Arun Chandrasekhar, Eric Beyne, Walter De Raedt, Bart Nauwelaers and Tania Van Bever
This paper highlights the electrical behaviour of the interconnects on a 120‐pin Ball Grid Array (BGA) package from 500 MHz upto 8 GHz. The measurements are made using IMEC's…
Abstract
This paper highlights the electrical behaviour of the interconnects on a 120‐pin Ball Grid Array (BGA) package from 500 MHz upto 8 GHz. The measurements are made using IMEC's MCM‐D thin film technology as the substrate and with a test set‐up called MoPoM (MCM‐on‐Package‐on‐MCM). The interconnects are classified based on length and measured with adjacent interconnects grounded as well as floating. Circuit models are extracted from the measurement and the simulation respectively for an RF interconnect including the wirebond. Comparison of the circuit models with each other and with the measurement show agreement atleast upto 6 GHz. One of the interconnects is also measured before and after globtopping and a considerable change in the impedance match is observed. The effect of package loading is found to be negligible.
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Hasan Ymeri, Bart Nauwelaers, Karen Maex and David De Roest
A new method for analysis of IC interconnects propagation parameters is suggested. A potential integral formalism is employed that enables us to express general solutions for the…
Abstract
A new method for analysis of IC interconnects propagation parameters is suggested. A potential integral formalism is employed that enables us to express general solutions for the scalar potential in each layer of a multilayer model. These expressions for potential led to the derivation of an equation for calculating the line parameters of interconnect lines in such a multilayer configuration. This approach is verified by two‐dimensional examples of the integrated circuit interconnects with errors within 0.5 per cent to 1 per cent.