Masrizal, Raditya Sukmana, Bayu Arie Fianto and Rifyal Zuhdi Gultom
This paper aims to examine the relationship between economic freedom and Islamic rural banks' efficiency in the case of Indonesia.
Abstract
Purpose
This paper aims to examine the relationship between economic freedom and Islamic rural banks' efficiency in the case of Indonesia.
Design/methodology/approach
The study covers 40 Islamic rural banks in 34 Indonesian regions from 2014 to 2020. Tobit regression is utilized to expose the impact of economic freedom on the efficiency of Islamic rural banks, and nonparametric frontier data envelopment analysis is used to acquire banks' technical efficiency.
Findings
The findings reveal that overall economic freedom has a strong favorable impact on the efficiency of Islamic rural banks. The study’s breakdown components suggest that business freedom, government spending and investment freedom are favorable indicators, whereas government integrity and tax burden are negative indicators, and all indicators agree with previous studies.
Practical implications
This research can serve as a guideline for Islamic rural bank management in terms of maintaining financial efficiency. The government should think about the ramifications of financial sector liberalization and reforms, according to these findings. When financial intermediaries operate in a less constrained environment, they are more likely to pursue competitive practices that increase their operating rate and other efficiency metrics. Finally, academics might utilize this information to investigate the economic flexibility of Islamic rural banks.
Originality/value
The novelty of this study is in using data envelopment analysis and Tobit regression to identify economic freedom and Islamic rural banks' efficiency. To the best of the authors' knowledge, the study of the role of economic freedom in Islamic rural bank's efficiency is limited, particularly in the context of Indonesia.
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Federica Miglietta, Matteo Foglia and Gang-Jin Wang
This study aims to examine information (stock return, volatility and extreme risk) spillovers and interconnectedness within dual-banking systems.
Abstract
Purpose
This study aims to examine information (stock return, volatility and extreme risk) spillovers and interconnectedness within dual-banking systems.
Design/methodology/approach
Using multilayer information spillover networks, this paper conduct a deep analysis of contagion dynamics among 24 Islamic and 46 conventional banks from 2006 to 2022.
Findings
The findings show the network’s rapid response to financial shocks. Through cross-sector analysis, this paper identify information spillovers between and within Islamic and conventional banking systems. Furthermore, this research illustrates distinct roles played by Islamic and conventional banks within the multilayer network structure, contingent upon the nature of the financial shock.
Practical implications
Understanding the differential roles of Islamic and conventional banks in information transmission can aid policymakers and financial institutions in devising more effective risk management strategies, thereby enhancing financial stability within dual-banking systems.
Originality/value
This study contributes to the literature by emphasizing the necessity of examining contagion mechanisms beyond traditional single-layer network structures, shedding light on the shadow dynamics of information transmission in dual-banking systems.
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Ummi Ibrahim Atah, Mustafa Omar Mohammed, Abideen Adewale Adeyemi and Engku Rabiah Adawiah
The purpose of this paper is to propose a model that will demonstrate how the integration of Salam (exclusive agricultural commodity trade) with Takaful (micro-Takaful – a…
Abstract
Purpose
The purpose of this paper is to propose a model that will demonstrate how the integration of Salam (exclusive agricultural commodity trade) with Takaful (micro-Takaful – a subdivision of Islamic insurance) and value chain can address major challenges facing the agricultural sector in Kano State, Nigeria.
Design/methodology/approach
The study conducted a thorough and critical analysis of relevant literature and existing models of financing agriculture in Nigeria to come up with the proposed model.
Findings
The findings indicate that measures undertaken to address the major challenges fail. In view of this, this study proposed Bay-Salam with Takaful and value chain model to solve a number of challenges such as poor access to financing, poor marketing and pricing, delay, collateral requirement and risk issues in order to avail farmers with easy access to finance and provide effective security to financial institutions.
Research limitations/implications
The paper is limited to using secondary data. Therefore, empirical investigation can be carried out to strengthen the validation of the model.
Practical implications
The study outcome seeks to improve the productivity of the farmers through enhancing their access to finance. This will increase their level of production and provide more employment opportunities. In addition, it will boost financial inclusion, income generation, poverty alleviation, standard of living, food security and overall economic growth and development.
Originality/value
The novelty of this study lies in the integration of classical Bay-Salam with Takaful and value chain and create a unique model structure which the researchers do not come across in any research that presented it in Nigeria.
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Sumant Kumar, B.V. Rathish Kumar, S.V.S.S.N.V.G. Krishna Murthy and Deepika Parmar
Thermo-magnetic convective flow analysis under the impact of thermal radiation for heat and entropy generation phenomena is an active research field for understanding the…
Abstract
Purpose
Thermo-magnetic convective flow analysis under the impact of thermal radiation for heat and entropy generation phenomena is an active research field for understanding the efficiency of thermodynamic systems in various engineering sectors. This study aims to examine the characteristics of convective heat transport and entropy generation within an inverted T-shaped porous enclosure saturated with a hybrid nanofluid under the influence of thermal radiation and magnetic field.
Design/methodology/approach
The mathematical model incorporates the Darcy-Forchheimer-Brinkmann model and considers thermal radiation in the energy balance equation. The complete mathematical model has been numerically simulated through the penalty finite element approach at varying values of flow parameters, such as Rayleigh number (Ra), Hartmann number (Ha), Darcy number (Da), radiation parameter (Rd) and porosity value (e). Furthermore, the graphical results for energy variation have been monitored through the energy-flux vector, whereas the entropy generation along with its individual components, namely, entropy generation due to heat transfer, fluid friction and magnetic field, are also presented. Furthermore, the results of the Bejan number for each component are also discussed in detail. Additionally, the concept of ecological coefficient of performance (ECOP) has also been included to analyse the thermal efficiency of the model.
Findings
The graphical analysis of results indicates that higher values of Ra, Da, e and Rd enhance the convective heat transport and entropy generation phenomena more rapidly. However, increasing Ha values have a detrimental effect due to the increasing impact of magnetic forces. Furthermore, the ECOP result suggests that the rising value of Da, e and Rd at smaller Ra show a maximum thermal efficiency of the mathematical model, which further declines as the Ra increases. Conversely, the thermal efficiency of the model improves with increasing Ha value, showing an opposite trend in ECOP.
Practical implications
Such complex porous enclosures have practical applications in engineering and science, including areas like solar power collectors, heat exchangers and electronic equipment. Furthermore, the present study of entropy generation would play a vital role in optimizing system performance, improving energy efficiency and promoting sustainable engineering practices during the natural convection process.
Originality/value
To the best of the authors’ knowledge, this study is the first ever attempted detailed investigation of heat transfer and entropy generation phenomena flow parameter ranges in an inverted T-shaped porous enclosure under a uniform magnetic field and thermal radiation.
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Abstract
Purpose
To study the effect of Ag content on the melting temperature and wetting properties of Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga lead‐free Solders.
Design/methodology/approach
The solder alloys used in the experiment were Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga (x=0, 0.1, 0.3, 0.5, 1 and 1.5). In this study, the alloys were initially studied using differential scanning calorimetry to determine their melting temperatures. Afterward, the solderability of the solders was studied using wetting balance and contact angle methods. Moreover, the microstructures of the solders were also investigated with an optical microscope, scanning electron microscope, energy dispersive X‐ray, X‐ray diffraction and electron probe micro analysis.
Findings
A small increase in Ag content in the Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga solders, from 0.1 to 1.0 wt%, has been found to lower their solidus temperature from 198.05°C to 190.20°C. A Ag content of 1.5 wt% increased the solidus temperature of the studied solder systems to 197.79°C. Furthermore, the study also found that the addition of silver lowered the wetting forces of the studied solders. The formation of multi‐intermetallic layers of Cu‐Zn and Ag‐Zn at the interface between the studied solders and copper might explain the reduction of the wetting forces.
Research limitations/implications
The silver contents in the studied Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga solders were limited to 0, 0.1, 0.3, 0.5, 1.0 and 1.5 wt%.
Practical implications
Useful literature for solder alloy designers and SMT engineers.
Originality/value
The paper provides the answers to the research question of what is the effect of silver content on the melting temperature and wetting properties of Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga solders.
Habib Ahmed, Faruq Arif Tajul Ariffin, Yusuf Karbhari and Zurina Shafii
Since International Financial Reporting Standards (IFRS) are not primarily meant for the accounting needs of Islamic banks, the Accounting and Auditing Organisation for Islamic…
Abstract
Purpose
Since International Financial Reporting Standards (IFRS) are not primarily meant for the accounting needs of Islamic banks, the Accounting and Auditing Organisation for Islamic Financial Institutions (AAOIFI) was established to develop specific accounting standards for Shari’ah compliance. The purpose of this paper is to assess the de jure harmonisation between the disclosure requirements of the IFRS-based Malaysian Accounting Standards (MAS) and those of the AAOIFI.
Design/methodology/approach
Using Malaysia as a case study, the paper examines the extent of the de jure congruence between the IFRS-based MAS and AAOIFI’s Financial Accounting Standard No 1 (FAS1), which is considered to be one of the key disclosure standards for Islamic banks. We employ leximetrics and content analysis to analyse these accounting standards and the additional guidelines introduced by the Malaysian Accounting Standards Board (MASB) and the Central Bank of Malaysia (Bank Negara Malaysia, BNM) to identify the gaps between different tiers of MAS and FAS1.
Findings
The study finds that de jure congruence between the IFRS-based MAS and AAOIFI standards has improved through the introduction of additional accounting guidelines by both the MASB and the banking regulator, BNM. However, some gaps remain between the two standards. These gaps may be difficult to completely eliminate due to differences in the fundamental principles underlying the development of both standards.
Originality/value
While some studies have explored the de facto congruence between AAOIFI accounting standards and others, this paper is the first, to the best of the authors’ knowledge, to examine the de jure congruence between those standards with the IFRS-based MAS.
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B. Salam, C. Virseda, H. Da, N.N. Ekere and R. Durairaj
A study of the Sn‐Ag‐Cu lead‐free solder reflow profile has been conducted. The purpose of the work was to determine the Sn‐Ag‐Cu reflow profile that produced solder bumps with a…
Abstract
A study of the Sn‐Ag‐Cu lead‐free solder reflow profile has been conducted. The purpose of the work was to determine the Sn‐Ag‐Cu reflow profile that produced solder bumps with a thin intermetallic compound (IMC) layer and fine microstructure. Two types of reflow profiles were studied. The results of the experiment indicated that the most significant factor in achieving a joint with a thin IMC layer and fine microstructure was the peak temperature. The results suggest that the peak temperature for the Sn‐Ag‐Cu lead‐free solder should be 230°C. The recommended time above liquidus is 40 s for the RSS reflow profile and 50‐70 s for the RTS reflow profile.
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Abstract
Purpose
The purpose of this paper is to study the influence of silver on the high‐temperature oxidation behaviour of the Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga (x=0, 0.1, 0.3 and 0.5) solder alloys.
Design/methodology/approach
The weight gains of the studied solders are measured using thermal gravimetric analyzers (TGA) at temperatures of 250, 300, 350 and 400°C. The weight gains measured are used to compare the oxidation behaviour of the studied solders. The surfaces of the solders are also analyzed with Auger emission spectroscopy (AES) depth profiling and thin‐film X‐ray diffractometry (thin‐film XRD) to identify the elements present on the surface of the studied solders.
Findings
The TGA results show that the weight gains decrease with increasing silver content in the studied solders. It meant that increasing silver content could help improve the high‐temperature oxidation behaviour of the studied solder. AES and thin‐film XRD confirm that the formed oxide layers on the surface of the studied solder are Zn‐based oxide layers.
Originality/value
The findings of this paper will help provide an understanding of the effects of silver on Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga solder.
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Can B. Kalayci, Olcay Polat and Surendra M. Gupta
The purpose of this paper is to efficiently solve disassembly line balancing problem (DLBP) and the sequence-dependent disassembly line balancing problem (SDDLBP) which are both…
Abstract
Purpose
The purpose of this paper is to efficiently solve disassembly line balancing problem (DLBP) and the sequence-dependent disassembly line balancing problem (SDDLBP) which are both known to be NP-complete.
Design/methodology/approach
This manuscript utilizes a well-proven metaheuristics solution methodology, namely, variable neighborhood search (VNS), to address the problem.
Findings
DLBPs are analyzed using the numerical instances from the literature to show the efficiency of the proposed approach. The proposed algorithm showed superior performance compared to other techniques provided in the literature in terms of robustness to reach better solutions.
Practical implications
Since disassembly is the most critical step in end-of-life product treatment, every step toward improving disassembly line balancing brings us closer to cost savings and compelling practicality.
Originality/value
This paper is the first adaptation of VNS algorithm for solving DLBP and SDDLBP.
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Jianbiao Pan, Brian J. Toleno, Tzu‐Chien Chou and Wesley J. Dee
The purpose of this work is to study the effect of the reflow peak temperature and time above liquidus on both SnPb and SnAgCu solder joint shear strength.
Abstract
Purpose
The purpose of this work is to study the effect of the reflow peak temperature and time above liquidus on both SnPb and SnAgCu solder joint shear strength.
Design/methodology/approach
Nine reflow profiles for Sn3.0Ag0.5Cu and nine reflow profiles for Sn37Pb have been developed with three levels of peak temperature (230°C, 240°C, and 250°C for Sn3.0Ag0.5Cu; and 195°C, 205°C, and 215°C for Sn37Pb) and three levels of time above solder liquidus temperature (30, 60, and 90 s). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear forces for the resistors were measured after assembly. The fracture interfaces were inspected using scanning electron microscopy with energy dispersive spectroscopy in order to determine the failure mode and failure surface morphology.
Findings
The results show that the effects of the peak temperature and the time above solder liquidus temperature are not consistent between different component sizes and between Sn37Pb and Sn3.0Ag0.5Cu solder. The shear force of SnPb solder joints is higher than that of Sn3.0Ag0.5Cu solder joints because the wetting of SnPb is better than that of SnAgCu.
Research limitations/implications
This study finds that fracture occurred partially in the termination metallization and partially in the bulk solder joint. To eliminate the effect of the termination metallization, future research is recommended to conduct the same study on solder joints without component attachment.
Practical implications
The shear strength of both SnPb and SnAgCu solder joints is equal to or higher than that of the termination metallization for the components tested.
Originality/value
Fracture was observed to occur partially in the termination metallization (Ag layer) and partially in the bulk solder joint. Therefore, it is essential to inspect the fracture interfaces when comparing solder joint shear strength.