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Article
Publication date: 27 January 2023

Damira Dairabayeva, Asma Perveen and Didier Talamona

Currently on additive manufacturing, extensive research is directed toward mitigating the main challenges associated with multi-material in fused filament fabrication which has a…

1367

Abstract

Purpose

Currently on additive manufacturing, extensive research is directed toward mitigating the main challenges associated with multi-material in fused filament fabrication which has a weak bonding strength between dissimilar materials. Low interfacial bonding strength leads to defects, anisotropy and temperature gradient in materials which negatively impact the mechanical performance of the multi-material prints. The purpose of this study was to assess the performance of different interface geometry designs in terms of the mechanical properties of the specimens.

Design/methodology/approach

Tensile test specimens were printed using: mono-material without a boundary interface, mono-material with the interface geometries (Face-to-face; U-shape; T-shape; Dovetail; Encapsulation; Mechanical interlocking; and Overlap) and multi-material with the interface geometries. The materials chosen with high and low compatibility were Tough polylactic acid (PLA) and TPU.

Findings

The main results of this study indicate that the interface geometries with the mechanical constriction between materials provide better structural integrity to the specimens. Moreover, in the case of the mono-material parts, the most effective interface design was the mechanical interlocking for both Tough PLA and TPU. On the other hand, in the case of multi-material specimens, the encapsulation showed the highest ultimate tensile strength, whereas the overlap and T-shape presented more robust bonding.

Originality/value

This study examines the mechanical performance, particularly tensile strength, strain at break, Young’s modulus and yield strength of different interface designs which were not studied in the previous studies.

Details

Rapid Prototyping Journal, vol. 29 no. 11
Type: Research Article
ISSN: 1355-2546

Keywords

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Article
Publication date: 3 November 2020

Nurul Ain Hidayah Abas, Mei-Hua Lin, Kathleen Otto, Izazol Idris and T. Ramayah

Academia is known for its high competitiveness, with prestige and diverse responsibilities and achievements being decisive determinants of success resulting in academic…

242

Abstract

Purpose

Academia is known for its high competitiveness, with prestige and diverse responsibilities and achievements being decisive determinants of success resulting in academic incivility. This paper extends Lazarus and Folkman's theory of stress by examining the moderating role of interpersonal justice (IJ) , as supervisory support, on academics' job satisfaction and depressivity.

Design/methodology/approach

The study recruited 185 academics from a public university in Malaysia to participate in a survey. Using the partial least squares- structural equation modeling (PLS-SEM) analysis, academic incivility was negatively related to job satisfaction, whilst positively related to depressivity.

Findings

As hypothesized, it was found that the predicted detrimental effect of academic incivility on job satisfaction was buffered by perceiving high IJ from their immediate supervisors, i.e. deans or heads of department. An unanticipated finding was that there was a stronger relationship between academic incivility and depressivity for those academics who perceived high supervisory IJ.

Practical implications

Further, academic management can formulate and revise zero-incivility policies and promote awareness explaining the detrimental impacts of incivility, despite support systems in academia.

Originality/value

This study provides the first empirical evidence showing the differential impact of supervisory IJ on two conditions of incivility–well-being relationships. Work culture and various sources of incivility should be considered for future research.

Details

Journal of Applied Research in Higher Education, vol. 13 no. 4
Type: Research Article
ISSN: 2050-7003

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