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The effect of ultrasonic agitation on hybrid devices during PCB cleaning has long been suspected as leading to device malfunction. However, little or no data exist to substantiate or quantify these effects. This paper describes a limited study into these effects using both test vehicles and commercial products, and discusses their variation with exposure time, the types and mechanisms of failure, and the rle of the hybrid package construction. It is demonstrated that the design of the hybrid package is critical in determining its susceptibility to ultrasonic damage.

Employees’ creativity competency is indeed an unstable, but powerful tool in any development and enhancement of business in creative industry. To understand employee’ assumptions on creativity is crucial for creative industry in recruiting creative personnel, developing organizational creativity training programmes as well as nurturing a creative organization. The paper aims to discuss these issues.

This paper aims to explore some basic assumptions of creativity competency by analysing literatures and creative employees’ feedback from a pilot study. This paper is neither going to define creativity accurately nor measuring employees’ creative outcomes for creative organizations, but rather to understand some basic assumptions of creativity competency in order to trigger further studies in organizational studies.

A pilot investigation has been done to investigate employees’ assumptions of creativity competency, and their expectation of the design of organizational creativity training programmes. The findings of this investigation have contributed to furthering the discussion and development in organizational studies and professional training programmes in creative industry.

Creativity and its training is getting important in developing learning organization nowadays. This paper is a study of the assumptions of employees in creative industry. This fundamental understanding of their assumption is essential for developing organization training and learning models in the future.

Although the use of ultrasonic agitation on quartz crystal devices during PCB cleaning has long been suspected to be detrimental, little or no data exist to substantiate or quantify the resultant effects. This paper summarises the results of a limited study into these effects for a range of quartz crystal devices, using both CFC and aqueous solvents. The variations with exposure time, and the types and mechanisms of failure are discussed. The results are encouraging and suggest that, although these devices are more susceptible to damage than ICs, once manufacturing defects have been screened out they will withstand ultrasonic exposure without deleterious effects for periods several times longer than those used for cleaning PCBs.

The effects of ultrasonic agitation on electronic components during PCB cleaning has long been the subject of controversy. This paper summarises the results of a series of studies into these effects for a range of components using CFC, aqueous and semi‐aqueous cleaning media. The variations with exposure time and power density under various ultrasonic stress conditions (loose, mounted on PCBs, or on purpose‐built test boards) are discussed. The results are encouraging and suggest that there is a large margin of safety when employing currently accepted regimes of operation and good quality components. However, the strong dependence of the damage accumulation on power density emphasises the need to specify and tightly control the power density used.

With the advent of the Montreal Protocol, the removal of flux residues from printed circuit assemblies using solvents based on CFC‐113 is no longer an acceptable option. An alternative range of cleaning technologies is being developed and marketed for this purpose, and the aim of this work was to study the efficiency of a variety of these alternative cleaning regimes after IR reflow soldering. The results indicated that: (i) all the cleaning regimes were capable of removing flux and flux residues after standard IR reflow soldering; (ii) as the level of flux contamination under the components increased, the ability of the cleaning regimes to clean the boards decreased; (iii) the cleaning regimes had varying problems in removing the flux residues after the non‐standard (overheat) IR profile processing; (iv) when additional flux is introduced under the components (i.e., non‐standard IR reflow), the delay between soldering and cleaning becomes important; and (v) the cleaning regimes exhibited a wide variation in their ability to clean under components with small stand‐off heights.

A GENERAL solution is obtained for the diffusion of stress in n equal and equally spaced stringers in a stiffened panel subject to any boundary conditions at the ends of the stringers.

Cubic B‐spline differential quadrature methods have been introduced. As test problems, two different solutions of advection‐diffusion equation are chosen. The first test problem, the transportion of an initial concentration, and the second one, the distribution of an initial pulse, are simulated. The purpose of this paper is to simulate the test problems.

The cubic B‐spline functions are chosen as test functions in order to construct the differential quadrature method. The error between the numerical solutions and analytical solutions are measured using various error norms.

The cubic B‐spline differential quadrature methods have produced acceptable solution for advection‐diffusion equation.

The advection‐diffusion equation has never been solved by any differential quadrature method based on cubic B‐splines.

The study aims to understand the meaning of event-based and place-based community practices, as well as the resulting social impacts.

An ethnomethodological approach was followed (participant observation and interviews were supplemented by secondary data), with the analysis being exploratory and interpretative.

The festival and the place reinforce the community’s social practices, which have impacts beyond the festival, benefiting individuals, the community and the place, becoming a means for valorisation and diffusion of the rural way of life, and placemaking.

In this study the authors focus on social practices in the context of an event and of a place (the village where the event occurs). The authors connect to theories of practice, which they apply in the analysis. The value of the study lies on the underlying mechanisms (how communities exercise social practices in the context of festivals, and what social impacts may lead to) rather than its context-dependent specific results.

National and regional authorities can play a role in providing local communities with adequate tools to overcome the challenges they encounter. This can be done by issuing appropriate (events) plans and policies while giving room for the locals to voice their opinions.

Community-based festivals are key social practices that can strategically impact placemaking, strengthening community bonding, forging connections with outsiders and promoting well-being practices that discourage rural depopulation.

There is a scarcity of research that deepens the understanding of the role of festivals in placemaking and their social impacts, particularly in the rural context. This study contributes to closing this gap by focussing on the social practices of a community-based festival in a village in the interior of Portugal.

National governments, international conferences, some industry associations, and a number of individual companies are increasingly emphasizing the need for a company to take responsibility both for the environmental consequences of its production and for the ultimate disposal or the products it produces. As a result companies are increasingly challenged – by competitors, government regulation, public pressure, or good conscience – to improve and manage their processes and products from both an environmental and an economic standpoint. To be effective, these efforts, to the extent possible, need to address the energy uses and materials flows related to the entire cycle of production, consumption and ultimate disposition. Rules of thumb for environmentally‐conscious manufacturing include improving efficiency and productivity through efficient energy and materials use, substituting more abundant and environmentally preferable materials for those that are rare or environmentally problematic; as well ass recycling and reusing products at the ends of their lives. Expounds on some of the challenges in integrating environmental considerations in design.

An investigation of the use of ultrasonic agitation for cleaning printed circuit boards using CFC‐based solvents has shown that, under the standard conditions required to produce clean assemblies, no damage will occur to the components studied. Damage can only be induced by use of anomalously longer times or higher power densities. In all cases in which damage has been induced, it is of a purely mechanical nature due to fatigue, and is located on the device bond‐wires and/or the package legs. Cleaning using CFC‐based solvents under standard ultrasonic conditions of power density and time etc. is readily achieved within 2 minutes, even with a minimum stand‐off height.