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The purpose of this paper is to develop a wireless strain sensor for measuring large strains. The sensor is based on passive ultra high‐frequency radio frequency identification (RFID) technology and it can be embedded into a variety of structures.

Silver ink conductors and RFID tags were printed by the screen printing method on stretchable polyvinyl chloride and fabric substrates. The development of the strain‐sensitive RFID tag was based on the behavior of the selected antenna and substrate materials. Performance of the tags and the effect of mechanical strain on tag functioning were examined.

The results showed that large displacements can be successfully measured wirelessly using a stretchable RFID tag as a strain‐sensitive structure. The behavior of the tag can be modified by selection of the material.

New tag designs, which are more sensitive to small levels of strain and which have a linear response will be the subject for future work. Tag performance under cyclic loading and in a real environment will also be investigated. Future work relating the investigation of practical applications and the system designing for the strain sensor will also be required.

Printing is fast and simple manufacturing process which does not produce much waste or material loss. The sensor is a new application of printed electronics. It also provides new opportunities for system designers.

The paper provides a new kind of wireless strain sensor which can be integrated into many structures (i.e. clothes). The sensor is a new application of printed electronics and it is made from novel materials.

The resistivity of cured conductive ink films are dependent on a wide range of process parameters. An early indication of the resistivity that is likely to result following curing can enable these parameters to be optimised and, therefore, improve product quality. This paper aims to report on the use of alternating current (AC) impedance measurement techniques on curing printed ink films as a means of assessing the resistivity likely to be attained following the curing process.

Impedance measurements (100 Hz-10 MHz) were performed on curing conductive carbon ink films printed on polyethylene terephthalate substrates during convective heat curing. A jig was designed to incorporate the test structure in an convection oven such that the effect of cure on the structure impedance could be investigated.

The initial impedance was found to decrease with an increase in the measurement frequency. As the ink films were cured, the impedance magnitude across the 100 Hz-10 MHz range converged with the direct current (DC) resistance value. For a given ink, the ratio of initial AC impedance at 10 MHz to final cured resistance was found to be consistent, thus giving a method where final conductivity can be estimated before cure.

Data from printed ink resistance measurements are required to ensure the optimal conductivity of printed devices. However, after the printed structures are fabricated and cured, it is too late to optimise process parameters, leading to significant wastage. AC impedance measurement can give an indication of the final cured resistivity whilst the structure is freshly printed and still in its curing phase, enabling the printing process parameters to be adjusted to improve the resistivity of subsequently printed devices. Measuring AC impedance of printed ink structures in a production environment can, therefore, improve output.