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As an advanced manufacturing method, additive manufacturing (AM) technology provides new possibilities for efficient production and design of parts. However, with the continuous expansion of the application of AM materials, subtractive processing has become one of the necessary steps to improve the accuracy and performance of parts. In this paper, the processing process of AM materials is discussed in depth, and the surface integrity problem caused by it is discussed.

Firstly, we listed and analyzed the characterization parameters of metal surface integrity and its influence on the performance of parts and then introduced the application of integrated processing of metal adding and subtracting materials and the influence of different processing forms on the surface integrity of parts. The surface of the trial-cut material is detected and analyzed, and the surface of the integrated processing of adding and subtracting materials is compared with that of the pure processing of reducing materials, so that the corresponding conclusions are obtained.

In this process, we also found some surface integrity problems, such as knife marks, residual stress and thermal effects. These problems may have a potential negative impact on the performance of the final parts. In processing, we can try to use other integrated processing technologies of adding and subtracting materials, try to combine various integrated processing technologies of adding and subtracting materials, or consider exploring more efficient AM technology to improve processing efficiency. We can also consider adopting production process optimization measures to reduce the processing cost of adding and subtracting materials.

With the gradual improvement of the requirements for the surface quality of parts in the production process and the in-depth implementation of sustainable manufacturing, the demand for integrated processing of metal addition and subtraction materials is likely to continue to grow in the future. By deeply understanding and studying the problems of material reduction and surface integrity of AM materials, we can better meet the challenges in the manufacturing process and improve the quality and performance of parts. This research is very important for promoting the development of manufacturing technology and achieving success in practical application.

Before the turn of the century, taking overseas students was more about a diplomatic issue dominated by the state in China, for which reason this section is relatively independent within the higher education system. However, evidence from a series of new policy documents and their impacts suggests that international student mobility (ISM) has been intensively shaped by the central government in the desire to promote its national strategy, namely the belt and road initiative. ISM policy, although with a significant proportion marketized, was introduced for a clear purpose of cultural diplomacy. The paper aims to discuss these issues.

Looking beyond the debate of market-driven vs state-dominated, this paper attempts to provide a thorough understanding of this changing pattern based on examination of key changes of policy statements along with official data analysis.

This paper argues that the new pattern must be understood against a context of a hierarchy of higher education institutes in contemporary China: a sector led by a small number of prestigious universities generously funded by the central government with a large number of ordinary universities underfunded and eager to generate income. Prestigious institutes enroll international students to satisfy performance indicators listed by policies like “Double First-rate”; other universities, benefiting from the reputation and momentum generated by the top ones, take self-funded students for profit.

By making good use of both performance indicators and market motives, the country managed to move a state-dominated ISM policy in the twentieth century into the existing state-steering marketization model and made China a major destination for overseas study.