Search results

1 – 3 of 3
Per page
102050
Citations:
Loading...
Access Restricted. View access options
Article
Publication date: 18 September 2024

Xulong Wang, Xuejiao Bai and Liming Zhao

This study explores the link between additional reviews, credibility, and consumers’ online purchasing behavior.

154

Abstract

Purpose

This study explores the link between additional reviews, credibility, and consumers’ online purchasing behavior.

Design/methodology/approach

We employ a 2 × 2 between-subjects design to measure subjects’ purchasing behavior with versus without additional reviews and with important versus non-important attributes. A total of 529 valid questionnaires are collected from university students across 30 Chinese provinces.

Findings

The addition of negative reviews to a positive initial review enhances consumers’ perceived credibility of the reviewer and the overall review content. This effect is positively moderated by the attribute importance in additional reviews. Moreover, we find that as the time interval increases, consumers’ perceived credibility gradually increases but eventually decreases after reaching a certain threshold. In addition, the attribute importance in additional reviews negatively moderates the impact of perceived credibility on consumer purchasing behavior.

Originality/value

Existing studies on first and subsequent reviews mainly focus on the difference in perceived usefulness between the two. They do not examine how additional reviews affect potential customers’ perceived credibility and their purchase decision-making. This study bridges the gap between the word-of-mouth literature and marketing practices.

Details

Asia Pacific Journal of Marketing and Logistics, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 1355-5855

Keywords

Access Restricted. View access options
Article
Publication date: 5 December 2024

Qiliang Wang, Xulong Shao, Dagang Wang, Shijun Wei, Jinyuan Kang and Jun Wang

The purpose of this study is to investigate the influence of geometric parameters of removable panels on the sealing characteristics of ceramic wafer seal structure subjected to…

18

Abstract

Purpose

The purpose of this study is to investigate the influence of geometric parameters of removable panels on the sealing characteristics of ceramic wafer seal structure subjected to high-temperature gas flow.

Design/methodology/approach

Based on the laminar flow Reynolds equation, the theoretical and numerical calculation models were constructed to investigate the influence of external convex deformation of removable panel on leakage rate. The theoretical formula for leakage rate after deformation of the removable panel was derived, and the flow field and leakage characteristics of ceramic wafer seal under different operating parameters were studied.

Findings

The leakage rate exhibits consistent trends between theoretical calculation, numerical simulation and experimental value, with a maximum discrepancy of 8.9%. This validates the accuracy of both the theoretical model and numerical simulation. As the deformation angle of the removable panel increases, the sealing gap gradually widens, resulting in a compromised sealing effect. Moreover, the leakage rate in the central region of the sealing area is lower compared to that at both ends.

Originality/value

The leakage of the ceramic wafer seal structure under the removable panel with different deformation angles can be monitored based on Reynolds equation. The pseudo-transient numerical calculation method can be used to determine the leakage value of the micro-state ceramic wafer seal structure. These research findings provide a theoretical foundation and numerical investigation approach for studying ceramic wafer seal structures.

Details

Industrial Lubrication and Tribology, vol. 77 no. 2
Type: Research Article
ISSN: 0036-8792

Keywords

Access Restricted. View access options
Article
Publication date: 26 November 2024

Xu Long, Xianyi Zhao, Kainan Chong, Yutai Su, Kim S. Siow, Zhi Wang, Fengrui Jia and Xin Wan

The purpose of this paper is to analyze and compare the mechanical properties of sintered nanosilver with different porosities at both the mesoscopic and macroscopic scales and to…

38

Abstract

Purpose

The purpose of this paper is to analyze and compare the mechanical properties of sintered nanosilver with different porosities at both the mesoscopic and macroscopic scales and to conduct a multiscale analysis of the porosity effect on the mechanical properties of sintered nanosilver.

Design/methodology/approach

This paper establishes a mesoscopic model for the uniaxial tension of sintered nanosilver and a macroscopic model for chips containing sintered silver layers. Using the finite element method, combined with crystal plasticity theory and unified creep plasticity theory, a multiscale analysis is conducted for the mechanical properties of sintered nanosilver. First, stress distribution characteristics under uniaxial tensile loading for different porosities in sintered nanosilver polycrystal models are analyzed at the mesoscopic scale. Second, at the macroscopic scale, the mechanical performance of sintered nanosilver layers with varying porosities in high-power chip models under cyclic loading is analyzed. Finally, the porosity influence on the damage evolution in sintered nanosilver is summarized, and simulations are conducted to explore the evolution of damage parameters in sintered nanosilver under different porosities.

Findings

In the mesoscopic model, the presence of mesoscale voids affects the stress distribution in sintered nanosilver subjected to tensile loading. Sintered nanosilver with lower porosity exhibits higher tensile strength. In the macroscopic model, sintered nanosilver layers with lower porosity correspond to a more uniform stress distribution, whereas higher porosity leads to faster accumulation of plastic strain in the sintered layer. During chip packaging processes, improving processes to reduce the porosity of sintered layers can delay the initiation of damage and the propagation of cracks in sintered nanosilver.

Practical implications

During chip packaging processes, improving processes to reduce the porosity of sintered layers can delay the initiation of damage and the propagation of cracks in sintered nanosilver.

Originality/value

This paper innovatively uses a mesoscopic crystal plasticity constitutive model and a macroscopic unified creep plasticity constitutive model to analyze the mechanical behavior of sintered nanosilver with different porosities. It comprehensively investigates and explains the influence of porosity on the mechanical performance of sintered nanosilver across multiple scales.

Details

Soldering & Surface Mount Technology, vol. 37 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

1 – 3 of 3
Per page
102050