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Article
Publication date: 1 June 2005

36

Abstract

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Soldering & Surface Mount Technology, vol. 17 no. 2
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 1 August 1999

This article has been withdrawn as it was published elsewhere and accidentally duplicated. The original article can be seen here: 10.1108/01445159710163481. When citing the…

170

Abstract

This article has been withdrawn as it was published elsewhere and accidentally duplicated. The original article can be seen here: 10.1108/01445159710163481. When citing the article, please cite: David C. Whalley, Samjid H. Mannan, David J. Williams, (1997), “Anisotropic conducting adhesives for electronic assembly”, Assembly Automation, Vol. 17 Iss 1 pp. 66 - 74.

Details

Microelectronics International, vol. 16 no. 2
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 13 March 2017

Paula Johnson, David J.W. Evans and Zulaikha Khan

The purpose of this paper is to evaluate whether an example of Seclusion Room Contactless Monitoring Technology (VitalGuardTM) is able to accurately detect the presence of life in…

134

Abstract

Purpose

The purpose of this paper is to evaluate whether an example of Seclusion Room Contactless Monitoring Technology (VitalGuardTM) is able to accurately detect the presence of life in a ward seclusion room ensuring patient wellbeing, without interference from background “living noise” (e.g. voices) or “electronic noise” (e.g. other systems).

Design/methodology/approach

The authors assessed the system’s ability to monitor movement caused by human respiration through its ability to discriminate false positives (i.e. presence of an inanimate object ± movement or noise, in the absence of a person in the seclusion room) and false negatives (i.e. failure to detect a human presence) in a ward setting.

Findings

The system displayed 100 per cent validity in terms of determining false positives (six conditions, each n=5) and the system did not alarm under either of the two false negative conditions tested (each n=5).

Research limitations/implications

These findings demonstrate that this example of technology is able to monitor movement caused by human respiration and can accurately and reliably detect the presence of life in seclusion rooms, in the ward setting, without interference from background noise (living and electronic). This was a small evaluation study and further research on its effectiveness in practice would be beneficial in both the intellectual disability forensic setting and other settings of segregation and isolation.

Originality/value

This study suggests that the use of technology in a seclusion room setting can be used as a reliable tool to enhance patient observations and assist in the delivery of care in a safe and unobtrusive manner.

Details

Journal of Intellectual Disabilities and Offending Behaviour, vol. 8 no. 1
Type: Research Article
ISSN: 2050-8824

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Available. Content available
Article
Publication date: 1 December 2003

David Whalley

234

Abstract

Details

Soldering & Surface Mount Technology, vol. 15 no. 3
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 1 March 1997

David C. Whalley, Samjid H. Mannan and David J. Williams

Presents some experimental and theoretical results from research exploring the design rules and relevant process parameters in the assembly of electronic components using…

624

Abstract

Presents some experimental and theoretical results from research exploring the design rules and relevant process parameters in the assembly of electronic components using anisotropic conductive adhesive materials. The experimental configurations studies have geometries representative of flip‐chip and micro ball grid array chip scale packaging. Evaluates a range of materials combinations, including (random filled) adhesive materials based on both thermoplastic and thermo‐setting resin systems, combined with both glass reinforced polymer printed circuit board and silver palladium thick film on ceramic substrate materials. Also presents a summary of assembly experiments which have been conducted using a specially developed instrumented assembly system. This test rig allows the measurement of the process temperatures and pressures and their relationship with the consequent bondline thickness reduction and conductivity development. Finally summarizes the capabilities of models which have been developed of the assembly process and of the final joint properties.

Details

Assembly Automation, vol. 17 no. 1
Type: Research Article
ISSN: 0144-5154

Keywords

Available. Content available
Article
Publication date: 1 March 2005

David Whalley

195

Abstract

Details

Soldering & Surface Mount Technology, vol. 17 no. 1
Type: Research Article
ISSN: 0954-0911

Available. Content available
Article
Publication date: 1 April 2001

David Whalley

418

Abstract

Details

Soldering & Surface Mount Technology, vol. 13 no. 1
Type: Research Article
ISSN: 0954-0911

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Available. Content available
Article
Publication date: 1 August 2000

David Whalley

250

Abstract

Details

Soldering & Surface Mount Technology, vol. 12 no. 2
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 1 April 2002

David C. Whalley and Stuart M. Hyslop

Previous models of temperature development during the reflow soldering process have typically used commercially available, general purpose, finite difference/finite element…

454

Abstract

Previous models of temperature development during the reflow soldering process have typically used commercially available, general purpose, finite difference/finite element modelling tools to create detailed three dimensional representations of both the product and of the reflow furnace. Such models have been shown to achieve a high degree of accuracy in predicting the temperatures a particular PCB design will achieve during the reflow process, but are complex to generate and analysis times are long, even when using modern high performance computer workstations.This paper will report on the development of a simplified model of the process, which uses less complex representations of both the product and the process, together with a simple numerical solver developed specifically for this application, whilst achieving an accuracy comparable with more detailed models. In the simplified model, the product is divided into elements, which are represented using a two‐dimensional mesh of thermal conductances linking thermal masses. The values of these conductances and masses are calculated based on the averaged properties of the PCB material and attached components within the area of each of the elements. The representation of the specific reflow furnace is based on measurements of the temperature and level of thermal convection at each point along the length of the furnace, thereby avoiding the necessity of making detailed measurements of the furnace geometry and air flow velocities. The combination of these two simplification techniques allow the reduction of analysis time for a relatively simple PCB from in the order of an hour on a high performance Unix workstation to under a second on a Pentium class PC running Microsoft Windows.

Details

Soldering & Surface Mount Technology, vol. 14 no. 1
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 31 July 2007

Farhad Sarvar, David C. Whalley, David A. Hutt, Paul J. Palmer and Nee Joo Teh

The encapsulation of electronic assemblies within thermoplastic polymers is an attractive technology for the protection of circuitry used in harsh environments, such as those…

732

Abstract

Purpose

The encapsulation of electronic assemblies within thermoplastic polymers is an attractive technology for the protection of circuitry used in harsh environments, such as those experienced in automotive applications. However, the relatively low‐thermal conductivity of the encapsulating polymer will introduce a thermally insulating barrier, which will impact on the dissipation of heat from the components and may result in the build‐up of stresses in the structure. This paper therefore seeks to present the results from computational models used to investigate the thermal and thermo‐mechanical issues arising during the operation of such electronic modules. In particular, a two‐shot overmoulded structure comprising an inner layer of water soluble and an outer layer of conventional engineering thermoplastics was investigated, due to this type of structure's potential to enable the easy separation of the electronics from the polymer at the end‐of‐life for recycling.

Design/methodology/approach

Representative finite element models of the overmoulded electronic structures were constructed and the effects of the polymer overmould were analysed through thermal and thermo‐mechanical simulations. Investigations were also carried out to explore the effect of materials properties on the overmoulded structure.

Findings

Models have shown that some power de‐rating of components is required to prevent temperatures exceeding those in unencapsulated circuits and have quantified the benefits of adding thermally conductive fillers to the polymer. Simulations have also clearly demonstrated the benefits of foamed polymers in reducing thermal stresses in the assemblies, despite their poorer thermal conductivity compared with solid polymers.

Originality/value

The paper illustrates the thermal issues affecting the overmoulded electronics and gives some guidelines for improving their performance.

Details

Microelectronics International, vol. 24 no. 3
Type: Research Article
ISSN: 1356-5362

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