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Article
Publication date: 4 January 2018

Ervina Efzan Mhd Noor, Baaljinder R. and Emerson J.

The purpose of this study is to investigate the effect of electromigration (EM) on solder alloy joint on copper with nickel surface finish. Sn-Bi solder alloy has been used in…

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Abstract

Purpose

The purpose of this study is to investigate the effect of electromigration (EM) on solder alloy joint on copper with nickel surface finish. Sn-Bi solder alloy has been used in this research.

Design/methodology/approach

The EM process was completed with the duration of 0, 24, 48, 72 and 96 h under direct current (DC) of 1,000 mA. Tensile stress on the substrates was assessed after EM at a tension rate of 0.1 mm/min. Microscopy was used to observe the formation and size of voids and conduct an analysis between copper and nickel substrates.

Findings

Four types of intermetallic compounds (IMCs), namely, Cu-Sn, Cu3Sn, Cu6Sn5, and Sn-Bi, were detected between the Sn-Bi/Co solder joint. Voids appear to be at the anode and the cathode for 96 h of EM for Sn-Bi/Ni solder join; however, there seem to be more voids at the cathode.

Originality/value

EM is one of the crucial keys to produce a good integrated circuit (IC). When the current density is extremely high and will cause the metal ions to move into the electron direction flow, it will be characterised based on the ion flux density. In this research, the effect of EM on the Sn-Bi solder alloy joint on copper with nickel surface finish was studied.

Details

Soldering & Surface Mount Technology, vol. 30 no. 1
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 4 April 2022

Lina Syazwana Kamaruzzaman and Yingxin Goh

This paper aims to review recent reports on mechanical properties of Sn-Bi and Sn-Bi-X solders (where X is an additional alloying element), in terms of the tensile properties…

710

Abstract

Purpose

This paper aims to review recent reports on mechanical properties of Sn-Bi and Sn-Bi-X solders (where X is an additional alloying element), in terms of the tensile properties, hardness and shear strength. Then, the effects of alloying in Sn-Bi solder are compared in terms of the discussed mechanical properties. The fracture morphologies of tensile shear tested solders are also reviewed to correlate the microstructural changes with mechanical properties of Sn-Bi-X solder alloys.

Design/methodology/approach

A brief introduction on Sn-Bi solder and reasons to enhance the mechanical properties of Sn-Bi solder. The latest reports on Sn-Bi and Sn-Bi-X solders are combined in the form of tables and figures for each section. The presented data are discussed by comparing the testing method, technical setup, specimen dimension and alloying element weight percentage, which affect the mechanical properties of Sn-Bi solder.

Findings

The addition of alloying elements could enhance the tensile properties, hardness and/or shear strength of Sn-Bi solder for low-temperature solder application. Different weight percentage alloying elements affect differently on Sn-Bi solder mechanical properties.

Originality/value

This paper provides a compilation of latest report on tensile properties, hardness, shear strength and deformation of Sn-Bi and Sn-Bi-X solders and the latest trends and in-depth understanding of the effect of alloying elements in Sn-Bi solder mechanical properties.

Details

Soldering & Surface Mount Technology, vol. 34 no. 5
Type: Research Article
ISSN: 0954-0911

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