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Endwall film cooling protects vane endwall by coolant coverage, especially at the leading edge (LE) region and vane-pressure side (PS) junction region. Strong flow impingement and complex vortexaa structures on the vane endwall cause difficulties for coolant flows to cover properly. This work aims at a full-scale arrangement of film cooling holes on the endwall which improves coolant efficiency in the LE region and vane-PS junction region.

The endwall film holes are grouped in four-holes constructal patterns. Three ways of arranging the groups are studied: based on the pressure field, the streamlines or the heat transfer field. The computational analysis is done with the k-ω SST model after validating the turbulence model properly.

By clustering the film cooling holes in four-holes patterns, the ejection of the coolant flow is stronger. The four-holes constructal patterns also improve the local coolant coverage in the “tough” regions, such as the junction region of the PS and the endwall. The arrangement based on streamlines distribution can effectively improve the coolant coverage and the arrangement based on the heat transfer distribution (HTD) has benefits by reducing high-temperature regions on the endwall.

A full-scale endwall film cooling design is presented considering interactions of different film cooling holes. A comprehensive model validation and mesh independence study are provided. The cooling holes pattern on the endwall is designed as four-holes constructal patterns combined with several arrangement choices, i.e. by pressure, by heat transfer and by streamline distributions.