Violeta Carvalho, Bruno Arcipreste, Delfim Soares, Luís Ribas, Nelson Rodrigues, Senhorinha Teixeira and José C. Teixeira
This study aims to determine the minimum force required to pull out a surface mount component in printed circuit boards (PCBs) during the wave soldering process through both…
Abstract
Purpose
This study aims to determine the minimum force required to pull out a surface mount component in printed circuit boards (PCBs) during the wave soldering process through both experimental and numerical procedures.
Design/methodology/approach
An efficient experimental technique was proposed to determine the minimum force required to pull out a surface mount component in PCBs during the wave soldering process.
Findings
The results showed that the pullout force is approximately 0.4 N. Comparing this value with the simulated force exerted by the solder wave on the component (
Originality/value
This study provides a deep understanding of the wave soldering process regarding the component pullout, a critical issue that usually occurs in the microelectronics industry during this soldering process. By applying both accurate experimental and numerical approaches, this study showed that more tests are needed to evaluate the main cause of this problem, as well as new insights were provided into the depositing process of glue dots on PCBs.