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This paper presents a novel mesoscale RF (mRF) relay that integrates advanced high resolution stereolithography (SL) and micro wire electro discharge machining (μEDM) technologies. Methods and infrastructure for reliable batch assembly of electromechanical actuators and structural parts less than 5 mm³ in volume are described. Switches made using these techniques are expected to have greater power handling capability relative to current micro RF relay products.

The conjecture is that the integration of SL and similar rapid additive manufacturing with other mesofabrication technologies can yield innovative miniature products with novel capabilities. A series of mRF prototypes consisting of a contact mechanism and actuator with return spring were fabricated assembled, inspected, and characterized for electromechanical performance. Characterization results led to specific conclusions regarding capabilities of the mRF product, and the integrated manufacturing technique.

The microassembly apparatus and epoxy‐based fastening system led to durable prototypes within 4 h (excluding a 16‐24 h cure cycle). Relay stroke ranged from 560 to 1,650 μm indicating a relative assembly accuracy of 90 percent. Prototypes demonstrated insertion loss of 1.3 dB at 100 MHz and isolation of better than 30 dB through 300 MHz.

Results indicated that fully functional and robust mesoscale relays are possible using integrated manufacturing with SL. However, prototypes exhibited high contact resistance and lacked assembly precision in the context of contact mechanism stroke. Opportunities exist to reduce contact resistance and switching time.

The research provides a practical new product application for integrated mesoscale rapid manufacturing.

This work represents one of the first examples of a mesoscale relay rapidly manufactured with a combination of μEDM and SL components.

In this contribution, the design and integration of a piezoelectric vibrating device into low-temperature, co-fired ceramic (LTCC) structures are presented and discussed. The mechanical vibration of the diaphragm was stimulated with a piezoelectric actuator, which was integrated onto the diaphragm. Three different methods for the integration were designed, fabricated and evaluated.

The vibrating devices were designed as an edge-clamped diaphragm with an integrated piezoelectric actuator at its centre, whose role is to stimulate the vibration of the diaphragm via the converse piezoelectric effect. The design and feasibility study of the vibrating devices was supported by analytical methods and finite-element analyses.

The benchmarking of the ceramic vibrating devices showed that the thick-film piezoelectric actuator responds weakly in comparison with both the bulk actuators. On the other hand, the thick-film actuator has the lowest dissipation factor and it generates the largest displacement of the diaphragm with the lowest driving voltage. The resonance frequency of the vibrating device with the thick-film actuator is the most sensitive for an applied load (i.e. mass or pressure).

Research activity includes the design and the fabrication of a piezoelectric vibrating device in the LTCC structure. The research work on the piezoelectric properties of integrated piezoelectric actuators was limited.

Piezoelectric vibrating devices were used as pressure sensors.

Piezoelectric vibrating devices could be used not only for pressure sensors but also for other type of sensors and detectors and for microbalances.

The development of chemical sensors based on nanostructures, such as nanotubes or nanowires, depends on the capability to reproducibly control the processing of the sensor. Alignment and consistent electrical contact of nanostructures on a microsensor platform is challenging. This can be accomplished using labor‐intensive approaches, specialized processing technology, or growth of nanostructures in situ. However, the use of standard microfabrication techniques for fabricating nanostructured microsensors is problematic. The purpose of this paper is to address this challenge using standard photoresist processing combined with dielectrophoresis.

Nanostructures are suspended in photoresist and aligned between opposing sawtooth electrode patterns using an alternating current (AC) electric field (dielectrophoresis). The use of photoresist processing techniques allow the burying of the nanostructures between layers of metal, thus improving the electrical contact of the nanostructures to the microsensor platform.

This approach is demonstrated for both multi‐walled carbon nanotubes and tin oxide nanowires. Preliminary data show the electrical continuity of the sensor structure as well as the response to various gases.

It is concluded that this approach demonstrates a foundation for a new tool for the fabrication of microsensors using nanostructures, and can be expanded towards enabling the combination of common microfabrication techniques with nanostructured sensor development.

This approach is intended to address the significant barriers of deposition control, contact robustness, and simplified processing to realizing the potential of nanotechnology as applied to sensors.

This paper aims to focus on the application of low temperature co-fired ceramic (LTCC) technology in the fabrication of a microfluidic module with integrated microwave components. The design, technology and performance of such an LTCC-based module is investigated. The rapid heating of liquid samples on a microliter scale is shown to be possible with the use of microwaves.

The developed microwave-microfluidic module was fabricated using well-known LTCC technology. The finite element method was used to design the geometry of the microwave circuit. Various numerical simulations for different liquids were performed. Finally, the performance of the real LTCC-based microwave-microfluidic module was examined experimentally.

LTCC materials and technology can be used in the fabrication of microfluidic modules which use microwaves in the heating of the liquid sample. LTCC technology permits the fabrication of matching circuits with appropriate geometry, whereas microwave power can be used to heat up the liquid samples on a microliter scale.

The main limitation of the presented work is found to be in conjunction with LTCC technology. The dimensions and shape of the deposited conductors (e.g. microstrip line, matching circuit) depend on the screen-printing process. A line with resolution lower than 75 µm with well-defined edges is difficult to obtain. This can have an effect on the high-frequency properties of the LTCC modules.

The presented LTCC-based microfluidic module with integrated microwave circuits provides an opportunity for the further development of various micro-total analysis systems or lab-on-chips in which the rapid heating of liquid samples in low volumes is needed (e.g. miniature real-time polymerase chain reaction thermocycler).

Examples of the application of LTCC technology in the fabrication of microwave circuits and microfluidic systems can be found in the available literature. However, the LTCC-based module which combines microwave and microfluidic components has yet to have been reported. The preliminary work on the design, fabrication and properties of the LTCC microfluidic module with integrated microwave components is presented in this paper.

Individual metering and charging (IMC) allows energy costs to be apportioned among tenants in multi-apartment buildings based on their own energy use. This can result in reduced energy use due to an increased saving behaviour by tenants, which has caught the attention of the European Parliament. In the EU-directive 2012/27/EU there is a requirement for IMC to be installed by December 31, 2016 in multi-apartment buildings.

Two techniques are mentioned in the directive for IMC: individual consumption meters and individual heat cost allocators. Either of these two techniques can be used as a method to measure the supplied energy to an apartment. Another method, not mentioned in the EU-directive, is temperature metering which means that the heating cost is instead based on measurements of the actual temperatures through sensors in certain locations in the apartment. However, some shortcomings have been identified with the aforementioned methods.

The purpose of this study is to investigate how internal heat production, solar radiation, an apartment’s location within the building and local defects in the building envelope affect the accuracy of IMC. The Energy demands of three apartments in different locations within the building have been simulated in the computer program VIP-Energy. The results of energy calculations prove that the accuracy of IMC is highly questionable in some of the investigated cases. The implication of the study is that it is difficult to measure the actual heat used for an individual apartment, which obstructs accurate and fair apportioning of heating costs among individual tenants.

The purpose of this paper is to present the research activity and results to research and development society on the field of ceramic microsystems.

The chemical reactor was developed as a non-conventional application of low temperature co-fired ceramic (LTCC) and thick-film technologies. In the ceramic reactor with a large-volume, buried cavity, filled with a catalyst, the reaction between water and methanol produces hydrogen and carbon dioxide (together with traces of carbon monoxide). The LTCC ceramic three-dimensional (3D) structure consists of a reaction chamber, two inlet channels, an inlet mixing channel, an inlet distributor, an outlet collector and an outlet channel. The inlet and outlet fluidic barriers for the catalyst of the reaction chamber are made with two “grid lines”.

A 3D ceramic structure made by LTCC technology was successfully designed and developed for chemical reactor – methanol decomposition.

Research activity includes the design and the capability of materials and technology (LTCC) to fabricate chemical reactor with large cavity. But further dimensions-scale-up is limited.

The technology for the fabrication of LTCC-based chemical reactor was developed and implemented in system for methanol decomposition.

The approach (large-volume cavity in ceramic structure), which has been developed, can be used for other type of reactors also.

The purpose of this study is the design, fabrication and evaluation of a miniature ozone generator using the principle of electric discharge are presented.

The device was fabricated using a low-temperature co-fired ceramics (LTCC) technology, by which a multilayered ceramic structure with integrated electrodes, buried channels and cavities in micro and millimeter scales was realized.

The developed ozone generator with the dimensions of 63.6 × 41.8 × 1.3 mm produces approximately 1 vol. % of ozone in oxygen flow of 15 ml/min, at an applied voltage of 7 kV.

A miniature ozone generator, manufactured in LTCC technology, produces high amount of ozone and more than it is described in the available references or in datasheets of commercial devices of similar size.

The purpose of this paper is to present the results of experiments performed to attach silicon dies (chips) to low‐temperature co‐fired ceramic (LTCC) substrates with Ag or AgPd pads using SnAgCu or SnPb solder and the results of the characterization of the solder joints.

LTCC substrates were fabricated by stacking and laminating four green tapes with the top layer screen‐printed with Ag or AgPd paste to form pads. Silicon die sizes of 1 × 1 mm and 2 × 2 mm with electroless nickel immersion gold plated were soldered to 2 × 2 mm pads on the LTCC substrates using SnPb or SnAgCu solder. The solder joints were then characterized using X‐ray, die shear, energy dispersive X‐ray and scanning electron microscopy techniques.

The joints made by AgPd pads with SnAgCu solder provided the best results with the highest shear strength having strong interfaces in the joints. However, the joints of Ag pads with SnPb solder did not provide high‐shear strength.

The findings provide certain guidelines to implement LTCC applications. AgPd pads with SnAgCu solder can be considered for applications where small silicon dies need to be attached to LTCC substrates. However, Ag pads with SnAgCu solder can be considered for lead‐free solder applications.

The objective of this paper is to demonstrate a method for producing embedded horizontal micro‐channels using a commercial line‐scan stereolithography (SL) system. To demonstrate that the method is repeatable, reproducible and capable of producing accurate horizontal micro‐channels, a statistical design of experiments was performed.

Demonstration of the technique was performed using a 3D Systems Viper si2^TM SL system and DSM Somos^® WaterShed^TM resin with polytetrafluoroethylene (PTFE)‐coated wire having diameters of 31.6 and 57.2 μm. By embedding the wire and building around the insert, the down‐facing surfaces were supported during fabrication enabling accurate fabrication of embedded micro‐channel geometries. The fabrication method involved first building an open micro‐channel, interrupting the SL process and inserting the wire, and then capping over the wire with multiple layers. After fabrication, the part with the inserted micro‐wire was post‐cured to harden any uncured resin around the wire. The micro‐channel was produced by simply pulling the wire out of the part. Scanning electron microscope images were used to examine and measure the geometries of the fabricated micro‐channels, and characterization through a statistical analysis was accomplished to show that the process was capable of producing accurate horizontal micro‐channels.

The measured data showed that the micro‐wires were successfully removed from the channels, leaving high quality micro‐channels, where the mean measured diameters for each wire were 2.65 and 2.18 μm smaller than the measured wire diameters (31.6 and 57.2 μm). Based on the statistical results, it is suggested that the method described in this work can rapidly produce repeatable and reproducible circular, embedded, and accurate micro‐channels.

The method developed in the current work was demonstrated on simple straight channels and a statistical study was used to show that the process is capable of repeatedly and reproducibly producing accurate micro‐channels with circular cross‐section; however, future studies are required to extend these procedures to more realistic and complicated geometries that may include non‐straight channel paths and non‐circular cross‐sectional geometries. The process can be used for micro‐channel fabrication with not only circular cross‐sectional geometries as shown here but potentially with a wide range of additional cross‐sectional geometries that can be fabricated into a PTFE‐coated micro‐wire.

This work demonstrates a process using commercial line‐scan SL and embedding a PTFE‐coated micro‐wire that is subsequently removed for producing repeatable and reproducible horizontal embedded micro‐channels of circular cross‐sectional geometries.

The purpose of this study is to design, fabricate and investigate low-temperature co-fired ceramic (LTCC) structures with integrated microfluidic elements. Special attention is paid to the study of fluid properties of micro-channels and microvalves, which are important constitutive parts of both, microfluidic systems and individual microfluidic devices.

Several test patterns of fluid channels with different geometry and different types of valves were designed and realized in LTCC technology. All test structures were tested under the flow of two fluids (liquids): water and isopropyl alcohol. Flow rates at different applied pressure were measured and hydrodynamic resistance and diode effect were calculated.

The investigation of the channels showed that viscosity of fluidic media has significant influence on the hydrodynamic resistance in channels with rectangular cross-section, while this effect is small on channels with square cross-section. The viscosity also has a decisive influence on the diode effect of different shape of valves, and therefore, it is important in the selection of the valve in practical applications.

In this work, the investigation of hydrodynamic resistance of channels and diode effect of passive valves is limited on selected geometry and only on two fluidic media and two applied pressures. All these and some other parameters have a significant influence on fluidic properties, but this will be the topic of the next research work, which will be supported by numerical modelling.

The presented results are useful in the future designing process of LTCC-based microfluidic devices and systems.

Microfluidic in the LTCC structures is an unconventional use of this technology. Therefore, the fluid properties are relatively unsearched. On the other hand, the global use of microfluidic devices and systems is growing rapidly in various applications. They are mostly made by polymer materials, however, in more demanding applications; ceramic is a useful alternative.