Marcin Sloma, Daniel Janczak, Grzegorz Wroblewski, Anna Mlozniak and Malgorzata Jakubowska
New types of substrates were used for fabrication of printed electroluminescent structures. Polymer foils mainly used as substrates for such optoelectronic elements were replaced…
Abstract
Purpose
New types of substrates were used for fabrication of printed electroluminescent structures. Polymer foils mainly used as substrates for such optoelectronic elements were replaced with paper and textiles. Printing on non-transparent substrate requires elaboration of printed transparent electrode, while usually polyester foils with sputtered ITO transparent electrodes are used. The paper aims to discuss these issues.
Design/methodology/approach
Electroluminescent structures were fabricated with elaborated polymer compositions filled with nanomaterials, such as carbon nanotubes and graphene platelets, dielectric and luminophore nanopowders. Structures were printed as “reverse stack”, where transparent electrode is printed on top of the last luminophore layer. For that carbon nanotubes and graphene platelets filled composition was used, deposited with spray-coating technique.
Findings
Main issue with new substrates is proper wetting with the use of screen-printing pastes, and much higher roughness especially for textiles.
Originality/value
Fully functional structures were obtained, but several disadvantages were observed that needs to be eliminated in further studies.
Details
Keywords
Krystyna Bukat, Janusz Sitek, Marek Koscielski, Wojciech Niedzwiedz, Anna Mlozniak and Malgorzata Jakubowska
The purpose of this work is to investigate the influence of carbon nanotube additions to solder paste on the solder joints mechanical strength and their microstructure. In our…
Abstract
Purpose
The purpose of this work is to investigate the influence of carbon nanotube additions to solder paste on the solder joints mechanical strength and their microstructure. In our investigation, the basic solder paste contains 85 wt.% of the commercial Sn96.5Ag3Cu0.5 powder (with the particle sizes in the range of 20‐38 μm) and 15 wt.% of the self‐prepared middle activated rosin flux. To this paste we added the 0.01, 0.05 and 0.1 wt.% of the self‐modified CNT by functionalized them by mineral acid and than esterificated by methanol (FCNTMet) or polyethylene glycol 400 (FCNTPG). After the pastes had stabilized, the reflow soldering process of “zero ohm” chip resistors on PCBs with Ni/Au and SAC (HASL) finishes was carried out and then shear strength of the solder joints was measured. The correlations between the mechanical strength of solder joins without and with the carbon nanotubes and their microstructure were analysed.
Design/methodology/approach
For shear strength measurement of solder joints, the printed circuit boards with Ni/Au and SAC (HASL) finishes was applied. The SAC solder paste with different carbon nanotubes and the basic SAC solder paste as reference were used for this experiment. The automatic SMT line was applied for the paste screen printing; “zero ohms” chip resistors: 0201, 0402, 0603 and 0805 were placing on PWBs and then reflowing according to appropriate time – temperature profile. The shear strength of the solder joints was measured. For the solder joints microstructure analysis, the standard metallographic procedures were applied. Changes in the microstructure, the thickness of the intermetallic compounds and their chemical compositions were observed by means of the SEM equipped with EDS.
Findings
As the authors expected, the SAC solder paste with the carbon nanotubes addition improve the solder joints shear strength of the chip resistors mounted on PCBs with Ni/Au and SAC (HASL) finishes. The carbon nanotubes addition positive effects on IMCs thickness because of blocking their excessive growth.
Research limitations/implications
It is suggested that further studies are necessary for the confirmation of the practical application, especially of the reliability properties of the solder joints obtained using solder paste with chosen carbon nanotubes.
Practical implications
Taking into account the shear strength data, the best results of the “nano” SAC solder pastes were obtained for the lowest addition of the carbon nanotubes modified by esterification process, especially by the methanol compared to the polyethylene glycol 400.
Originality/value
The obtained results made it possible to draw conclusions regarding the correlation between the output of the mechanical results and the amount of the added carbon nanotubes, and also the microstructure and thickness of the IMCs of the “nano” solder joints. It can be useful from practical point of view.