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Article
Publication date: 1 August 2004

John Lau, Dongkai Shangguan, Todd Castello, Rob Horsley, Joe Smetana, Nick Hoo, Walter Dauksher, Dave Love, Irv Menis and Bob Sullivan

Failure analyses of the lead‐free and SnPb solder joints of high‐density packages such as the plastic ball grid array and the ceramic column grid array soldered on SnCu hot‐air…

798

Abstract

Failure analyses of the lead‐free and SnPb solder joints of high‐density packages such as the plastic ball grid array and the ceramic column grid array soldered on SnCu hot‐air solder levelling electroless nickel‐immersion gold or NiAu, and organic solderability preservative Entek printed circuit boards are presented. Emphasis is placed on determining the failure locations, failure modes, and intermetallic compound composition for these high‐density packages' solder joints after they have been through 7,500 cycles of temperature cycling. The present results will be compared with those obtained from temperature cycling and finite element analysis.

Details

Soldering & Surface Mount Technology, vol. 16 no. 2
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 11 April 2008

John Lau, Jerry Gleason, Valeska Schroeder, Gregory Henshall, Walter Dauksher and Bob Sullivan

The High Density Packaging Users Group Consortium has conducted a study of process development and solder‐joint reliability of high‐density packages on printed circuit boards…

480

Abstract

Purpose

The High Density Packaging Users Group Consortium has conducted a study of process development and solder‐joint reliability of high‐density packages on printed circuit boards (PCB) using a low‐melting temperature lead‐free solder. The purpose of this paper is to investigate the reliability tests (e.g. temperature cycling and shock and vibration) and failure analysis (FA) of high‐density packages on PCB with the low‐melting temperature lead‐free solder (Sn‐57 wt%Bi‐1 wt%Ag).

Design/methodology/approach

The design for reliability, materials, and assembly process aspects of the project have been discussed in “Design, materials, and assembly process of high‐density packages with a low‐temperature lead‐free solder (SnBiAg)” also published in this journal issue. In this study, reliability tests (e.g. temperature cycling and shock and vibration) and FA of high‐density packages on PCB with the low‐melting temperature lead‐free solder (Sn‐57 wt%Bi‐1 wt%Ag) are investigated.

Findings

Lead‐free solder‐joint reliability of high‐density packages, such as the PBGA388, PBGA256, PBGA208, PBGA196, PBGA172, PQFP80, and TSSOP56 were determined by temperature cycling, shock, and vibration tests. Temperature cycling test data for over 8,100 cycles between 0 and 100°C in a 44 min. cycle were statistically analyzed. Shock and vibration test data based on the HP Standard Class Bi‐II Products SPEC have also been reported.

Originality/value

Currently there is a lack of experimental and simulation data and field experience in respect of one of the critical issues for industry – that of solder joint reliability in lead‐free soldering. The paper contains some important research results and recommendations.

Details

Soldering & Surface Mount Technology, vol. 20 no. 2
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 1 April 2004

John Lau, Walter Dauksher, Joe Smetana, Rob Horsley, Dongkai Shangguan, Todd Castello, Irv Menis, Dave Love and Bob Sullivan

The lead‐free solder joint reliability of several printed circuit board mounted high‐density packages, when subjected to temperature cycling was investigated by finite element…

719

Abstract

The lead‐free solder joint reliability of several printed circuit board mounted high‐density packages, when subjected to temperature cycling was investigated by finite element modelling. The packages were a 256‐pin plastic ball grid array (PBGA), a 388‐pin PBGA, and a 1657‐pin ceramic column grid array. Emphasis was placed on the determination of the creep responses (e.g. stress, strain, and strain energy density) of the lead‐free solder joints of these packages.

Details

Soldering & Surface Mount Technology, vol. 16 no. 1
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 1 April 2004

Joe Smetana, Rob Horsley, John Lau, Ken Snowdon, Dongkai Shangguan, Jerry Gleason, Irv Memis, Dave Love, Walter Dauksher and Bob Sullivan

The High Density Packaging Users Group conducted a substantial study of the solder joint reliability of high‐density packages using lead‐free solder. The design, material, and…

706

Abstract

The High Density Packaging Users Group conducted a substantial study of the solder joint reliability of high‐density packages using lead‐free solder. The design, material, and assembly process aspects of the project are addressed in this paper. The components studied include many surface mount technology package types, various lead, and printed circuit board finishes and paste‐in‐hole assembly.

Details

Soldering & Surface Mount Technology, vol. 16 no. 1
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 1 August 2004

John Lau, Nick Hoo, Rob Horsley, Joe Smetana, Dongkai Shangguan, Walter Dauksher, Dave Love, Irv Menis and Bob Sullivan

Temperature cycling tests, and statistical analysis of the results, for various high‐density packages on printed‐circuit boards with Sn‐Cu hot‐air solder levelling, electroless…

899

Abstract

Temperature cycling tests, and statistical analysis of the results, for various high‐density packages on printed‐circuit boards with Sn‐Cu hot‐air solder levelling, electroless nickel‐immersion gold, and organic solder preservative finishes are investigated in this study. Emphasis is placed on the determination of the life distribution and reliability of the lead‐free solder joints of these high‐density package assemblies while they are subjected to temperature cycling conditions. A data acquisition system, the relevant failure criterion, and the data extraction method will be presented and examined. The life test data are best fitted to the Weibull distribution. Also, the sample mean, population mean, sample characteristic life, true characteristic life, sample Weibull slope, and true Weibull slope for some of the high‐density packages are provided and discussed. Furthermore, the relationship between the reliability and the confidence limits for a life distribution is established. Finally, the confidence levels for comparing the quality (mean life) of lead‐free solder joints of high‐density packages are determined.

Details

Soldering & Surface Mount Technology, vol. 16 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

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Article
Publication date: 11 April 2008

John Lau, Jerry Gleason, Valeska Schroeder, Gregory Henshall, Walter Dauksher and Bob Sullivan

The purpose of this paper is to discuss the design, materials, and assembly process aspects of a study, conducted by The High Density Packaging Users Group Consortium, into…

629

Abstract

Purpose

The purpose of this paper is to discuss the design, materials, and assembly process aspects of a study, conducted by The High Density Packaging Users Group Consortium, into process development and solder joint reliability of high‐density packages on printed circuit boards using a low‐melting temperature lead‐free solder (Sn‐57 wt%Bi‐1 wt%Ag).

Design/methodology/approach

The components studied include several SMT package types and various lead configurations. The assembly process addresses the low‐temperature lead‐free assembly process, inspection and analysis of these boards and packages.

Findings

It was found that, the assembly process of the SnBiAg lead‐free test boards is very robust and the assembly yield is almost 100 percent.

Originality/value

The paper is of value by presenting a description of the rationale and material set used for an experiment to test SMT assembly and reliability characteristics using the 57Bi‐42Sn‐1Ag alloy, which has a melting point of 139°C.

Details

Soldering & Surface Mount Technology, vol. 20 no. 2
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 1 November 1999

Alex M. Andrew

Comments on the Internet, giving details of new facilities and provisions that are of specific interest to systemists and cyberneticians. They include: Computers for Net access…

221

Abstract

Comments on the Internet, giving details of new facilities and provisions that are of specific interest to systemists and cyberneticians. They include: Computers for Net access, Personal Web site, International access, Choice of Internet service provider and the integral environment.

Details

Kybernetes, vol. 28 no. 8
Type: Research Article
ISSN: 0368-492X

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Article
Publication date: 24 May 2011

Howard Thomas and Eric Cornuel

The purpose of this paper is to present details of this special issue, that has as its theme: “Business school futures: evaluation and perspectives”.

1823

Abstract

Purpose

The purpose of this paper is to present details of this special issue, that has as its theme: “Business school futures: evaluation and perspectives”.

Design/methodology/approach

The Guest Editors have assembled a set of papers presented at recent AACSB/EFMD meetings to provide further fuel for this important debate.

Findings

Together the papers in this volume provide a set of insights about important themes and perspectives on business schools as we reflect about their future evolution.

Originality/value

The insights presented in this special issue should provide the fuel for continued critical debate and dialogue as we confront the current turning points in management education and also develop future strategies for the continued success and evolution of the business school in the modern university.

Details

Journal of Management Development, vol. 30 no. 5
Type: Research Article
ISSN: 0262-1711

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Article
Publication date: 1 January 2006

Robert E. Holtfreter and Kristy Holtfreter

To examine identity theft in the United States and to provide an overview and assessment of recent legislation designed to assist identity theft victims and punish offenders.

855

Abstract

Purpose

To examine identity theft in the United States and to provide an overview and assessment of recent legislation designed to assist identity theft victims and punish offenders.

Design/methodology/approach

Statistics on the prevalence of identity theft are included, as well as details from a fact‐based, fairly typical case of identify theft. An overview of the Fair and Accurate Credit Transactions Act (FACTA) and the Identity Theft Penalty Act (ITPEA) are provided, and the provisions of each act are analyzed.

Findings

It will take time to determine to what extent the provisions in FACTA and ITPEA will prevent or reduce identity theft. No doubt, in the future, there will amendments to both acts.

Research limitations/implications

Future empirical studies could inform all interested parties by examining the impact of the FACTA and ITPEA over a multi‐year time frame. Moreover, cross‐cultural comparisons focusing on the ways in which other nations address identity theft will also shed light on the issues discussed herein.

Originality/value

The topic of identity theft remains salient to researchers as well as criminal justice practitioners and victim advocates. Public education to increase knowledge of identity theft, and to provide information and resources for victims, will be critical in the future.

Details

Journal of Financial Crime, vol. 13 no. 1
Type: Research Article
ISSN: 1359-0790

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Article
Publication date: 1 January 1992

Larry Davis Browning, James J. Ziaja and Debra R. France

Reviews the Baldrige Award as a modern document and views CompuAddas a post‐modern organization. Traces the steps of CompuAdd′sapplication for the Baldrige Award and shows…

119

Abstract

Reviews the Baldrige Award as a modern document and views CompuAdd as a post‐modern organization. Traces the steps of CompuAdd′s application for the Baldrige Award and shows CompuAdd′s culture to be excellent local practices, that are different from the Baldrige Award criteria, and that, despite their local excellence, would be difficult to transfer to another setting.

Details

Journal of Organizational Change Management, vol. 5 no. 1
Type: Research Article
ISSN: 0953-4814

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