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Article
Publication date: 1 February 1994

L.J. Turbini and D. Cauffield

For a number of years electronic manufacturers of printed circuit assemblies have used rosin‐based soldering fluxes. Post‐solder cleaning was accomplished with chlorinated or…

159

Abstract

For a number of years electronic manufacturers of printed circuit assemblies have used rosin‐based soldering fluxes. Post‐solder cleaning was accomplished with chlorinated or chlorofluorocarbon (CFC) solvents. With the elimination of these solvent options due to their destructive effect on the stratospheric ozone layer, manufacturers are considering alternative cleaners for rosin flux or new flux choices which can be cleaned with water or left uncleaned. Many of the flux formulations are relatively new and their long‐term effect on the performance of products manufactured with them is unknown. Although ionic contamination testers can alert one to the ionic levels remaining on an assembly, there is no direct relationship between the total ionic level and the corrosivity of the soldering flux. Surface insulation resistance testing is used in the industry, but the results are misunderstood by many. This is due to the fact that SIR data represent a complex dependency on a number of factors including (1) the test conditions (temperature, humidity, bias), (2) the area of interactions (often referred to as the number of squares), (3) the separation between lines on the interdigitated comb pattern, (4) the presence or absence of bias voltage during the test and (5) the nature of the substrate. All of these factors have been the driving force to develop a quantitative screening test for soldering flux residues. This test, originally reported by Dr David Bono, is being modified and developed at Georgia Tech to provide a quantitative evaluation of flux residue corrosivity. This work, in collaboration with the work being performed by the French UTE, will result in a new international standard. This paper reports the latest data on this important test development.

Details

Soldering & Surface Mount Technology, vol. 6 no. 2
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 19 June 2007

C.H.S. Ruxton, L. Kirkwood, B. McMillan, D. St John and C.E.L. Evans

There are many herbal supplements on the market claiming to aid weight loss but few are evidence‐based. This study aims to test one such formulation.

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Abstract

Purpose

There are many herbal supplements on the market claiming to aid weight loss but few are evidence‐based. This study aims to test one such formulation.

Design/methodology/approach

An over‐the‐counter herbal supplement containing yerba maté, guarana and damiana (YGD) was tested in 73 overweight health professionals for six weeks. Subjects were not asked to make any lifestyle changes.

Findings

Self‐reported weight, waist circumference and hip circumference reduced significantly, while 22 per cent of subjects experienced a clinically significant weight loss. The anthropometric changes were in line with other commercial diet and exercise programmes. Reported between‐meal hunger, and consumption of snacks reduced across the six weeks. Reported satiety after meals increased and subjects claimed to be more in control of snacking, emotional eating and portion sizes. A follow‐up at week ten, when 82 per cent of subjects had stopped taking YGD, revealed no additional reductions in weight or hip circumference. Fullness ratings had stabilised, while hunger ratings had increased. There were no consistent adverse effects that could reasonably be related to YGD.

Research limitations/implications

Taken alongside a 2001 randomised, placebo‐controlled trial, this study provides evidence that a YGD supplement can aid weight loss and reduce waist and hip circumference, probably by increasing satiety.

Originality/value

The growing market in weight management products brings with it a responsibility for manufacturers to provide evidence that their products work. This paper adds to the evidence base.

Details

British Food Journal, vol. 109 no. 6
Type: Research Article
ISSN: 0007-070X

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