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Article
Publication date: 6 January 2025

Luis Morales-Navarro, Deborah Fields, Yasmin B. Kafai and Deepali Barapatre

The purpose of this paper is to examine how a clinical interview protocol with failure artifact scenarios can capture changes in high school students’ explanations of…

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Abstract

Purpose

The purpose of this paper is to examine how a clinical interview protocol with failure artifact scenarios can capture changes in high school students’ explanations of troubleshooting processes in physical computing activities. The authors focus on physical computing, as finding and fixing hardware and software bugs is a highly contextual practice that involves multiple interconnected domains and skills.

Design/methodology/approach

This paper developed and piloted a “failure artifact scenarios” clinical interview protocol. Youth were presented with buggy physical computing projects over video calls and asked for suggestions on how to fix them without having access to the actual project or its code. Authors applied this clinical interview protocol before and after an eight-week-long physical computing (more specifically, electronic textiles) unit. They analyzed matching pre- and post-interviews from 18 students at four different schools.

Findings

The findings demonstrate how the protocol can capture change in students’ thinking about troubleshooting by eliciting students’ explanations of specificity of domain knowledge of problems, multimodality of physical computing, iterative testing of failure artifact scenarios and concreteness of troubleshooting and problem-solving processes.

Originality/value

Beyond tests and surveys used to assess debugging, which traditionally focus on correctness or student beliefs, the “failure artifact scenarios” clinical interview protocol reveals student troubleshooting-related thinking processes when encountering buggy projects. As an assessment tool, it may be useful to evaluate the change and development of students’ abilities over time.

Details

Information and Learning Sciences, vol. 126 no. 3/4
Type: Research Article
ISSN: 2398-5348

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