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Article
Publication date: 18 September 2009

Kati Kokko, Hanna Harjunpää, Anna‐Maija Haltia, Pekka Heino and Minna Kellomäki

The purpose of this paper is to study epoxy and parylene C‐coated samples. These coatings are used to protect the electronic devices from harsh environments. The effect of these…

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Abstract

Purpose

The purpose of this paper is to study epoxy and parylene C‐coated samples. These coatings are used to protect the electronic devices from harsh environments. The effect of these conformal coatings on electronics reliability is considered.

Design/methodology/approach

Epoxy coating is applied using dip coating and parylene C is applied with the vapour deposition polymerisation method. Test chip used is joined using flip‐chip technology and an anisotropically conductive adhesive. Reliability of the test samples is evaluated in a constant humidity test, where test conditions are 85°C and 85%RH. The test lasts 4,000 h. Failure analysis is carried out by cross‐sectioning failed samples and using scanning electron microscopy for closer analysis.

Findings

The results show variation in the reliability of adhesive joints with different conformal coating materials. Failure analysis highlights explicit failure mechanisms. Adhesion testing is also carried out on the test samples after constant humidity testing. The results of these reliability tests indicate clearly that parylene C is a more reliable choice of conformal coating than epoxy.

Originality/value

The paper shows the influence of certain conformal coatings on the reliability of adhesive flip‐chip joints. In medical applications, reliability plays an important role.

Details

Soldering & Surface Mount Technology, vol. 21 no. 4
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 18 September 2009

Martin Goosey

249

Abstract

Details

Soldering & Surface Mount Technology, vol. 21 no. 4
Type: Research Article
ISSN: 0954-0911

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