C. Zardini, J.D. Pistre, F. Rodes and J.L. Aucouturier
Water cooling of hybrid modules allows a power dissipation much higher than that of conventional methods. This paper describes the design and construction of a copper‐clad Invar…
Abstract
Water cooling of hybrid modules allows a power dissipation much higher than that of conventional methods. This paper describes the design and construction of a copper‐clad Invar water‐cooled hybrid power circuit intended for use in a medical hand‐held tool which is a 25 mm diameter cylinder. The thermal study demonstrates the interest of a copper‐clad Invar heat exchanger: water flowing at a rate lower than 15 Ih−1 allows the dissipation of more than 50 W in the module while keeping the external temperature of the tool below 35°C.
C. Zardini, F. Rodes, G. Duchamp and J.‐L. Aucouturier
Among the main factors to be considered for the thermal optimisation of hybrid power modules are: the thermal resistance between the power chips and the bottom of the case; the…
Abstract
Among the main factors to be considered for the thermal optimisation of hybrid power modules are: the thermal resistance between the power chips and the bottom of the case; the thermal coupling between adjacent chips; and the ability of the module to withstand the thermal overloads induced by electrical surges. In this paper, the authors show how a finite element code can be used to optimise a hybrid power assembly in both steady‐and unsteady‐state. Comparisons made between results obtained with 3D and 2D simulations show that for hybrid power modules 2D simulations are generally unreliable. However, thermal studies cannot guarantee the reliability of hybrid power assemblies. Studies relative to hybrid power circuits must be thermomechanical.
J. Lantairès, B.C. Waterfield, H. Binner, G. Griffiths and Maurice Wright
ISHM invites papers for the above Conference, to be held on 29–31 May 1991 in Rotterdam, The Netherlands. Papers should cover areas such as: design, manufacturing, packaging and…
Abstract
ISHM invites papers for the above Conference, to be held on 29–31 May 1991 in Rotterdam, The Netherlands. Papers should cover areas such as: design, manufacturing, packaging and interconnection, materials and processing, applications, reliability, components, new technologies, marketing and economics, optoelectronics. Summaries should be in English, length 200–300 words. The deadline for receipt of summaries is 30 September 1990. (For full details, see announcement on pp. 54–55.)
Giulio Caldarelli, Alessandro Zardini and Cecilia Rossignoli
This paper aims to examine and overcome the barriers to the widespread adoption of blockchain technology, introducing a novel concept of sustainability in the fashion supply chain.
Abstract
Purpose
This paper aims to examine and overcome the barriers to the widespread adoption of blockchain technology, introducing a novel concept of sustainability in the fashion supply chain.
Design/methodology/approach
This work is an exploratory study of a well-known fashion company operating in the Veneto region (Italy). Data extracted from interviews and focus groups are coded using the (CAQDAS) software AQUAD. The outcome is then organized according to an adapted TOE view.
Findings
This exploration study's findings support the idea that the blockchain solution could be a valuable add-on in sustainable supply chains. However, a high understanding of technology and extensive communication with clients is required for successful integration.
Research limitations/implications
Being the outcome of qualitative analysis, the findings require further investigation to be inferable at a broader scale. As the project is still incomplete, some managerial choices are always subject to change.
Practical implications
Focused on a practitioner approach, this paper should guide managers in the process of successfully implementing blockchain technology. Arguably, similar companies may opt for similar choices.
Originality/value
To the best of the authors' knowledge, this is the first paper to contextualize and address the blockchain adoption barriers in the fashion supply chain. Furthermore, it offers an overview of how blockchain affects sustainable production.
Details
Keywords
Marc Monneraye, Panizza, Brian Waterfield, John Knowles and P.L. Bainbridge
A month or so after the Stresa meeting, the French ISHM chapter, organising a session on ‘Gallic inks’ (!), summoned me to deliver some comments on the 5th European Hybrid…
Abstract
A month or so after the Stresa meeting, the French ISHM chapter, organising a session on ‘Gallic inks’ (!), summoned me to deliver some comments on the 5th European Hybrid Microelectronics Conference. Although it was only a matter of interlude during this technical session, I felt the task quite a difficult one. It became a hazardous project when Brian C. Waterfield kindly asked me to let what is in fact a personal opinion—my personal opinion, standing back from my daily work—appear in Hybrid Circuits. I'll do my best.
Kalpana Rajsinghot, Shashi Bala and Puja Singhal
Rural entrepreneurship is an important vehicle to drive sustainable rural development in India. The process of planning, starting, and operating a new business is termed as…
Abstract
Rural entrepreneurship is an important vehicle to drive sustainable rural development in India. The process of planning, starting, and operating a new business is termed as entrepreneurship. It has been described as having the ability and willingness to create, plan, and manage a business enterprise while accepting any risks involved to generate a profit. In India’s rural areas, enterprise and entrepreneurship are what fuel economic progress. A rural entrepreneur is someone who uses rural resources to develop products and establish enterprises that support the development of the rural economy and its growth potential. Although, these rural business owners encounter issues similar to those faced by urban business owners due to the rural setting in which they operate amplifies their difficulties. To reduce rural people’s migration and to support rural upliftment, it is necessary to encourage entrepreneurship and new employment opportunities. Consequently, rural entrepreneurship has the potential to greatly increase employment in rural areas. It is a more effective method of eradicating poverty and hunger, sustainable health and well-being, enhancing gender equality, quality education, decent work conditions, promoting innovation in industries, and ultimately reducing the inequalities which are mapped with the important agenda of the United Nation’s sustainable development goals (SDGs 2030). To bring about change, institutions must concentrate on the interactions between education, skill, entrepreneurship, and employment. This chapter explores the challenges and skills required for rural entrepreneurship in India, proposing a framework to enhance rural development through entrepreneurship.
Details
Keywords
Abstract
Present‐day electronics are shifting increasingly towards surface mounting technology (SMT) and hybrid technology (thick and thin film), which offer greater advantages due to their fabrication processes. Capacitors, like other components used in these processes, must occupy the smallest volume possible. Because of miniaturisation of the capacitors, the reliability of the surface mounting process is affected not only by the reliability of the components themselves but also by that of the assembly. In this study, a thermo‐mechanical simulation has been performed by means of ANSYS software based on the finite element method. This paper deals with the evaluation of a ceramic capacitor module (capacitors soldered on copper lands) on FR‐4 or alumina substrates during cooling to room temperature (25°C). The parameters of the assembly — temperature, length and thickness of the capacitor, thickness of the solder joint and nature of the substrate — were chosen by using the Design Of Experiments (DOE) method, which permits optimisation of these parameters and reduces the investigation time. The results showed a correlation between the length of the capacitor and the nature of the substrate used. Greater capacitor length is required for alumina substrate while a shorter length is preferred for FR‐4. It appears that a solder joint more than 100 urn thick may induce significant constraints on the copper lands and on the capacitor leads. It was noted that shear stress and voids in the solder joint can occur at temperatures higher than 250°C. This investigation makes it possible to prevent thermo‐mechanical stress damage during the mounting process and gives some recommendations for the choice of assembly variables.
T. Kwikkers, J. Lantaires, R.B. Turnbull, H.T. Law, Barry George and Dave Savage
On 20 April ISHM‐Benelux held its 1988 Spring meeting at the Grand Hotel Heerlen. This meeting was totally devoted to implantable devices, in particular to the technologies used…
Abstract
On 20 April ISHM‐Benelux held its 1988 Spring meeting at the Grand Hotel Heerlen. This meeting was totally devoted to implantable devices, in particular to the technologies used for these high reliability, extremely demanding devices. For this meeting ISHM‐Benelux was the guest of the Kerkrade facility of Medtronic. Medtronic (headquartered in Minneapolis, USA) is the world's leading manufacturer of implantable electronic devices. Apart from the assembly of pacemakers and heart‐wires, the Kerkrade facility acts as a manufacturing technology centre for Medtronic's European facilities.
In this contribution a linear thermal model for hybrid circuits is presented. Both the heat dissipated in screen printed resistors and in mounted components such as transistors…
Abstract
In this contribution a linear thermal model for hybrid circuits is presented. Both the heat dissipated in screen printed resistors and in mounted components such as transistors and integrated circuits is taken into account.
Tagreed Ali and Piyush Maheshwari
Blockchain technology, renowned for its decentralization, security, reliability, and data integrity, has the potential to revolutionize businesses globally. However, its full…
Abstract
Blockchain technology, renowned for its decentralization, security, reliability, and data integrity, has the potential to revolutionize businesses globally. However, its full potential remains unrealized due to adoption barriers, necessitating further studies to address these challenges. Identifying these barriers is crucial for businesses and practitioners to effectively tackle them. This systematic review analyzed 70 eligible studies out of 1944 gathered from various databases to understand and identify common blockchain adoption barriers. The Technology–Organization–Environment (TOE) framework was the most popular theory used in these studies. Despite differences in variable definitions, financial constraints, lack of stakeholder collaboration and coordination, and social influences like resistance to change and negative perceptions emerged as the top three barriers. The supply chain domain had the highest number of studies on blockchain adoption. Notably, there was a significant increase in studies addressing blockchain adoption in 2023, comprising 34.2% of the total reviewed studies. This review provides a comprehensive overview of identified barriers, serving as a valuable foundation for future research. Understanding these challenges allows researchers to design targeted studies aimed at developing solutions, strategies, and innovations to overcome obstacles hindering blockchain adoption.