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Article
Publication date: 10 April 2009

94

Abstract

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Soldering & Surface Mount Technology, vol. 21 no. 2
Type: Research Article
ISSN: 0954-0911

Available. Content available
57

Abstract

Details

Circuit World, vol. 35 no. 2
Type: Research Article
ISSN: 0305-6120

Available. Content available
Article
Publication date: 25 July 2008

John Ling

308

Abstract

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Microelectronics International, vol. 25 no. 3
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 21 September 2010

50

Abstract

Details

Soldering & Surface Mount Technology, vol. 22 no. 4
Type: Research Article
ISSN: 0954-0911

Available. Content available
Article
Publication date: 23 November 2010

45

Abstract

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Circuit World, vol. 36 no. 4
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 August 2005

Andy Longford

To provide an insight and view of the expected directions for microelectronic packaging, at chip level, that ties in current developments to the needs envisaged by emerging…

2803

Abstract

Purpose

To provide an insight and view of the expected directions for microelectronic packaging, at chip level, that ties in current developments to the needs envisaged by emerging technology roadmaps.

Design/methodology/approach

The requirements for packaging semiconductor devices have become a new technology driver for the electronics “Final Manufacturing” industry. In line with forecasts and roadmaps, the expected multitude of options are being developed in order to meet the demand of an industry which requires ever more complex devices which exhibit both higher reliability and lower cost.

Findings

As application potentials develop, so package cost becomes the driver. In turn, low cost package solutions are becoming the drivers for new technologies such as “last‐mile” fibre optic Telecom systems, 3G phones, bluetooth and sensors. MEMS devices are a key example of how applications are pushing the technologies to create cost effective packaging.

Research limitations/implications

The emerging packaging technologies, currently BGA's and chip size packaging's (CSP), continue to develop to meet the needs of electronic devices, driven by the “smaller, faster, cheaper” paradigm. However the final manufacturing and testing aspects of such needs are often overlooked and as such the test industry faces a number of severe challenges in terms of handling these new package technologies.

Practical implications

By looking at the market trends and how these new technologies are developing, especially with respect to emerging developments in CSP, flip chip and wafer level packaging, solutions for many of the challenges posed can be determined.

Originality/value

This paper provides a market analysis of the trends and directions of the chip packaging industry. It has taken data from a wide number of sources of market information and compared the expectations of each to actual emerging applications. The resulting information is expected to become a benchmark for this aspect of the semiconductor manufacturing industry.

Details

Microelectronics International, vol. 22 no. 2
Type: Research Article
ISSN: 1356-5362

Keywords

Available. Content available
Article
Publication date: 13 February 2007

J.H. Ling

29

Abstract

Details

Soldering & Surface Mount Technology, vol. 19 no. 1
Type: Research Article
ISSN: 0954-0911

Available. Content available
Article
Publication date: 13 September 2013

Pete Starkey

218

Abstract

Details

Soldering & Surface Mount Technology, vol. 25 no. 4
Type: Research Article
ISSN: 0954-0911

Available. Content available
Article
Publication date: 1 August 2005

John Ling

68

Abstract

Details

Microelectronics International, vol. 22 no. 2
Type: Research Article
ISSN: 1356-5362

Keywords

Available. Content available
Article
Publication date: 1 August 2005

35

Abstract

Details

Microelectronics International, vol. 22 no. 2
Type: Research Article
ISSN: 1356-5362

Keywords

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