Search results
1 – 2 of 2C.G.J. Schabmueller, A.G.R. Evans, A. Brunnschweiler, G. Ensell, D.L. Leslie and M.A. Lee
Reports the design, fabrication and packaging of a micromachined silicon/Pyrex based chip for the polymerase chain reaction (PCR). The anodic bonding method is used for sealing…
Abstract
Reports the design, fabrication and packaging of a micromachined silicon/Pyrex based chip for the polymerase chain reaction (PCR). The anodic bonding method is used for sealing the chambers of 1μl volume with a Pyrex glass wafer. Platinum resistors on the back of the wafer are used as heaters and temperature sensors. The chip is externally cooled by forced air to achieve rapid temperature cycling. The transparency of the Pyrex makes it possible for using optical readout methods. The packaging is especially designed for easy handling, filling, power connection, temperature regulation and optical readout. The mass production of such silicon reactors could make single‐shot throwaway devices economically viable.
Josef Šandera and Michal Nicák
This article aims to discuss the construction of a system for temperature cycling, where Peltier elements are used as heating or cooling elements. This article describes the…
Abstract
Purpose
This article aims to discuss the construction of a system for temperature cycling, where Peltier elements are used as heating or cooling elements. This article describes the results and experiences based on several years of practice in the area of thermo-mechanical reliability of soldered joints on printed boards with SMD components.
Design/methodology/approach
The authors discuss the characteristics of the design, the threshold temperatures, dynamic properties of the system and, most importantly, the reliability and the useful life of the Peltier elements. The advantages and disadvantages of the system are mentioned as well as examples of use.
Findings
The utilisation of Peltier elements for temperature cycling is possible, but it is important to keep in mind that the reliability of the elements is similar to the reliability of the system, and therefore, it is essential to replace the defective Peltier elements during the cycling.
Research limitations/implications
The construction of system is very simply. It is necessary to ensure the Peltier elements with low dispersion parameters.
Originality/value
The system is very well suited for cycling of printed boards, especially one sided, multi-chip systems, COB systems, flip-chip embedded construction, etc. The system can be used in situations where it is possible to ensure an effective heat transfer and where extremely low temperatures are not required.
Details