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Article
Publication date: 1 December 2004

Cliff Roseen

Development efforts at Rogers are continuing on R/flex® liquid crystalline polymer (LCP) materials for printed circuit production. As an extension of our EIPC Spring 2003 paper…

402

Abstract

Development efforts at Rogers are continuing on R/flex® liquid crystalline polymer (LCP) materials for printed circuit production. As an extension of our EIPC Spring 2003 paper, work has been completed on a novel method for sequentially building multi‐layer circuit boards using our laminates, bond plys and cap layers manufactured from various melt‐point LCP dielectric films. This paper discusses the theory and practice of sequentially built multilayers in all‐LCP and mixed dielectric constructions, reviews the pertinent processing steps and guidelines necessary for production and subsequent assembly thereafter, and considers some of the application areas that may benefit from this novel fabrication strategy.

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Circuit World, vol. 30 no. 4
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 December 2004

John Ling

66

Abstract

Details

Circuit World, vol. 30 no. 4
Type: Research Article
ISSN: 0305-6120

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