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Article
Publication date: 1 September 2005

Taehoon Kim, Jee‐Soo Mok, Chang‐Kyu Song, Jun‐Heyoung Park, Kyung‐O Kim, Ben Sun and Byung‐Youl Min

To review a newly developed PCB fabrication process based on a parallel lamination technique.

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Abstract

Purpose

To review a newly developed PCB fabrication process based on a parallel lamination technique.

Design/methodology/approach

This paper has been written to introduce the SAVIA process, a new parallel lamination technique for PCB fabrication. The basic concept of the SAVIA process has been described along with the individual process steps and the reliability issues. The advantages of SAVIA process have been also discussed in both economical and technological aspects.

Findings

It was found that the parallel lamination technique, a key process for SAVIA, was not only highly flexible and reliable but also a cost‐effective fabrication method for high performance PCB. With the SAVIA process, manufacturing lead‐times can be substantially reduced due to the nature of the parallel processing. It was also confirmed that a highly reliable metal alloy interconnection was created between the core and the adhesive layers during the lamination process. The formed metal alloy contacts showed excellent electrical and physical characteristics. The between layers was precise.

Originality/value

The value of this paper is to introduce a novel PCB fabrication process based on a parallel lamination technique that is superior to conventional build‐up processes from both technological and economical viewpoints. By applying a parallel lamination technique, it is expected that fabrication costs can be lowered due to reductions in manufacturing lead‐time.

Details

Circuit World, vol. 31 no. 3
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 2 November 2015

Hyun-Sook Han, Sungmin Kim and Chang Kyu Park

– The purpose of this paper is to develop an automated custom-pattern-making system using the width-height independent grading method for semi-customized clothing.

441

Abstract

Purpose

The purpose of this paper is to develop an automated custom-pattern-making system using the width-height independent grading method for semi-customized clothing.

Design/methodology/approach

The system reads basic patterns and graded large patterns and calculates the grading ratio of independent horizontal and vertical values on all points in a pattern. The custom pattern is automatically generated by calculating the horizontal and vertical grading amount according to individual body measurements. The system does not follow any complicated alteration rules.

Findings

The width-height independent grading method can provide custom-pattern fitted primary body circumference and length and helps to quickly produce semi-customized clothing.

Originality/value

There are few studies on automated custom-pattern-making systems without an alteration rule. This study developed an automatic custom-pattern-making system using the width-height independent grading method.

Details

International Journal of Clothing Science and Technology, vol. 27 no. 6
Type: Research Article
ISSN: 0955-6222

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