Search results

1 – 1 of 1
Per page
102050
Citations:
Loading...
Access Restricted. View access options
Article
Publication date: 1 August 1998

David L. Cusick, William F. Knight and Bob Madeiros

Dealing with forming and tinning in a low‐volume high‐reliability environment is a never‐ending challenge. This process is one of the most critical steps in SMT fabrication. The…

240

Abstract

Dealing with forming and tinning in a low‐volume high‐reliability environment is a never‐ending challenge. This process is one of the most critical steps in SMT fabrication. The effects of forming and tinning contribute to a majority of the defects found at final inspection. The intention of this paper is to describe in detail the forming and tinning process and all that it entails. The topics include: forming, tinning, converting to an automated process, process control techniques, and statistical process capability.

Details

Soldering & Surface Mount Technology, vol. 10 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

1 – 1 of 1
Per page
102050