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The paper aims to get the knowledge about electrical properties, including noise, of modern polymer thick-film resistors (TFRs) in a wide range of temperature values, i.e. from 77 K up to room temperature. The sample resistors have been made of different combinations of resistive compositions, either ED7100 or MINICO (M2013, M2010), and conducting pastes (for contacts) Cu- or Au-based, deposited on FR-4 laminate.

The paper opted for an experimental study using either current noise index measurement in room temperature for large batch of samples or noise spectra measurement in temperature range 77-300 K for selected samples. Obtained noise maps, i.e. plots of power spectral density of voltage fluctuations vs frequency and temperature, have been used for evaluation of noise describing parameters like material noise intensity C and figure of merit K, for TFRs made of different combinations of resistive/conductive materials. Comparison of the parameters gives the information about the quality of the technology and matching the conductive/resistive materials.

Experiments confirmed that the main noise component is 1/f resistance noise. However, low-frequency noise spectroscopy revealed that also noise components of Lorentzian shape, associated with thermally activated noise sources exist. Their activation energies have been found to be of a few tenths of eV.

The noise intensity of polymer TFRs depends on technology process and/or contacts materials. The use of Au contacts leads to better noise properties of the resistors. The results of the studies might be helpful for further improvement of thick-film technology, especially for manufacturing low-noise, stable and reliable TFRs.

The paper includes indications for the materials selection for thick-film technology to manufacture low-noise, reliable and stable TFRs.

Experimental studies of electrical properties of polymer TFRs by means of noise spectra measurements in wide range of temperature is rare. They give fundamental knowledge about noise sources in the modern passive electronic components as well as practical indications of selection material for thick-film technology, to obtain high performance components and get technological advantage.

The purpose of this paper is to characterize electrical properties of nickel-phosphorus (Ni-P) thin-film resistors made on FR-4 laminate in a wide range of temperature (from −180 to 20°C).

The study was performed using resistors made of Ni-P foil with two different thicknesses (0.1 or 0.05 μm) and sheet resistances (100 or 250 Ω/sq), respectively. The resistance rectangular resistors had length and width from the range between 0.59 and 5.91 mm. The resistance versus temperature characteristics and their distribution as well as resistors ' durability to low-temperature thermal shocks were investigated.

The results showed almost linear temperature dependence of resistance with a negative temperature coefficient of resistance of about −95 ppm/°C for 250 Ω/sq layer and −55 ppm/°C for 100 Ω/sq layer. A very small dimensional effect was observed for sheet resistance as well as for R(T) characteristic. Thin-film resistors are also characterized by very high durability to low-temperature thermal shocks.

The results presented in this paper can be very useful for low-temperature applications of thin-film resistors made on printed circuit boards. They suggest possibility of wide applications of these components in a wide temperature range.

This paper aims to present systematic studies of a wide spectrum of geometrical and electrical properties of thick‐film and LTCC microresistors (with designed dimensions between 50 × 50 μm² and 800 × 200 μm²).

The geometrical parameters (average length, width and thickness, relations between designed and real dimensions, distribution of planar dimensions) are correlated with basic electrical properties of resistors (sheet resistance and its distribution, hot temperature coefficient of resistance and its distribution distribution) as well as long term thermal stability and durability of microresistors to short electrical pulses.

Fodel process gives better resolution than standard screen‐printing and leads to smaller dimensions than designed, smaller absolute error and better uniformity of planar sizes. Microresistors made in full Fodel process show much weaker dimensional effect and exhibit noticeably smaller distribution of basic electrical properties.

Presents systematic studies of a wide spectrum of geometrical and electrical properties of thick‐film and LTCC microresistors.