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Article
Publication date: 1 April 1992

Necdet Geren, Ching‐Yuen Chan and Eddie Lo

Despite continuous efforts in improving process reliability inprinted‐circuit board assembly (PCBA), a zero‐defect situation isdifficult to achieve because of the complexity of…

49

Abstract

Despite continuous efforts in improving process reliability in printed‐circuit board assembly (PCBA), a zero‐defect situation is difficult to achieve because of the complexity of the process and the multitude of components involved. PCBA rework is necessary in many companies due to economic as well as commercial reasons. Presents the intermediate results of a research programme aimed to investigate the technical and economic feasibility of extending the use of a robotic assembly cell to perform single‐board rework. Outlines various manual rework practices and the equipment available. Examines the role of industrial robots and machine vision in PCBA and defines the objectives and overall boundary of the research programme in automatic rework. Describes individual equipment selected to assist the robot, the layout and the manner in which it is used in the cell. Concludes with the development of the cell controller and the methods of equipment integration.

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Integrated Manufacturing Systems, vol. 3 no. 4
Type: Research Article
ISSN: 0957-6061

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Article
Publication date: 1 August 2008

Kam Fai Dick Tam, Ching Yuen Chan, W.H. Ip and Chi Shing Jackson Tang

The purpose of this paper is to develop a cost effective ball grid array (BGA) workcell for solder ball attachment.

377

Abstract

Purpose

The purpose of this paper is to develop a cost effective ball grid array (BGA) workcell for solder ball attachment.

Design/methodology/approach

This paper presents the construction of a low‐cost high‐efficiency automatic ball attachment workcell. In fact, it is an economical means of simultaneous placement of all solder balls on BGA substrates containing multiple BGA units as well as singulated substrates. Common industry problems such as the effect of static charges, the solder ball oxidation, the missing ball, the extra ball, the ball alignment, the deformed ball and, etc. will be addressed and critical issues affecting yield will also be discussed in this paper.

Findings

BGA is a popular integrated circuit packaging that is often applied in laptop computers and other handheld electronic devices for the provision of a high‐connection count in a relatively small area. However, the cost of a market available BGA solder ball attachment workcell is very expensive and the flexibility in fitting various customized process is usually low.

Originality/value

The developed workcell cost is about half of the market available machines with similar specifications; the yield achieved is within three sigma confidence interval with competitive output rate. The maintenance and troubleshooting are easy since the machine was developed by the in‐house engineering team.

Details

Assembly Automation, vol. 28 no. 3
Type: Research Article
ISSN: 0144-5154

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Article
Publication date: 1 March 1994

DIANNE HUNT

Some of you may be surprised to learn of some of the inventions originating from Australian endeavours — the black box flight recorder, atomic absorption spectrophotometer…

33

Abstract

Some of you may be surprised to learn of some of the inventions originating from Australian endeavours — the black box flight recorder, atomic absorption spectrophotometer, over‐the‐horizon radar, combine harvester and the all important ‘esky’ cooler, to name but a few. However, in the 1980s the Australian electronics industry found itself in somewhat of a knowledge vacuum when it came to surface mount technology. The introduction of this technology and its advancement were happening overseas and it was taking some time for the information to get down under for Australian designers and manufacturers to apply this new enabling technology.

Details

Soldering & Surface Mount Technology, vol. 6 no. 3
Type: Research Article
ISSN: 0954-0911

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