At the first zone (from intermetallic compound [IMC] until approximately 100 μm) the increase of the electrical resistivity is gradual from the substrate to the solder side. This is because of the copper substrate diffusion, which established a chemical composition gradient near the IMC layer. At the second zone, electrical resistivity becomes much higher and is mainly dependent on the Bi content of the solder alloy. In both identified zones, electrical resistivity is affected by its microstructure, which is dependent on Cu and Bi content and solidification characteristics.

A detailed characterization of the solder/substrate zone, in terms of electrical conductivity, was done with the definition of two variation zones. With this knowledge, a better definition of processing parameters and in-service soldered electronic devices behavior can be achieved.

In a printed circuit board assembly (PCBA), the coefficient of thermal expansion (CTE) mismatch between the solder joint materials has a detrimental impact on reliability. The mechanical stresses caused by the thermal changes of the assembly lead to fatigue and sometimes the failure of the solder joints. The purpose of this study is to propose a novel pad design to obtain an interrupted solder/substrate interface, to improve the PCBA reliability.

An interruption in the continuous intermetallic compound (IMC) layer of a solder joint was implemented, by the deposition of a silicone film in the pad, changing its geometry. That change allows a redistribution of stresses in the most ductile zone of the solder joint, the solder. The stress concentration at the solder/substrate interface is reduced, as well as the general state of stress at the solder joint.

A new way was developed to reduce the stress on the solder joints, caused by thermal variations, because of the different components CTEs mismatch. This new method consists of interrupting the IMC layers of the solder joint, strategically, redirecting the usual stresses to a more ductile area of the joint, the solder. This is an innovative method that allows increase the lifetime of PCBAs and the equipments.

In this study, a new pad design concept for higher solder joint reliability was developed to reduce the shear stress in the solder joints because of the CTE mismatch between all the solder joint components.

The aim of this paper is to characterize the rheological properties of the flux media exposed to different levels of solicitation and to determine its influence on the rheology of the solder paste. The data obtained experimentally are fundamental for the development of numerical models that allow the simulation of the printing process of printed circuit boards (PCB).

Rheological tests were performed using the Malvern rheometer Bohlin CVO. These experiments consist of the analysis of the viscosity, yield stress, thixotropy, elastic and viscous properties through oscillatory tests and the capacity to recover using a creep-recovery experiment. The results obtained from this rheological analysis are compared with the rheological properties of the solder paste F620.

The results have shown that the flux is viscoelastic in nature and shear thinning. The viscosity does not decrease with increasing solicitations, except in the case where the flow is withdrawn directly from the bottle. Even if the solder paste shows a thixotropic behavior, this is not the case of the flux, meaning that this property is given by the metal particles. Furthermore, the oscillatory tests proved that the flux presents a dominant solid-like behavior, higher than the solder paste, meaning that the cohesive/tacky behavior of the solder paste is given by the flux.

To complement this work, printing tests are required.

This work demonstrates the importance of the rheological characterization of the flux in order to understand its influence in the solder paste performance during the stencil printing process.

The purpose of this paper is to investigate the wettability and intermetallic (IMC) layer formation of Sn-3.0Ag-0.5Cu (SAC305)/CNT/Cu solder joint according to the formulation of solder paste because of different types of fluxes.

Solder pastes were prepared by mixing SAC305 solder powder with different flux and different wt.% of carbon nanotube (CNT). Fourier transform infrared spectroscopy was used to identify functional groups from different fluxes of as-formulated solder paste. The solder pastes were then subjected to stencil printing and reflow process. Solderability was investigated via contact angle analysis and the thickness of cross-sectionally intermetallic layer.

It was found that different functional groups from different fluxes showed different physical behaviour, indicated by contact angle value and IMC layer thickness. “Aromatic contain” functional group lowering the contact angle while non-aromatic contain functional group lowering the thickness of IMC layer. The higher the CNT wt.%, the lower the contact angle and IMC layer thickness, regardless of different fluxes. Relationship between contact angle and IMC layer thickness is found to have distinguished region because of different fluxes. Thus it may be used as guidance in flux selection for solder paste formulation.

However, detail composition of the fluxes was not further explored for the scope of this paper.

The quality of solder joint of SAC305/CNT/Cu system, as indicated by contact angle and the thickness of IMC layer formation, depends on existence of functional group of the fluxes.