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This study aims to address the problem of low-temperature wave soldering in industry production with Sn-9Zn-2.5 Bi-1.5In alloys and develop qualified process parameters. Sn–Zn eutectic alloys are lead-free solders applied in consumer electronics due to their low melting point, high strength, and low cost. In the electronic assembly industry, Sn–Zn eutectic alloys have great potential for use.

This paper explored developing and implementing process parameters for low-temperature wave soldering of Sn–Zn alloys (SN-9ZN-2.5BI-1.5 In). A two-factor, three-level design of the experiments experiment was designed to simulate various conditions parameters encountered in Sn–Zn soldering, developed the nitrogen protection device of waving soldering and proposed the optimal process parameters to realize mass production of low-temperature wave soldering on Sn–Zn alloys.

The Sn-9Zn-2.5 Bi-1.5In alloy can overcome the Zn oxidation problem, achieve low-temperature wave soldering and meet IPC standards, but requires the development of nitrogen protection devices and the optimization of a series of process parameters. The design experiment reveals that preheating temperature, soldering temperature and flux affect failure phenomena. Finally, combined with the process test results, an effective method to support mass production.

In term of overcome Zn’s oxidation characteristics, anti-oxidation wave welding device needs to be studied. Various process parameters need to be developed to achieve a welding process with lower temperature than that of lead solder(Sn–Pb) and lead-free SAC(Sn-0.3Ag-0.7Cu). The process window of Sn–Zn series alloy (Sn-9Zn-2.5 Bi-1.5In alloy) is narrow. A more stringent quality control chart is required to make mass production.

In this research, the soldering temperature of Sn-9Zn-2.5 Bi-1.5In is 5 °C and 25 °C lower than Sn–Pb and Sn-0.3Ag-0.7Cu(SAC0307). To the best of the authors’ knowledge, this work was the first time to apply Sn–Zn solder alloy under actual production conditions on wave soldering, which was of great significance for the study of wave soldering of the same kind of solder alloy.

Low-temperature wave soldering can supported green manufacturing widely, offering a new path to achieve carbon emissions for many factories and also combat to international climate change.

There are many research papers on Sn–Zn alloys, but methods of achieving low-temperature wave soldering to meet IPC standards are infrequent. Especially the process control method that can be mass-produced is more challenging. In addition, the metal storage is very high and the cost is relatively low, which is of great help to provide enterprise competitiveness and can also support the development of green manufacturing, which has a good role in promoting the broader development of the Sn–Zn series.

To develop an automated system for identifying and repairing cracks in asphalt pavements, addressing the urgent need for efficient pavement maintenance solutions amidst increasing workloads and decreasing budgets.

The research was conducted in two main stages: Crack identification: Utilizing the U-Net deep learning model for pixel-level segmentation to identify pavement cracks, followed by morphological operations such as thinning and spur removal to refine the crack trajectories. Automated crack repair path planning: Developing an enhanced hybrid ant colony greedy algorithm (EAC-GA), which integrates the ant colony (AC) algorithm, greedy algorithm (GA) and three local enhancement strategies – PointsExchange, Cracks2OPT and Nearby Cracks 2OPT – to plan the most efficient repair paths with minimal redundant distance.

The EAC-GA demonstrated significant advantages in solution quality compared to the GA, the traditional AC and the AC-GA. Experimental validation on repair areas with varying numbers of cracks (16, 26 and 36) confirmed the effectiveness and scalability of the proposed method.

The originality of this research lies in the application of advanced deep learning and optimization algorithms to the specific problem of pavement crack repair. The value is twofold: Technological innovation in the field of pavement maintenance, offering a more efficient and automated approach to a common and costly issue. The potential for significant economic and operational benefits, particularly in the context of reduced maintenance budgets and increasing maintenance demands.

This study aims to uncover the mechanisms behind the marginalization of county-level public libraries.

The research surveyed 25 counties in central China, including Hubei, Chongqing, Hunan, and Guizhou provinces. Semi-structured interviews were conducted with library directors and deputy directors, focusing on main and branch library construction, cultural inclusivity, library assessment, and digital services.

Contributing factors to library marginalization were identified as economic pressure, institutional domain, longstanding issues, organizational entity, and societal misconceptions. Building on this, the study introduces the HBAC model to explain county-level public library marginalization. Considering the actual social context of these libraries, the article proposes a “3 + 1” approach to mitigate their marginalization.

The research methodology, analysis process, theoretical model, and recommendations provided could shed light on academic research and practical exploration in the field of public libraries globally.