Sung Yi and Robert Jones
This paper aims to present a machine learning framework for using big data analytics to predict the reliability of solder joints. The purpose of this study is to accurately…
Abstract
Purpose
This paper aims to present a machine learning framework for using big data analytics to predict the reliability of solder joints. The purpose of this study is to accurately predict the reliability of solder joints by using big data analytics.
Design/methodology/approach
A machine learning framework for using big data analytics is proposed to predict the reliability of solder joints accurately.
Findings
A machine learning framework for predicting the life of solder joints accurately has been developed in this study. To validate its accuracy and efficiency, it is applied to predict the long-term reliability of lead-free Sn96.5Ag3.0Cu0.5 (SAC305) for three commonly used surface finishes such OSP, ENIG and IAg. The obtained results show that the predicted failure based on the machine learning method is much more accurate than the Weibull method. In addition, solder ball/bump joint failure modes are identified based on various solder joint failures reported in the literature.
Originality/value
The ability to predict thermal fatigue life accurately is extremely valuable to the industry because it saves time and cost for product development and optimization.
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C. Andersson, B. Vandevelde, C. Noritake, P. Sun, P.E. Tegehall, D.R. Andersson, G. Wetter and J. Liu
The purpose of this paper is to assess the effect of different temperature cycling profiles on the reliability of lead‐free 388 plastic ball grid array (PBGA) packages and to…
Abstract
Purpose
The purpose of this paper is to assess the effect of different temperature cycling profiles on the reliability of lead‐free 388 plastic ball grid array (PBGA) packages and to deeply understand crack initiation and propagation.
Design/methodology/approach
Temperature cycling of Sn‐3.8Ag‐0.7Cu PBGA packages was carried out at two temperature profiles, the first ranging between −55°C and 100°C (TC1) and the second between 0°C and 100°C (TC2). Crack initiation and propagation was analyzed periodically and totally 7,000 cycles were run for TC1 and 14,500 for TC2. Finite element modeling (FEM), for the analysis of strain and stress, was used to corroborate the experimental results.
Findings
The paper finds that TC1 had a characteristic life of 5,415 cycles and TC2 of 14,094 cycles, resulting in an acceleration factor of 2.6 between both profiles. Cracks were first visible for TC1, after 2,500 cycles, and only after 4,000 cycles for TC2. The crack propagation rate was faster for TC1 compared to TC2, and faster at the package side compared to the substrate side. The difference in crack propagation rate between the package side and substrate side was much larger for TC1 compared to TC2. Cracks developed first at the package side, and were also larger compared to the substrate side. The Cu tracks on the substrate side affected the crack propagation sites and behaved as SMD. All cracks propagated through the solder and crack propagation was mainly intergranular. Crack propagation was very random and did not follow the distance to neutral point (DNP) theory. FEM corroborated the experimental results, showing both the same critical location of highest creep strain and the independence of DNP.
Originality/value
Such extensive work on the reliability assessment of Pb‐free 388 PBGA packages has never been performed. This work also corroborates the results from other studies showing the difference in behavior between Pb‐free and Pb‐containing alloys.
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Richard Williams has been appointed to the Board of Micaply International as Marketing Director. He has extensive experience of the European printed circuit industry with periods…
Abstract
Richard Williams has been appointed to the Board of Micaply International as Marketing Director. He has extensive experience of the European printed circuit industry with periods spent in the UK, Sweden and Germany.
Eiichi Taniguchi and Tadashi Yamada
This paper presents integrated models of probabilistic vehicle routing and scheduling model with time windows and dynamic traffic simulation. The probabilistic model incorporates…
Abstract
This paper presents integrated models of probabilistic vehicle routing and scheduling model with time windows and dynamic traffic simulation. The probabilistic model incorporates the uncertainty of travel times. After applying the models to test road network, incorporating the uncertainty of travel times using the models not only allows freight carriers to reduce their total costs, but also improves the environment in terms of decreasing CO2 emissions. As well, the paper investigated the effects and profitability of co-operative freight transport systems using a simulation model based on forecast vehicle routing and scheduling model. Results showed cooperative freight transport systems can lead to a substantial reduction in total delivery costs and total travel times within the whole road network.
Eiichi Taniguchi, Russell G Thompson, Tadashi Yamada and Ron Van Duin
The purpose of this paper is to look at Geert Hofstede's five dimensions of culture.
Abstract
Purpose
The purpose of this paper is to look at Geert Hofstede's five dimensions of culture.
Design/methodology/approach
Reviews Hofstede's web site and numerous of his writings.
Findings
The distinctive sites mentioned are a reflection of Swedish and Japanese dimensions of culture respectively. In a global village, where the web is almost ubiquitous, this kind of understanding is more important than ever.
Originality/value
Considers the value that Hofstede's paradigm, or perhaps another cross‐cultural analytical tool, might have in enhancing understanding of web design and usability.
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Drawing on the literature from cognitive neuroscience and auditing research on professional skepticism (PS), this paper identifies new research questions, determinants, and…
Abstract
Drawing on the literature from cognitive neuroscience and auditing research on professional skepticism (PS), this paper identifies new research questions, determinants, and theories that may resolve current problem areas in PS research. We identify the following PS research areas that neuroscientific perspectives can potentially improve: 1) theory, 2) trust, 3) trait and state skepticism, 4) deception/fraud detection, and 5) skeptical judgment and action. The paper concludes with a discussion of the critical question of whether integrating a neuroscientific perspective in PS research is worthwhile and provides further direction for future research.
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Eiichi Taniguchi, Russell G Thompson, Tadashi Yamada and Ron van Duin
This chapter complements the one that appeared as “History of the AIB Fellows: 1975–2008” in Volume 14 of this series (International Business Scholarship: AIB Fellows on the First…
Abstract
This chapter complements the one that appeared as “History of the AIB Fellows: 1975–2008” in Volume 14 of this series (International Business Scholarship: AIB Fellows on the First 50 Years and Beyond, Jean J. Boddewyn, Editor). It traces what happened under the deanship of Alan Rugman (2011–2014) who took many initiatives reported here while his death in July 2014 generated trenchant, funny, and loving comments from more than half of the AIB Fellows. The lives and contributions of many other major international business scholars who passed away from 2008 to 2014 are also evoked here: Endel Kolde, Lee Nehrt, Howard Perlmutter, Stefan Robock, John Ryans, Vern Terpstra, and Daniel Van Den Bulcke.