Xiaolin Sun, Jiawen Zhu, Huigang Liang, Yajiong Xue and Bo Yao
As after-hours technology-mediated work (ATW) becomes common in organizations, the increased workload and interference to life caused by ATW has induced employee turnover. This…
Abstract
Purpose
As after-hours technology-mediated work (ATW) becomes common in organizations, the increased workload and interference to life caused by ATW has induced employee turnover. This research develops a mediated moderation model to explain how employees' intrinsic and extrinsic motivations for ATW affect their turnover intention through work–life conflict.
Design/methodology/approach
A survey was conducted to collect data of 484 employees from Chinese companies. Partial Least Square was used to perform data analysis.
Findings
The results show that intrinsic motivation for ATW has an indirect negative impact on turnover intention via work–life conflict, whereas extrinsic motivation for ATW has both a positive direct impact and a positive indirect impact (via work–life conflict) on turnover intention. This study also helps find that time spent on ATW can strengthen the positive impact of extrinsic motivation for ATW on turnover intention but has no moderation effect on the impact of intrinsic motivation for ATW. Furthermore, this study reveals that the interaction effect of time spent on ATW and extrinsic motivation on turnover intention is mediated by employees' perceived work–life conflict.
Originality/value
By discovering the distinct impact of employees' intrinsic and extrinsic motivations for ATW on turnover intention, this research provides a contingent view regarding the impact of ATW and offers guidance to managers regarding how to mitigate ATW-induced turnover intention through fostering different motivations.
Details
Keywords
Jian Liu, Mengyao Xu, Wenxiong Xi, Jiawen Song, Shibin Luo and Bengt Ake Sunden
Endwall film cooling protects vane endwall by coolant coverage, especially at the leading edge (LE) region and vane-pressure side (PS) junction region. Strong flow impingement and…
Abstract
Purpose
Endwall film cooling protects vane endwall by coolant coverage, especially at the leading edge (LE) region and vane-pressure side (PS) junction region. Strong flow impingement and complex vortexaa structures on the vane endwall cause difficulties for coolant flows to cover properly. This work aims at a full-scale arrangement of film cooling holes on the endwall which improves coolant efficiency in the LE region and vane-PS junction region.
Design/methodology/approach
The endwall film holes are grouped in four-holes constructal patterns. Three ways of arranging the groups are studied: based on the pressure field, the streamlines or the heat transfer field. The computational analysis is done with the k-ω SST model after validating the turbulence model properly.
Findings
By clustering the film cooling holes in four-holes patterns, the ejection of the coolant flow is stronger. The four-holes constructal patterns also improve the local coolant coverage in the “tough” regions, such as the junction region of the PS and the endwall. The arrangement based on streamlines distribution can effectively improve the coolant coverage and the arrangement based on the heat transfer distribution (HTD) has benefits by reducing high-temperature regions on the endwall.
Originality/value
A full-scale endwall film cooling design is presented considering interactions of different film cooling holes. A comprehensive model validation and mesh independence study are provided. The cooling holes pattern on the endwall is designed as four-holes constructal patterns combined with several arrangement choices, i.e. by pressure, by heat transfer and by streamline distributions.